Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end F P E 1 25 A H J I G N C S B L S K D M M NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S50G5-80-7JF3-1
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PDF
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Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end F P E 1 25 A H I S G C D N M J L S K B M NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S50G5-80-7JF4-1
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PDF
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 50 pin TSOP (II) (400 mil) 26 50 F P E detail of lead end 1 25 A D M M C B L G K N I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S50G5-80-7KF2
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PDF
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 50 pin TSOP (II) (400 mil) 50 26 E 5°±5° F detail of lead end 1 25 A H J K G I N D L B C M M S50G5-80-7JF-1 NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at
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400MIL21
S50G5-80-7JF-1
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PDF
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Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 E P F detail of lead end 1 25 A H J K G I N B C D M L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
005Each
S50G5-80-7JF1
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PDF
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U 821 B
Abstract: 0020L
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end S T R 1 A∗3 L Q 25 U H N C S J I S G B K D M M NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
006inch)
048MAX.
S50G5-80-9NF
U 821 B
0020L
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PDF
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 50 pin TSOP (II) (400 mil) 50 26 F E 5°±5° detail of lead end 1 25 A D M M C B L G K N I J H S50G5-80-7KF-1 NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at
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400MIL21
S50G5-80-7KF-1
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PDF
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Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end F E 1 P 25 A M D M K N C S G B L S I J H NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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Original
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400MIL21
S50G5-80-7KF3-1
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PDF
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TSOP package tray
Abstract: JEDEC TRAY DIMENSIONS 10936 TSOP TRAY
Text: HEAT PROOF 7 A' 12 13.67 135°C MAX. PPE 135.9 13.27 A NEC TSOP 2 400MIL21 9x13=117 109.36 UNIT : mm 21.1 22.96 19.74 275.52 315.0 (322.6) SECTION A – A' 21.1 5.62 (6.35) 7.62 18.0 Applied Package Quantity (pcs) 32-pin Plastic TSOP(II)(400mil) 50-pin Plastic TSOP(II)(400mil)
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400MIL21
32-pin
400mil)
50-pin
400MIL21
TSOP package tray
JEDEC TRAY DIMENSIONS
10936
TSOP TRAY
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PDF
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Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end F E P 1 25 A M D M K C N S G B L S I J H NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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Original
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400MIL21
S50G5-80-7KF4-1
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PDF
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Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 E P F detail of lead end 1 25 A H J K G I N B C D M L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S50G5-80-7JF2
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PDF
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JEDEC tray standard
Abstract: JEDEC TRAY DIMENSIONS JEDEC tray standard tsop TRAY TSOP TSOP package tray H6115 TSOP TRAY TRAY DIMENSIONS SSD-A-H6115-2
Text: TRAY CONTAINER HEAT PROOF A' 12.00 7 135°C MAX. PPE 109.36 13.67 13.27 A NEC TSOP 2 400MIL21 9x13=117 21.10 22.96 19.74 275.52 315.0 (322.6) SECTION A – A' 21.10 5.62 (6.35) 18.00 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 32-pin Plastic TSOP (II)
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400MIL21
32-pin
50-pin
400MIL21
SSD-A-H6115-2
JEDEC tray standard
JEDEC TRAY DIMENSIONS
JEDEC tray standard tsop
TRAY TSOP
TSOP package tray
H6115
TSOP TRAY
TRAY DIMENSIONS
SSD-A-H6115-2
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PDF
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0038 tsop
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 32 17 1 P E F detail of lead end 16 A H J K G I N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S32G5-50-7JD2
0038 tsop
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PDF
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 50 pin TSOP (II) (400 mil) 50 26 F E P detail of lead end 1 25 A D M M C B L G K N I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
00Each
S50G5-80-7KF1
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PDF
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TSOP 54 tray
Abstract: tsop 0038
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 17 32 F E 5°±5° detail of lead end 1 16 A D M M C L B G K N I J H S32G5-50-7KD1-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at
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400MIL21
S32G5-50-7KD1-1
TSOP 54 tray
tsop 0038
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PDF
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 32 17 F P E detail of lead end 1 16 A D M M C L B G K N I H NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S32G5-50-7KD2
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PDF
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U 821 B
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end U Q L R T 1 25 A∗3 D M S M K C N G S B S I J H NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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Original
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400MIL21
006inch)
002otrusions
048MAX.
S50G5-80-9PF
U 821 B
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PDF
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 F E P detail of lead end 1 14 A D M M C L B G K N I J H NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S28G5-50-7KD4
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PDF
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TSOP package tray
Abstract: 50-pin TRAY TSOP JEDEC TRAY DIMENSIONS DSAE00696 913117
Text: 7 PPE NEC 135°C MAX. A A' 20.65 22.96 19.74 11.8 109.36 13.67 13.27 TSOP 2 400MIL21 135.9 9x13=117 HEAT PROOF UNIT : mm 275.52 315.0 (322.6) SECTION A – A' 20.65 5.62 7.62 (6.35) 17 Applied Package Quantity (pcs) 50-pin Plastic TSOP(II)(400mil) MAX. 117
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400MIL21
50-pin
400mil)
TSOP package tray
TRAY TSOP
JEDEC TRAY DIMENSIONS
DSAE00696
913117
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PDF
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21x21
Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
Text: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。
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P22C100300A1
P8C-100-300B
P8CT-100-300B2-1
P8C-100-300A-1
P-DIP8-0300-2
MD300-2A
MD300-1A
MD300-09A
21x21
MM554
tray bga
45x45 bga
X13769XJ2V0CD00
CPGA132
LA010
P14DH-100-300A2-1
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PDF
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MD300-10A
Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
Text: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP
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S64F1-CA1
S108S1-YHC
P116S1-YJC
S144S1-YKC
S176S1-2C
S224S1-3C-1
S304S1-6C
S256N7-B6
S352N7-F6-1
S420N7-F6
MD300-10A
QFN tray
tray datasheet bga
SIP 400B
TSOP TRAY 40 PIN
BGA package tray 64
NEC A39A 240
TSOP package tray
6-tsop
TRAY DIMENSIONS 132 PGA
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PDF
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MD300-10A
Abstract: P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1
Text: Find tool 1. Click button in the Toolbar. 2. Search dialog box is displayed. 3. Enter a NEC code to be searched and click Find . Caution Don't use the wild card *) when entering a NEC code. Ex.) Find Find What P22C-100-300A-1 Match Whole Word Only Match Case
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P22C-100-300A-1
P8C-100-300B
P-DIP8-0300-2
MD300-2A
P8CT-100-300B2-1
MD300-1A
P8C-100-300A-1
X13769XJ2V0CD00
MD300-10A
P32C-100-600A
p20d100
C-PGA176-S15U-2
CDIP28
LA-0543A
tray bga
P-TQFP100-14X20-0
0x20010
P14DH-100-300A2-1
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