JEDEC TRAY DIMENSIONS
Abstract: JEDEC tray standard OT-007TM-01 JEDEC tray QFP JEDEC tray JEDEC tray standard 10 TRAY MATERIAL
Text: 39.57 135°C MAX 77.46 29.22 135.9 OT-007TM-01 UNIT : mm A 50.56 31.10 A' 39.57 252.8 315 322.6 <SECTION A - A'> 4.12 6.35 7.62 39.57 48.8 Tray OT-007TM-01 (JEDEC Tray) Material Carbon PPO Heat Proof Temp. Surface resistance 135°C 12 less than 1 x 10 Ω /
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OT-007TM-01
JEDEC TRAY DIMENSIONS
JEDEC tray standard
OT-007TM-01
JEDEC tray
QFP JEDEC tray
JEDEC tray standard 10
TRAY MATERIAL
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Abstract: No abstract text available
Text: 1.27mm .050" Pitch SIMM Socket FEATURES AND SPECIFICATIONS Reference Information Product Specification: PS-78954 Packaging: Tray UL File No.: E29179 CSA File No.: LR19980 Mates With: JEDEC modules Designed In: Inches Electrical Voltage: 250V Current: 1.0A
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PS-78954
E29179
LR19980
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Untitled
Abstract: No abstract text available
Text: 1.27mm .050" Pitch SIMM Socket FEATURES AND SPECIFICATIONS Reference Information Product Specification: PS-78968 Packaging: Tray UL File No.: E29179 CSA File No.: LR19980 Mates With: JEDEC modules Designed In: Inches Electrical Voltage: 250V Current: 1.0A
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PS-78968
E29179
LR19980
100Gold
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EIA and EIAJ tape standards
Abstract: TR3000MT TR-3000MT EIA and EIAJ standards
Text: TAPE AND REEL EQUIPMENT REEL-TECH TR-3000MT • ■ ■ ■ ■ ■ ■ ■ Dual pick-and-place probes 3400 UPH tray-to-tape Continuous operation 8-inch high stack of JEDEC trays Easy PC control Quick, accurate changeovers Mark, implied lead and pin #1 Vision
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TR-3000MT
TR-3000MT
EIA and EIAJ tape standards
TR3000MT
EIA and EIAJ standards
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trays
Abstract: QFN Shipping Trays PEAK TRAY bga
Text: S PEC I FI C AT I ON SHE E T Matrix Trays Matrix T r ay s UltraLite designs Available Now Open Tooling for all popular configurations Quick-tur n, custom tooling ser vices Peak Matrix Trays conform to JEDEC standards and are available in a number of tray types including Pin Grid Array, Plastic Quad
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Teradyne connector
Abstract: 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne
Text: TB-2082 DFM and SMT Assembly Guideline Revision “C“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 Initial Release Update stencil design, JEDEC tray info, add weight
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TB-2082
Teradyne connector
470-2075-100
470-2105-100
337 BGA footprint
471-2045-100
471-1045-100
471-1025-100
470-2235-100
BGA PROFILING
Teradyne
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JEDEC TRAY DIMENSIONS
Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are
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MIL-STD-81705
Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
Text: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes
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MQFP Shipping Trays
Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook
Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are
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EIA and EIAJ standards 783
Abstract: EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label
Text: Application Report SZZA021B – September 2001 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare
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SZZA021B
EIA and EIAJ standards 783
EIA standards 783
EIA 783
eia783
EIA-783
ic shipping tray
tsop Shipping Trays
SZZA021B
tray matrix bga
ti packing label
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JEDEC Matrix Tray outlines
Abstract: ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783
Text: Application Report SZZA021C − September 2005 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare
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SZZA021C
JEDEC Matrix Tray outlines
ti packing label
dck3
QFP Shipping Trays
tray bga 64
EIA-468 label location
EIA standards 783
EIA-481-x
dbv4
EIA-783
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EIA and EIAJ standards 783
Abstract: JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP
Text: Application Report SZZA021A – January 2000 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear and Logic ABSTRACT The Texas Instruments TI Semiconductor Group uses three packing methodologies to
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SZZA021A
EIA and EIAJ standards 783
JEDEC tray standard dimension
abstract for water level indicator
EIA-481-x
EIA standards 783
EIA 783
JEDEC Matrix Tray outlines
QFP Shipping Trays
EIA-783
EIA 481 TSSOP
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SMT CONNECTOR
Abstract: JEDEC tray standard
Text: S.O. DIMM Connectors Features/Benefits SERIES 6401 Series 6401 is a right-angle SMT connector, conforming to JEDEC MO-160 standard of S.O. DIMM. TECHNICAL SPECIFICATIONS Application: Pitch: Number of Contacts: Height: Current Rating: Voltage Rating: Mating Cycles
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MO-160
MO-160
SMT CONNECTOR
JEDEC tray standard
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MO-160
Abstract: MO-190 JEDEC tray standard
Text: S.O. DIMM Connectors Features/Benefits SERIES 6401 Series 6401 is a right-angle SMT connector, conforming to JEDEC MO-160 standard of S.O. DIMM. TECHNICAL SPECIFICATIONS Application: Pitch: Number of Contacts: Height: Current Rating: Voltage Rating: Mating Cycles
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MO-160
MO-160
MO-190
JEDEC tray standard
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2013310-2
Abstract: JEDEC tray standard DIMM 240 2013298-1 2-2013310-1 2013289-1
Text: DDR3 DIMM Sockets TE Connectivity’ DIMM sockets address interconnect requirements across server, communications, and notebook platforms. This product portfolio is designed around JEDEC industry standards. Sockets are offered with a variety of features designed to
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JEDEC dip profile
Abstract: No abstract text available
Text: S.O. DIMM Connectors Features/Benefits SERIES 6401 Series 6401 is a right-angle SMT connector, conforming to JEDEC MO-160 standard of S.O. DIMM. TECHNICAL SPECIFICATIONS Application: Pitch: Number of Contacts: Height: Current Rating: Voltage Rating: Mating Cycles
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MO-160
MO-160
JEDEC dip profile
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LQFP-48 thermal pad
Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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TQFP 100 pin ic
Abstract: 208ld
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features: ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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ANSI/EOS ESD S11.11-2001
Abstract: EIA-625 1x10E-8 EIA-541 SSTV16857 SSYA010 abstract for "metal detector" 1x10e9
Text: Application Report SZZA047 - July 2004 Semiconductor Packing Material Electrostatic Discharge ESD Protection Albert Escusa and Lance Wright Standard Linear and Logic ABSTRACT Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI)
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SZZA047
ANSI/EOS ESD S11.11-2001
EIA-625
1x10E-8
EIA-541
SSTV16857
SSYA010
abstract for "metal detector"
1x10e9
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Untitled
Abstract: No abstract text available
Text: m o le x Sockets a n d Edge C onnecto rs FEATURES A N D SPECIFICATIONS Features and Benefits Electrical • Zero insertion force contacts improve socket and module contact life ond provide fo r fast on-line assembly ■ Guaranteed 2 points of contact per readout with standard
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30mC2
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IR 9530
Abstract: No abstract text available
Text: Sockets and Edge Connectors FEATURES ANDSPECMCAHOHS features and Benefits • Zero insertion farce contacts improve socket and module contact life and provide fo r fast on-line assembly ■ Guaranteed 2 points of contact per readout with standard JEDEC module
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GS-14-899
Abstract: MO-269 DDR3 memory DDR3 sodimm socket DDR3 rDIMM DDR3 pcb design GS-12-486 ddr3 dimm connector sc007
Text: BOARD-TO-BOARD CONNECTORS FCÎ, DDR3 MEMORY MODULE SOCKETS DESCRIPTION Memory module sockets from FCI are designed to accept most industry standard memory types DDR, DDR2, DDR3 and form factors such as DIMM, SO-DIMM or VLP DIMM. The sockets allow convenient memory
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240-posltlon
MO-269.
UL94V-0
GS-12-486
S0-009
MO-269
GS-14-899
MO-269
DDR3 memory
DDR3 sodimm socket
DDR3 rDIMM
DDR3 pcb design
ddr3 dimm connector
sc007
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Untitled
Abstract: No abstract text available
Text: S o c k e ts a n d E d g e C o n n e c to rs FEATURES AMD SPECIFICATIONS Features and Benefits • Zero insertion force contacts improve socket and module contact life and provide for fast on-line assembly ■ Guaranteed 2 points of contact per readout with standard
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OCR Scan
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MO-64
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Untitled
Abstract: No abstract text available
Text: • Guaranteed 2 points o f contact per readout with standard JEDEC module m o l e x 2.54mm x 12.70mm Flectrical .100 x .500" Pitch Voltage: 2S0V SIMM Classic Current: 1.0A Contact Resistance: 30mC2 max. SIMM Socket Dielectric Withstanding Voltage: 1000V AC
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30mC2
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