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    TRAY BGA 17 Search Results

    TRAY BGA 17 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84512-202 Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array Visit Amphenol Communications Solutions
    10022671-102LF Amphenol Communications Solutions 528 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84501-001LF Amphenol Communications Solutions 300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    55714-102LF Amphenol Communications Solutions 81 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84520-002LF Amphenol Communications Solutions 400 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions

    TRAY BGA 17 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    ADV0505

    Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
    Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The


    Original     		ADV0505 and14 12C-0707-E19 12F-1111-119 1F3-1313-D19 1F1-1717-A19 12U-1919-G19 12Y-2323-919 12Y-3333-419 12Y-3535-419 ADV0505 FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7 PDF

    nec 575

    Abstract: 484-pin BGA NEC C 324 C jedec tray BGA 324-PIN tray datasheet bga JEDEC tray standard tray bga TRAY DIMENSIONS TRAY CONTAINER
    Text: TRAY CONTAINER UNIT : mm 5x12=60 PPE 135°C MAX. 16.95 25.50 23.25 BGA23×23ESP NEC 102.0 A' 25.50 135.9 A 23.25 17.25 280.5 315.0 322.6 Section A – A' 23.25 (6.07) (6.35) 7.62 23.00 Applied Package Quantity (pcs) 324-pin Plastic BGA (23×23) 352-pin Plastic BGA (23×23)


    Original     		BGA23 23ESP 324-pin 352-pin 484-pin 575-pin SSD-A-H7317-4 nec 575 484-pin BGA NEC C 324 C jedec tray BGA tray datasheet bga JEDEC tray standard tray bga TRAY DIMENSIONS TRAY CONTAINER PDF

    JEDEC tray standard

    Abstract: JEDEC TRAY DIMENSIONS SSD-A-H7053-1 45374 H705 1849-pin BGA4545
    Text: TRAY CONTAINER UNIT : mm HEAT PROOF 30.00 7 160°CMAX PPE 2x 6=12 45.20 75.90 BGA45 × 45× 3.74 45.20 51.00 255.0 30.00 315.0 322.6 SECTION A – A' 45.20 7.55 11.50 135.9 NEC A' A Applied Package 1849-pin Plastic BGA (45×45) (FLIP CHIP TYPE) 1752-pin Plastic BGA (45×45)


    Original     		BGA45 1849-pin 1752-pin BGA45 SSD-A-H7053-1 JEDEC tray standard JEDEC TRAY DIMENSIONS SSD-A-H7053-1 45374 H705 BGA4545 PDF

    JEDEC TRAY DIMENSIONS

    Abstract: PACKAGE TRAY jedec bga tray tray jedec BGA tray bga JEDEC tray standard
    Text: TRAY CONTAINER UNIT : mm 6x15=90 17.25 107.0 NEC 135°C MAX. A' 14.45 21.40 FBGA17×17A-1 135.9 PPE A 20.50 17.25 287.0 14.00 315.0 322.6 SECTION A – A' 17.25 (6.05) (5.62) 7.62 17.00 Applied Package 256-pin Plastic BGA (17×17) Quantity (pcs) 90 MAX.


    Original     		FBGA17 256-pin SSD-A-H7511 JEDEC TRAY DIMENSIONS PACKAGE TRAY jedec bga tray tray jedec BGA tray bga JEDEC tray standard PDF

    1152 BGA tray

    Abstract: tray datasheet bga jedec bga tray tray bga 117-pin JEDEC tray standard JEDEC TRAY DIMENSIONS
    Text: TRAY CONTAINER 135° C MAX. A 10.5 12.80 10.35 FBGA14 x 10 ESP NEC 115.2 135.9 PPE 10 × 18=180 UNIT : mm A' 14.5 17.10 12.15 290.7 315.0 322.6 SECTION A-A' 14.50 (5.97) (5.62) 7.62 14.00 Applied Package 117-pin Plastic BGA (14×10) Quantity (pcs) 180 MAX.


    Original     		FBGA14 117-pin FBGA14 SSD-A-H7531 1152 BGA tray tray datasheet bga jedec bga tray tray bga JEDEC tray standard JEDEC TRAY DIMENSIONS PDF

    WY transistor

    Abstract: tray datasheet bga 256-pin BGA S256S1-B6-1
    Text: Mounting Pad Packing Name JEDEC Tray T-651 256 pin BGA 27 x 27 A S B C D Y WV U T R P N M L K J H G F E D C B A P Index mark R H K L 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 φM F E I J G M NOTE Each lead centerline is located within φ 0.3 mm (φ 0.012 inch) of


    Original     		T-651 S256S1-B6-1 WY transistor tray datasheet bga 256-pin BGA S256S1-B6-1 PDF

    tray datasheet bga

    Abstract: 0n 33 25
    Text: Packing Name Mounting Pad JEDEC Tray T-657 352 pin BGA 35 x 35 A B A B S 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 C D AE AC AA W U R N L J G E C A AF AD AB Y V T P M K H F D B P Index mark J I R H S K L φM φN S F M S A B M


    Original     		T-657 Y352S1-F6-1 tray datasheet bga 0n 33 25 PDF

    tray datasheet bga

    Abstract: 256-pin BGA BGA L WY transistor
    Text: Packing Name Mounting Pad JEDEC Tray T-651 256 pin BGA 27 x 27 A S B B A C 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D YWV U T R P N M L K J H G F E D C B A P Index mark J R I A H S F L φM φN M S A B M S E G *1 *2 detail of A part K S NOTES * 1 Each lead centerline is located within φ 0.30 mm (φ 0.012 inch) of


    Original     		T-651 Y256S1-B6 tray datasheet bga 256-pin BGA BGA L WY transistor PDF

    TRAY 15X15

    Abstract: bga Shipping Trays tray jedec BGA ad456 176TQFP Package tray 15X15 MPSU 140 tray bga 23 AD4567 BGA-1515
    Text: I AMSUN ELECTRONICS KS8664B_ CDMA/AMPS Dual Mode Modem Processor DATA SHEET Ordering July, Information Dev ice Package KS8664B 196PBGA KS8664BQ 176TQFP 1999 CDMA Team System LSI/Semiconductor SAMSUNG Electronics Co., LTD. [\D r\D ^ Uí KÍ I— o


    OCR Scan     		KS8664B_ KS8664B KS8664BQ 196PBGA 176TQFP SCom3200 15X15 15X15 BGA--1515 AD4567 TRAY 15X15 bga Shipping Trays tray jedec BGA ad456 176TQFP Package tray 15X15 MPSU 140 tray bga 23 AD4567 BGA-1515 PDF

    mask rom

    Abstract: No abstract text available
    Text: DDR Code Information 1/2 Last Updated : November 2008 K7DXXXXXXX - XXXXXXX 1 2 3 4 5 1. Memory (K) 6 7 8 9 10 11 12 13 14 15 16 17 18 13. Temp, Power - COMMON (Temp, Power) 2. Sync(DDR) SRAM : 7 C : Commercial, Normal I : Industrial, Normal 3. Small Classification


    Original     		333MHz 350MHz 375MHz 400MHz mask rom PDF

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga PDF

    mask rom

    Abstract: No abstract text available
    Text: Late Write Code Information 1/2 Last Updated : November 2008 K7PXXXXXXX - XXXXXXX 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 1. Memory (K) 13. Temp, Power - COMMON (Temp, Power) 2. Sync(Late Write) SRAM : 7 C : Commercial, Normal I : Industrial, Normal


    Original     		250MHz 300MHz mask rom PDF

    strapack s-669

    Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
    Text: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,


    Original     		PDF

    Kostat tray

    Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
    Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher


    Original     		and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13 PDF

    fBGA package tray 12 x 19

    Abstract: FCCSP HT80C51 a44e SecuCalm cortex my uLGA ARM10 I18N 64 pin IC microcontroller LCD
    Text: Microcontroller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 7. Rom Master 0 : 0K byte 2 : 2K byte 4 : 4K byte 6 : 6K byte 8 : 8K byte A : 48K byte C : 96K byte E : 176K byte G : 384K byte I : 768K byte (S-SIM)


    Original     		16-bit 32-bit ARM10 16-bit HT80C51 SC-200 128-bit fBGA package tray 12 x 19 FCCSP a44e SecuCalm cortex my uLGA ARM10 I18N 64 pin IC microcontroller LCD PDF

    secucalm

    Abstract: SecuCalm16 FCCSP fBGA package tray 12 x 19 ARM10 HT80C51 I18N 1Z89
    Text: Flash Card Controller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 1. System LSI (S) 2. Large Classification : Microcontroller(3) 3. Small Classification C : MASK ROM F : FLASH 3 : MCP 4. Core 1 : 51 4-bit 3 : 17 16-bit


    Original     		16-bit 32-bit ARM10 16-bit HT80C51 SC-200 128-bit SC-100 secucalm SecuCalm16 FCCSP fBGA package tray 12 x 19 ARM10 I18N 1Z89 PDF

    secucalm

    Abstract: HT80C51 ARM10 H285 I18N SecuCalm16
    Text: Smart Card Controller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 7. Rom Master 0 : 0K byte 2 : 2K byte 4 : 4K byte 6 : 6K byte 8 : 8K byte A : 48K byte C : 96K byte E : 176K byte G : 384K byte I : 768K byte (S-SIM)


    Original     		16-bit 32-bit ARM10 16-bit HT80C51 SC-200 128-be secucalm ARM10 H285 I18N SecuCalm16 PDF

    CCGA

    Abstract: 938 SO-16 tray datasheet bga LQFP 48 Package Box tray BGA 520 CBF 420 292 CCGA BGA 328 plcc TRAY 40 PIN PDE-208
    Text: u Packing Quantities CHAPTER 6 SUMMARY OF PACKING QUANTITIES Packing Quantities Packages and Packing Publication Revision A 3/1/03 6-1 u Packing Quantities PACKING QUANTITIES The table below summarizes the packing quantities for each package leadcount. The data is sorted first by OPN package code, then by AMD internal package code, and then by lead/ball count. Details on each product carrier can be found in the following chapters:


    Original     		PDF

    bga solder ball shear

    Abstract: foxconn
    Text: SPECIFICATIONS BGA 754 LP BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 17 mΩ max. Insulation Resistance: 1000mΩ min.


    Original     		13kgf 1000gf 1000m 754Pos 754Pos. 29X29 bga solder ball shear foxconn PDF

    S146

    Abstract: S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3
    Text: NEW High-Speed 10+Gbps BGA Mezzanine Connectors IT3 Series •Flexibility Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 10+Gbps systems. With the ability to transmit differential, single-ended,


    Original     		15mmH misali6-2-2557-7351 S146 S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3 PDF

    NEC A39A

    Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
    Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES


    Original     		C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B PDF

    tray bga 17

    Abstract: No abstract text available
    Text: Async Fast Code Information 1/2 Last Updated : November 2008 K6RXXXXXXX - XXXXXXX 1 2 3 5 4 6 7 8 9 10 11 12 13 14 15 16 17 18 1. Memory (K) 13. Temp, Power - COMMON (Temp, Power) C : Commercial, Normal I : Industrial, Normal 2. Async Fast SRAM : 6 3. Small Classification


    Original     		TSOP2-400 tray bga 17 PDF

    Untitled

    Abstract: No abstract text available
    Text: IDT - Integrated Device Technology - PowerSpan II > CA91L8260B > CA91L8260B-. Page 1 of 2 Integrated Device Technology Products | Applications Processor Products | Search | EHB Embedded Host Bridges Support The Analog and Digital Company ™ | PowerSpan II™


    Original     		CA91L8260B CA91L8260B-. CA91L8260B-100CEV A1006-02 TEPBGA-420 TEPBGA-675 PDF

    BGA PACKAGE TOP MARK intel

    Abstract: 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK
    Text: Preliminary Mechanical and Shipping Media Information for Easy BGA Packages May 2000 Document Number: 298049-007 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


    Original     		28F160F3 US048641 RD33708SW RD33716SW 12B-1013-G13 BGA PACKAGE TOP MARK intel 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK PDF