MIL-I-8835A
Abstract: camtex trays ND07071 camtex trays QFP nd r304 E20-02080-00 ITW Camtex ceramic QFP Package 100 lead exposed QFP 144 CAMTEX
Text: January 1998, ver.3 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are now common on boards because of their density, size, and cost benefits. A few precautions, however, are necessary to protect these devices from
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PLCC 84 PINS
Abstract: camtex trays MIL-I-8835A
Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP
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strapack s-669
Abstract: strapack Sivaron S 669 MIL-I-8835A kbr 208 MIL-D-3464 strapack d-52 MIL-B-81705C EIA-625 MIL-D-3464 type 1
Text: 1999年 1 月 ver. 4 イントロダク ション Application Note 71 現在表面実装用のJリード・パッケージ、クワッド・フラット・パック （QFP）パッケージ、およびFineLine BGATMを含むボール・グリッド・ア
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-AN-071-04/J
strapack s-669
strapack
Sivaron S 669
MIL-I-8835A
kbr 208
MIL-D-3464
strapack d-52
MIL-B-81705C
EIA-625
MIL-D-3464 type 1
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DAEWON tray drawing
Abstract: 124-48LD-119 DAEWON JEDEC TRAY daewon 1EC-08LD-919 Kostat tray daewon tray FBGA tray kostat Kostat TSOP Tray KS8503
Text: Chapter 5 Trays CHAPTER 5 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers Tray Dimensions Packages and Packing Methodologies Handbook 17 Oct 2008 5-1 Chapter 5 Trays INTRODUCTION Trays are used instead of tubes to protect
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Kostat tray
Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher
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and5-741-9148
Kostat tray
KS-8308
CAMTEX
Kostat
DAEWON tray 48
DAEWON tray drawing
JEDEC Kostat
CERAMIC PIN GRID ARRAY CPGA AMD
daewon
D-12G-56LD-A13
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camtex trays
Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP
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strapack s-669
Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
Text: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,
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TD 265 N 600 KOC
Abstract: core i5 520 Scans-049 camtex trays sii Product Catalog EPM9560 film hot BT 342 project TIL Display 7160S
Text: 1996 Data Book Data Book June 1996 A-DB-0696-01 Altera, MAX, M A X+PLUS, FLEX, FLEX 10K, FLEX 8000, FLEX 8000A, MAX 9000, MAX 7000, MAX 7000E, MAX 7000S, FLASHlogic, MAX 5000, Classic, M AX+PLUS II, PL-ASAP2, PLDshell Plus, FastTrack, AHDL, MPLD, Turbo Bit, BitBlaster, PENGN, RIPP 10, PLS-ES, ClockLock, ClockBoost,
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-DB-0696-01
7000E,
7000S,
EPF10K100,
EPF10K70,
EPF10K50,
EPF10K40,
EPF10K30,
EPF10K20,
EPF10K10,
TD 265 N 600 KOC
core i5 520
Scans-049
camtex trays
sii Product Catalog
EPM9560
film hot
BT 342 project
TIL Display
7160S
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