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    Vishay Intertechnologies RWR80S1R00FRB12

    Wirewound Resistors - Through Hole 1 OHM 1% EGS-3-80
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI RWR80S1R00FRB12 Box 216 1
    • 1 $6.57
    • 10 $6.26
    • 100 $5.9
    • 1000 $4.7
    • 10000 $4.7
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    Vishay Intertechnologies 376D126X9075S2BBZ

    Tantalum Capacitors - Solid Leaded 12UF 75V 10% D B-FR
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 376D126X9075S2BBZ Tray 3 1
    • 1 $59.32
    • 10 $56.46
    • 100 $55.35
    • 1000 $55.35
    • 10000 $55.35
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    Vishay Intertechnologies 176D826X9020S2BMZ

    Tantalum Capacitors - Solid Leaded 82UF 20V 10% D M-FR
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 176D826X9020S2BMZ Tray 20
    • 1 -
    • 10 -
    • 100 $15.49
    • 1000 $15.49
    • 10000 $15.49
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    Vishay Intertechnologies 135D547X9015T42P

    Tantalum Capacitors - Wet 540UF 15V 10% T4P
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 135D547X9015T42P Tray 20
    • 1 -
    • 10 -
    • 100 $68.51
    • 1000 $65.85
    • 10000 $65.85
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    KEMET Corporation C114T470K1X5CR

    Multilayer Ceramic Capacitors MLCC - Leaded CKR11BX470KR
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI C114T470K1X5CR Bulk 100
    • 1 -
    • 10 -
    • 100 $2.29
    • 1000 $1.84
    • 10000 $1.71
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    300MIL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    zif socket

    Abstract: SOIC16 socket zif soic16 socket SOIC-16
    Text: DIL16W/SOIC16 ZIF 300mil ord.no. 70-0881 universal adapter, assigned for SOIC devices up to 16-pins operation (mechanical) life of ZIF socket - 10.000 actuations made in Slovakia Ord. no 70-0881 Socket ZIF SOIC16, open top type Bottom 2 rows, 2x 8 pins, square, 0.6x0.6mm, rows spacing


    Original     		PDF DIL16W/SOIC16 300mil 16-pins SOIC16, 600mil 22nF-100nF SOIC16 zif socket SOIC16 socket zif soic16 socket SOIC-16

    DIP20

    Abstract: No abstract text available
    Text: SANYO Semiconductor Dual In-line Package 20Pin Plastic DIP20 300mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the


    Original     		PDF 20Pin DIP20 300mil) ED-7303A) 51min DIP20

    Untitled

    Abstract: No abstract text available
    Text: SANYO Semiconductor Shrink Dual In-line Package 10Pin Plastic DIP10S 300mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the


    Original     		PDF 10Pin DIP10S 300mil) ED-7303A) DIP10S

    DIP14

    Abstract: 300mil
    Text: SANYO Semiconductor Dual In-line Package 14Pin Plastic DIP14T 300mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the


    Original     		PDF 14Pin DIP14T 300mil) ED-7303A) 26max 51min DIP14T DIP14 300mil

    Untitled

    Abstract: No abstract text available
    Text: SANYO Semiconductor Small Outline Package 18Pin Plastic MFP18 300mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the


    Original     		PDF 18Pin MFP18 300mil) ED-7303A) SANYOMFP18

    Untitled

    Abstract: No abstract text available
    Text: SANYO Semiconductor Dual In-line Package 14Pin Plastic DIP14TD 300mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the


    Original     		PDF 14Pin DIP14TD 300mil) ED-7303A) 54kage 26max 51min DIP14TD

    Untitled

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE 26 PIN PLASTIC FPT-26P-M02 Lead pitch 50mil Package width 300mil Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold 26-pin plastic TSOP II (FPT-26P-M02) * : Resin protrusion. (Each side : 0.15 (.006) Max)


    Original     		PDF FPT-26P-M02 50mil 300mil 26-pin FPT-26P-M02) F26002S-3C-3

    FPT-24P-M01

    Abstract: No abstract text available
    Text: SMALL OUTLINE L-LEADED PACKAGE 24 PIN PLASTIC FPT-24P-M01 EIAJ code : ∗SOP024-P-0300-1 Lead pitch 50mil Nominal dimensions 300mil Standard Conforms with EIAJ:TYPE II Lead shape Gullwing Sealing method Plastic mold 24-pin plastic SOP FPT-24P-M01 24-pin plastic SOP


    Original     		PDF FPT-24P-M01 OP024-P-0300-1 50mil 300mil 24-pin FPT-24P-M01) FPT-24P-M01

    Untitled

    Abstract: No abstract text available
    Text: UG9M43722 4 KBG(T) 16M Bytes (4M x 36) DRAM 72Pin SIMM w/ECC based on 4M X 4 General Description Features The UG9M43722(4)KBG(T) is a 4,149,304 bits by 36 SIMM module.The UG9M43722(4)KBG(T) is assembled using 9 pcs of 4Mx4 2K/4K refresh DRAMs 300mil SOJ Package mounted on 72 Pin


    Original     		PDF UG9M43722 72Pin 300mil 1000mil)

    Untitled

    Abstract: No abstract text available
    Text: UG54W742 4 4GJ(T)G 32M Bytes (4M x 72) DRAM 168Pin DIMM With ECC based on 4M x 4 General Description Features The UG54W742(4)4GJ(T)G is a 4,194,304 bits by 72 EDO DRAM module. The UG54W742(4)4GJ(T)G is assembled using 18 pcs of 4Mx4 DRAMs in a 300mil SOJ/TSOP package,and one 2k EEPROM for SPD in


    Original     		PDF UG54W742 168Pin 300mil 168-pin 100Max 54Max 540Min) 100Min

    Untitled

    Abstract: No abstract text available
    Text: UG54W662 4 4GJ(T)G 32M Bytes (4M x 64) DRAM 168Pin DIMM based on 4M x 4 General Description Features The UG54W662(4)4GJ(T)G is a 4,194,304 bits by 64 EDO DRAM module. The UG54W662(4)4GJ(T)G is assembled using 16 pcs of 4Mx4 DRAMs in a 300mil SOJ/TSOP package,and one 2k EEPROM for SPD in


    Original     		PDF UG54W662 168Pin 300mil 168-pin 350Max 89Max 540Min) 100Min

    we 510

    Abstract: UG9M
    Text: UG9M13621DBG T 4M Bytes (1M x 36 ) DRAM w/Parity 72Pin SIMM based on 1M X 4 General Description Features The UG9M13621DBG(T) is a 1,048,576 bits by 36 SIMM module.The UG9M13621DBG(T) is assembled using 8 pcs of 1Mx4 1K refresh in 300mil package, and 1 pc of 1Mx4 Quad-CAS


    Original     		PDF UG9M13621DBG 72Pin 300mil 1000mil) we 510 UG9M

    Untitled

    Abstract: No abstract text available
    Text: UG58E642 4 4GJ(T)L 64M Bytes (8M x 64) DRAM 168Pin DIMM based on 4M x 4 General Description Features The UG58E642(4)4GJ(T)L is a 8,388,608 bits by 64 EDO DRAM module. The UG58E642(4)4GJ(T)L is assembled using 32 pcs of 4Mx4 2K/4K refresh DRAMs in 300mil SOJ/TSOP package, and


    Original     		PDF UG58E642 168Pin 300mil ABT16244 240mil 168-pin 1250mil) 190Max

    1Mx4

    Abstract: No abstract text available
    Text: UG8M13201DBJ N 4M Bytes (1M x 32 ) DRAM 72Pin SIMM based on 1M X 4 General Description Features The UG8M13201DBJ(N) is a 1,048,576 bits by 32 SIMM module.The UG8M13201DBJ(N) is assembled using 8 pcs of 1Mx4 1K refresh in 300mil package,mounted on a 72 Pin unbuffered


    Original     		PDF UG8M13201DBJ 72Pin 300mil 500mil) D661-2788 1Mx4

    KSZ8721B

    Abstract: sn0736 "sn 0732" KSZ8721BL SN0726 ksz8721bla4 ksz8721bt SSOP-300mil spnz801 KSZ8721CL
    Text: 2007 ETHERNET PACKAGE RELIABILITY High Temperature Storage Life +150 deg C, 1000 hours Device Lot No Pkg Pin Pre-con. KSZ8721SL A4TR GDN2621 SSOP 300mil 48L N/A KSZ8721BL GDN2631 LQFP(7*7mm) 48L N/A KSZ8721BLA4 GDN2619 LQFP(7*7mm) 48L N/A KSZ8721SL TR GDN3785


    Original     		PDF KSZ8721SL GDN2621 300mil) KSZ8721BL GDN2631 KSZ8721BLA4 GDN2619 GDN3785 300mils) KSZ8721B sn0736 "sn 0732" KSZ8721BL SN0726 ksz8721bla4 ksz8721bt SSOP-300mil spnz801 KSZ8721CL

    motorola mc146818B crystal

    Abstract: motorola mc146818B DS12885S MC146818B DS1285 DS12885 DS12885N DS12885Q DS12885QN DS12885T
    Text: www.maxim-ic.com DS12885/DS12885Q/DS12885T Real-Time Clock www.maxim-ic.com FEATURES § § § § § § § § § § § § § § § § § § DS12885, 24 DIP DS12885S, 24 SO 300mil § PIN ASSIGNMENT Top View Drop- in replacement for IBM AT computer clock/calendar


    Original     		PDF DS12885/DS12885Q/DS12885T DS12885, DS12885S, 300mil MC146818B DS1285 12-hour 24-hour motorola mc146818B crystal motorola mc146818B DS12885S DS1285 DS12885 DS12885N DS12885Q DS12885QN DS12885T

    20P2N-A

    Abstract: 20P2N SOP20 Package
    Text: 20P2N-A Plastic 20pin 300mil SOP EIAJ Package Code SOP20-P-300-1.27 JEDEC Code – Weight g 0.26 Lead Material Cu Alloy e 11 E Recommended Mount Pad 1 Symbol F 10 A D A2 A1 b y L e L1 HE e1 I2 20 b2 A A1 A2 b c D E e HE L L1 y c Detail F b2 e1 I2 Dimension in Millimeters


    Original     		PDF 20P2N-A 20pin 300mil OP20-P-300-1 20P2N-A 20P2N SOP20 Package

    SSOP24-P-300-0

    Abstract: 24P2Q 24p2q-a
    Text: 24P2Q-A Plastic 24pin 300mil SSOP EIAJ Package Code SSOP24-P-300-0.80 JEDEC Code – Weight g 0.2 Lead Material Cu Alloy e I2 13 E F Recommended Mount Pad Symbol 1 12 A A2 A1 D L L1 HE e1 24 b2 e y c b Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters


    Original     		PDF 24P2Q-A 24pin 300mil SSOP24-P-300-0 24P2Q 24p2q-a

    20PIN

    Abstract: P20C
    Text: 20PIN PLASTIC DIP 300mil 20 11 1 10 A K L H G J I P F D N M C B M 0~15° P20C - 100 - 300SA NOTE 1) Each lead centerline is located within 0.25 mm(0.01 inch) of its true position (T.P.) at maximum material condition. 2) Item "K" to center of leads when formed


    Original     		PDF 20PIN 300mil) 300SA P20C

    DIP12F

    Abstract: DIP-12F
    Text: SANYO Semiconductor Dual In-line Package 12Pin Plastic DIP12F 300mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。


    Original     		PDF 12Pin DIP12F 300mil) ED-7303A 51min 26max DIP12F DIP-12F

    DIP22S

    Abstract: No abstract text available
    Text: SANYO Semiconductor Shrink Dual In-line Package 22Pin Plastic DIP22S 300mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。


    Original     		PDF 22Pin DIP22S 300mil) ED-7303A 51min DIP22S

    DIP-24

    Abstract: No abstract text available
    Text: SANYO Semiconductor Dual In-line Package 24Pin Plastic DIP24 300mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。


    Original     		PDF 24Pin DIP24 300mil) ED-7303A 51MIN DIP24 DIP-24

    Untitled

    Abstract: No abstract text available
    Text: SANYO Semiconductor Dual In-line Package 8Pin Plastic DIP8 300mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。


    Original     		PDF 300mil) ED-7303A 51MIN

    DIP20

    Abstract: DIP-20
    Text: SANYO Semiconductor Dual In-line Package 20Pin Plastic DIP20 300mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。


    Original     		PDF 20Pin DIP20 300mil) ED-7303A 51min DIP20 DIP-20