Untitled
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 50 PIN PLASTIC FPT-50P-M06 50-pin plastic TSOP II Lead pitch 0.80mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-50P-M06) * : Resin protrusion. (Each side : 0.15 (.006) Max) 50-pin plastic TSOP (II)
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FPT-50P-M06
400mil
50-pin
FPT-50P-M06)
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400MIL
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 50 PIN PLASTIC FPT-50P-M05 50-pin plastic TSOP II Lead pitch 0.80mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-50P-M05) * : Resin protrusion. (Each side : 0.15 (.006) Max) 50-pin plastic TSOP (II)
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FPT-50P-M05
400mil
50-pin
FPT-50P-M05)
F50005S-2C-1
400MIL
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50-PIN
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 50 PIN PLASTIC FPT-50P-M06 50-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-50P-M06) 50-pin plastic TSOP (II) (FPT-50P-M06)
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FPT-50P-M06
50-pin
FPT-50P-M06)
F50006S-2C-1
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Untitled
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 50 PIN PLASTIC FPT-50P-M05 50-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-50P-M05) 50-pin plastic TSOP (II) (FPT-50P-M05)
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FPT-50P-M05
50-pin
FPT-50P-M05)
F50005S-2C-1
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SIGNETICS
Abstract: JEDEC tray standard 13 Signetics OR Mullard package tray outline 12X20 signetics data
Text: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 2 Signetics Thin Small Outline Package Type2 Cross Section View of TSOP Type 2 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type 2 package is available in 50 lead counts with 0.80mm lead pitches
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12x20
SIGNETICS
JEDEC tray standard 13
Signetics OR Mullard
package tray outline
signetics data
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TSOP package tray
Abstract: JEDEC TRAY DIMENSIONS 10936 TSOP TRAY
Text: HEAT PROOF 7 A' 12 13.67 135°C MAX. PPE 135.9 13.27 A NEC TSOP 2 400MIL21 9x13=117 109.36 UNIT : mm 21.1 22.96 19.74 275.52 315.0 (322.6) SECTION A – A' 21.1 5.62 (6.35) 7.62 18.0 Applied Package Quantity (pcs) 32-pin Plastic TSOP(II)(400mil) 50-pin Plastic TSOP(II)(400mil)
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400MIL21
32-pin
400mil)
50-pin
400MIL21
TSOP package tray
JEDEC TRAY DIMENSIONS
10936
TSOP TRAY
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eb240
Abstract: No abstract text available
Text: 50P3G-F Plastic 50pin 400mil TSOP (LOC) EIAJ Package Code TSOP II 50/44-P-400-0.80 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 40 36 26 Recommended Mount Pad E Symbol 1 15 11 25 A D e L c L1 HE ME 50 I2 F y b A2 Detail F A A1 A2 b c D E e HE L
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50P3G-F
50pin
400mil
50/44-P-400-0
eb240
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44-P-400-0
Abstract: 44P4000
Text: 50P3W-L Plastic 50pin 400mil TSOP EIAJ Package Code TSOP II 50/44-P-400-0.80 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 50 36 26 E Recommended Mount Pad Symbol 1 11 15 25 A D e L c L1 HE ME 40 l2 F y b A2 Detail F A1 A A1 A2 b c D E e HE L L1
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50P3W-L
50pin
400mil
50/44-P-400-0
44-P-400-0
44P4000
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Untitled
Abstract: No abstract text available
Text: 50P3W-M Plastic 50pin 400mil TSOP EIAJ Package Code TSOP II 50/44-P-400-0.80 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 F 25 E Recommended Mount Pad Symbol 50 40 36 26 A c L D L1 HE ME 15 l2 11 1 e y b A2 Detail F A A1 A2 b c D E e HE L L1 y
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50P3W-M
50pin
400mil
50/44-P-400-0
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TSOP package tray
Abstract: 50-pin TRAY TSOP JEDEC TRAY DIMENSIONS DSAE00696 913117
Text: 7 PPE NEC 135°C MAX. A A' 20.65 22.96 19.74 11.8 109.36 13.67 13.27 TSOP 2 400MIL21 135.9 9x13=117 HEAT PROOF UNIT : mm 275.52 315.0 (322.6) SECTION A – A' 20.65 5.62 7.62 (6.35) 17 Applied Package Quantity (pcs) 50-pin Plastic TSOP(II)(400mil) MAX. 117
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400MIL21
50-pin
400mil)
TSOP package tray
TRAY TSOP
JEDEC TRAY DIMENSIONS
DSAE00696
913117
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ion lithium battery ev
Abstract: MM1532 MM1639 MM1332 MM1333 MM1433 MM1438 MM1475 MM1485
Text: MITSUMI IC For Charging Lithium - ion Batteries Temperature conditions A: Ta=-25~75°C, B: Ta=-20~70°C, C: Ta=0~50°C, D: Ta=0~40°C Package SOP-8C, 8E VSOP-8A, 8B TSOP-16A MM1332 MM1333 VSOP-16A TSOP-24A AF 4.100±0.050 B 1cell BF 8.200±0.100 B 2cell CF
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TSOP-16A
VSOP-16A
TSOP-24A
MM1332
MM1333
MM1433
MM1438
MM1485
MM1532
MM1475
ion lithium battery ev
MM1532
MM1639
MM1332
MM1333
MM1433
MM1438
MM1475
MM1485
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BA5 marking
Abstract: DQ112-127 BA7 marking HMD4M144D9WG DQ113 BA6 marking BA6137 DQ99
Text: HANBit HMD4M144D9WG 64Mbyte 4Mx144 200-pin ECC Mode 4K Ref. DIMM Design 5V Part No. HMD4M144D9WG GENERAL DESCRIPTION The HMD4M144D9WG is a 4Mbit x 144bit dynamic RAM high-density memory module. The module consists of eight CMOS 4Mx16bit DRAMs in 50-pin TSOP packages and one CMOS 4M x 16bit DRAM in 50pin TSOP package
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HMD4M144D9WG
64Mbyte
4Mx144)
200-pin
HMD4M144D9WG
144bit
4Mx16bit
50-pin
16bit
BA5 marking
DQ112-127
BA7 marking
DQ113
BA6 marking
BA6137
DQ99
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Untitled
Abstract: No abstract text available
Text: 184PIN DDR400 Unbuffered DIMM 512MB With 32Mx8 CL2.5 JM366D643A-50 Description Placement The JM366D643A-50 is a 64Mx64bits Double Data Rate SDRAM high-density for DDR400. The JM366D643A-50 consists of 16pcs CMOS 32Mx8 bits Double Data Rate SDRAMs in 66 pin TSOP-II 400mil packages and a 2048
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184PIN
DDR400
512MB
32Mx8
JM366D643A-50
JM366D643A-50
64Mx64bits
DDR400.
16pcs
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Untitled
Abstract: No abstract text available
Text: 184PIN DDR400 Unbuffered DIMM 256MB With 32Mx8 CL2.5 JM334D643A-50 Placement Description The JM334D643A-50 is a 32M x 64bits Double Data Rate SDRAM high-density for DDR400.The JM334D643A-50 consists of 8pcs CMOS 32Mx8 bits Double Data Rate SDRAMs in 66 pin TSOP-II 400mil packages and a 2048
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184PIN
DDR400
256MB
32Mx8
JM334D643A-50
JM334D643A-50
64bits
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Untitled
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 50 PIN PLASTIC FPT-50P-M01 Lead pitch 0.80mm Package width 400mil Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold 50-pin plastic TSOP II (FPT-50P-M01) * : Resin protrusion. (Each side : 0.15 (.006) Max)
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FPT-50P-M01
400mil
50-pin
FPT-50P-M01)
F50001S-1C-1
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Untitled
Abstract: No abstract text available
Text: 32Mx4, 50 - 60ns, TSOP Stack 30A221-10 A M-Densus 128 Megabit CMOS 3.3V EDO DRAM DP3ED32MX4RKY5 High Density Memory Device DESCRIPTION: The M-Densus series is a family of interchangeable memory modules. The 64 Megabit DRAM is a member of this family which utilizes the new and innovative space saving TSOP
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32Mx4,
30A221-10
DP3ED32MX4RKY5
DP3ED32MX4RKY5
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30A221-00
Abstract: No abstract text available
Text: 32Mx4, 50 - 60ns, TSOP Stack 30A221-00 A M-Densus 128 Megabit CMOS 3.3V EDO DRAM DP3ED32MX4RY5 High Density Memory Device DESCRIPTION: The M-Densus series is a family of interchangeable memory modules. The 64 Megabit DRAM is a member of this family which utilizes the new and innovative space saving TSOP
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32Mx4,
30A221-00
DP3ED32MX4RY5
DP3ED32MX4RY5
30A221-00
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Untitled
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 50 PIN PLASTIC FPT-50P-M02 50-pin plastic TSOP II Lead pitch 0.80mm Package width 400mil Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold (FPT-50P-M02) * : Resin protrusion. (Each side : 0.15 (.006) Max)
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FPT-50P-M02
400mil
50-pin
FPT-50P-M02)
F50002S-1C-1
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50-PIN
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 50 PIN PLASTIC To Top / Package Lineup / Package Index FPT-50P-M02 50-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Lead bend direction Reverse bend Sealing method
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FPT-50P-M02
50-pin
FPT-50P-M02)
F50002S-1C-1
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50-PIN
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 50 PIN PLASTIC To Top / Package Lineup / Package Index FPT-50P-M01 50-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Lead bend direction Normal bend Sealing method
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FPT-50P-M01
50-pin
FPT-50P-M01)
F50001S-1C-1
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Untitled
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 50 PIN PLASTIC To Top / Package Lineup / Package Index FPT-50P-M06 50-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-50P-M06)
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FPT-50P-M06
50-pin
FPT-50P-M06)
F50006S-2C-1
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY MICRON I TECHNOLOGY, 1 6 M l n b XAM INC. FEATURES 50-Pin TSOP V cc DQ0 DQ1 V ssQ DQ2 DQ3 V ccQ DQ4 DQ5 V ssQ DQ6 DQ7 V ccQ DQ M L W E# C AS# RAS# C S# BA A10 A0 A1 A2 A3 V cc MARKING 1M16 • Plastic Package - OCPL 50-pin TSOP 400 mil TG • Timing
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OCR Scan
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PDF
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50-Pin
MT48LC1M16A1TG-8A
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Untitled
Abstract: No abstract text available
Text: DRAM PART NUMBERING HY 51 X XX XXX X XX XX - XX HYUNDAI SPEED Memory Products 45 45ns 50 50ns 60 60ns 70 70ns PRODUCT GROUP 51 : DRAM PACKAGE PROCESS & POWER SUPPLY BLANK : CMOS, 5.0V J 300mit SOJ V : CMOS, 3.3V JC 400mit SOJ T 300mil TSOP-II TC 400mil TSOP-il
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OCR Scan
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PDF
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300mit
400mit
300mil
400mil
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY MICRON 4 MEG x 16 EDO DRAM I MT4LC4M16R6 DRAM FEATURES PIN ASSIGNMENT Top View OPTIONS 50-Pin TSOP (DB-7) Vcc DQ1 DQ2 DQ3 DQ4 Vcc DQ5 DQ6 DQ7 DQ8 NC Vcc WE# RAS# NC NC NC NC A0 A1 A2 A3 A4 A5 Vcc MARKING • Package Plastic TSOP (400 mil) TG
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MT4LC4M16R6
50-Pin
MT4LC4M16R6TG-5
104ns
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