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    FCCSP Search Results

    FCCSP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TX7516ALH Texas Instruments 16-channel five-level transmitter 144-FCCSP 0 to 70 Visit Texas Instruments
    PTX08DACP Texas Instruments 8-channel ultrasound transmitter 196-FCCSP 0 to 70 Visit Texas Instruments
    IWR6843AQGABL Texas Instruments Single-chip 60-GHz to 64-GHz intelligent mmWave sensor integrating processing capability 161-FCCSP -40 to 105 Visit Texas Instruments
    DS280DF810ABWT Texas Instruments 28-Gbps multi-rate 8-channel retimer 135-FCCSP -40 to 85 Visit Texas Instruments
    DS160PT801ACBR Texas Instruments PCIe® 4.0 16-Gbps 8-Lane (16-Channel) retimer 332-FCCSP -40 to 85 Visit Texas Instruments Buy

    FCCSP Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    FCCSP Amkor Technology a flip chip solution in a CSP package format. Original PDF

    FCCSP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    BGA 64 PACKAGE thermal resistance

    Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
    Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect


    Original     		PDF 63Sn/37Pb) BGA 64 PACKAGE thermal resistance FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45

    E700G

    Abstract: No abstract text available
    Text: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


    Original     		PDF DS577G E700G

    DS7409HGB

    Abstract: DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G
    Text: Data Sheet LAMINATE FlipStack CSP Features FlipStack® CSP The FlipStack CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment of


    Original     		PDF DS820C DS7409HGB DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G

    HL832N

    Abstract: ELC4785 E679 DS7409 MO-298 amkor flip Amkor Technology HL832 MO-192 MO-195
    Text: LAMINATE data sheet FlipStack CSP FlipStack® CSP: The FlipStack® CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment


    Original     		PDF

    cu pillar

    Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance
    Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


    Original     		PDF

    HL832N

    Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
    Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


    Original     		PDF

    3F1 SMD Transistor

    Abstract: 3fx transistor transistor 3Fn 24 smd transistor lg smd transistor LF smd JH transistor celeritek CCS1933 F7104 smd transistor fh
    Text: CCS1933 Product Information March 1996 1 of 2 1.85 to 2.0 GHz 2 Watt Amplifier Chip Set Features ❏ High Gain ≈ 35 dB ❏ +33 dBm Output Power @ 5 Volts ❏ >45% Efficiency Achievable ❏ Small Size Functional Block Diagram CMM1301 CFK2162 Applications


    Original     		PDF CCS1933 CMM1301 CFK2162 CCS1933 CMM1301) CFK2162) PB-CCS1933 3F1 SMD Transistor 3fx transistor transistor 3Fn 24 smd transistor lg smd transistor LF smd JH transistor celeritek F7104 smd transistor fh

    transistor l1w smd

    Abstract: ng52 mmic transistor E5 SMD Transistor Y04 SMD K62 smd mmic transistor E5 WG1 smd O2W transistor G7FH transistor g7x
    Text: CCS1930 Product Information March 1996 1 of 2 1.85 to 2.0 GHz 1 Watt Amplifier Chip Set Features ❏ High Gain ≈ 32 dB ❏ +30 dBm Output Power @ 5 Volts ❏ >45% Efficiency Achievable ❏ Small Size Functional Block Diagram CMM1301 CFK2062 Applications


    Original     		PDF CCS1930 CMM1301 CFK2062 CCS1930 CMM1301) CFK2062) CFK2062 PB-CCS1930 transistor l1w smd ng52 mmic transistor E5 SMD Transistor Y04 SMD K62 smd mmic transistor E5 WG1 smd O2W transistor G7FH transistor g7x

    fBGA package tray 12 x 19

    Abstract: FCCSP HT80C51 a44e SecuCalm cortex my uLGA ARM10 I18N 64 pin IC microcontroller LCD
    Text: Microcontroller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 7. Rom Master 0 : 0K byte 2 : 2K byte 4 : 4K byte 6 : 6K byte 8 : 8K byte A : 48K byte C : 96K byte E : 176K byte G : 384K byte I : 768K byte (S-SIM)


    Original     		PDF 16-bit 32-bit ARM10 16-bit HT80C51 SC-200 128-bit fBGA package tray 12 x 19 FCCSP a44e SecuCalm cortex my uLGA ARM10 I18N 64 pin IC microcontroller LCD

    CSR 57

    Abstract: No abstract text available
    Text: TOSHIBA 155 Mbps High Performance ATM SAR 1 9 9 8 T C 3 5 8 5 4 F R E V I S I O N : 1 . 0 D A T A TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC. B O O K TC35854F Rev.1.0 FLOWmasterTM is a trademark of Digital Equipment Corporation. The contents of this technical data are subject to change without


    Original     		PDF TC35854F TC35854F. 125oC/20hours CSR 57

    DS1047

    Abstract: No abstract text available
    Text: MachXO3L Family Data Sheet Advance DS1047 Version 00.2, February 2014 MachXO3L Family Data Sheet Introduction February 2014 Advance Data Sheet DS1047 Features  Solutions • • • • • • • • • • Smallest footprint, lowest power, high data


    Original     		PDF DS1047 DS1047

    CSPNL

    Abstract: amkor RDL wafer map format amkor amkor flip amkor Sip amkor polyimide FCCSP wafer map
    Text: data sheet wafer level packaging CSPnl RDL Features: Packaging CSPnl Bump on Redistribution RDL (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the


    Original     		PDF

    PM7503

    Abstract: programmable rf delay line PM750 cpri
    Text: PM7503 SynthePHY 3G-Lite AM Programmable System Clock Synthesizer and 2-Port SERDES for Remote Radio Heads The SynthePHY 3G-Lite is a programmable System Clock Synthesizer and 2-Port SERDES designed for use in wireless Remote Radio Head RRH applications. It provides two independent high-speed,


    Original     		PDF PM7503 PMC-2101814, programmable rf delay line PM750 cpri

    Untitled

    Abstract: No abstract text available
    Text: Modular Jack FEATURES AND SPECIFICATIONS Features and Benefits Electrical Voltage: 125V Current: 1.5A Contact Resistance: 10mΩ max. Dielectric Withstanding Voltage: 1000V AC rms Insulation Resistance: 500 MΩ min. • Meets UL 1086 Section 8 Electrical Probe and UL 1863


    Original     		PDF RJ-45

    PIN SCR BRX 49

    Abstract: APC UPS CIRCUIT DIAGRAM SCR BRX 49 PIN SCR BRX 49 APC UPS 650 CIRCUIT DIAGRAM switch it 1102d RBS 2964 APC back UPS RS 800 g44 motorola 1024D1
    Text: MPC8260UM/D 4/1999 Rev. 0 ª MPC8260 PowerQUICC II UserÕs Manual ª PowerQUICC II, Mfax, and DigitalDNA are trademarks of Motorola, Inc. The PowerPC name, the PowerPC logotype, PowerPC 601, PowerPC 603, PowerPC 603e, PowerPC 604, PowerPC 604e, and RS/6000 are trademarks of


    Original     		PDF MPC8260UM/D MPC8260 RS/6000 32-Bit MPCFPE32B/AD PIN SCR BRX 49 APC UPS CIRCUIT DIAGRAM SCR BRX 49 PIN SCR BRX 49 APC UPS 650 CIRCUIT DIAGRAM switch it 1102d RBS 2964 APC back UPS RS 800 g44 motorola 1024D1

    RBS 3518

    Abstract: APC UPS CIRCUIT DIAGRAM ITG 3030 UPS APC CIRCUIT MPC8260RM transceiver LED PIN 155mbps ATML lp 1610 for door bell 2.3 ecm MPC8250
    Text: MPC8260 PowerQUICC II Family Reference Manual Supports MPC8250 MPC8255 MPC8260 MPC8264 MPC8265 MPC8266 MPC8260RM Rev. 2, 12/2005 How to Reach Us: Home Page: www.freescale.com email: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor


    Original     		PDF MPC8260 MPC8250 MPC8255 MPC8260 MPC8264 MPC8265 MPC8266 MPC8260RM CH370 RBS 3518 APC UPS CIRCUIT DIAGRAM ITG 3030 UPS APC CIRCUIT MPC8260RM transceiver LED PIN 155mbps ATML lp 1610 for door bell 2.3 ecm MPC8250

    APC UPS CIRCUIT DIAGRAM

    Abstract: APC back UPS RS 800 motorola ECM 3361AS apc back-ups 800 rs diagram CHN 535 EE 2817 driver circuit to drive electromagnetic relay using microprocessor APC UPS CIRCUIT BOARD APC UPS CIRCUIT layout
    Text: Freescale Semiconductor, Inc. Freescale Semiconductor, Inc. MPC8260UM/D 05/2003, REV 1 MPC8260 PowerQUICC II Family Reference Manual Supports MPC8250 MPC8255 MPC8260 MPC8264 MPC8265 MPC8266 For More Information On This Product, Go to: www.freescale.com


    Original     		PDF MPC8260UM/D MPC8260 MPC8250 MPC8255 MPC8260 MPC8264 MPC8265 MPC8266 APC UPS CIRCUIT DIAGRAM APC back UPS RS 800 motorola ECM 3361AS apc back-ups 800 rs diagram CHN 535 EE 2817 driver circuit to drive electromagnetic relay using microprocessor APC UPS CIRCUIT BOARD APC UPS CIRCUIT layout

    MSP 34100

    Abstract: MSP 34100 C5 LC1 DB25 B7 inverter ABB ACS 150 pcb connector 4 pin push button dp 20 Wiring Diagram cpu 315-2 dp siemens MARKING DIAGRAMS sob 214 motorola bts hm1 MSP 34106 BT 342 project
    Text: MSC8103 Reference Manual 16-Bit Digital Signal Processor MSC8103RM/D Revision 0, June 2003 HOW TO REACH US: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution P.O. Box 5405 Denver, Colorado 80217 1-800-521-6274 or 480-768-2130 JAPAN: Motorola Japan Ltd.


    Original     		PDF MSC8103 16-Bit MSC8103RM/D Index-36 SC140/CPM Index-37 Index-38 MSP 34100 MSP 34100 C5 LC1 DB25 B7 inverter ABB ACS 150 pcb connector 4 pin push button dp 20 Wiring Diagram cpu 315-2 dp siemens MARKING DIAGRAMS sob 214 motorola bts hm1 MSP 34106 BT 342 project

    wy smd transistor

    Abstract: transistor k626 GHW Connectors g1n transistor TRANSISTOR f5j transistor smd 3f13 smd transistor EY transistor smd 3fh smd transistor fh f5j transistor
    Text: CCS2930 Product Information March 1996 1 of 2 2.4 to 2.5 GHz 1 Watt Amplifier Chip Set Features ❏ High Gain ≈ 30 dB ❏ +30 dBm Output Power @ 5 Volts ❏ 33% Efficient ❏ Small Size Functional Block Diagram CMM2301 CFK2062 Applications ❏ ISM Band Base Stations


    Original     		PDF CCS2930 CMM2301 CFK2062 CCS2930 CMM2301) CFK2062) PB-CCS2930 wy smd transistor transistor k626 GHW Connectors g1n transistor TRANSISTOR f5j transistor smd 3f13 smd transistor EY transistor smd 3fh smd transistor fh f5j transistor

    WLCSP flip chip

    Abstract: WLCSP smt 0.3mm pitch csp package wlcsp inspection WLCSP chip mount WLCSP PBO design amkor flip amkor RDL amkor polyimide system in package WLCSP underfill
    Text: data sheet wafer level packaging WLCSP Features • 4 - 196 ball count • 0.8 mm – 6.5 mm body size • Repassivation, Redistribution and Bumping options available • Electroplated and Ball-loaded bumping options • Eutectic and Lead-free solder • Standard JEDEC / EIAJ pitches and CSP solder ball diameters


    Original     		PDF

    SMD TRANSISTOR ANALOG

    Abstract: SMD TRANSISTOR LIST CCS1930 CFK2062 CFK2062-P3 CMM1301 CMM1301-AM CSW2102 PB-CCS1930 SOIC-16
    Text: CELERÊTEK g CCS1930 1.85 to 2.0 GHz 1 Watt Amplifier Chip Set P roduct Inform ation M arch 1996 Oof 2 Features □ High Gain = 32 dB □ +30 dBm Output Power @ 5 Volts □ >45% Efficiency Achievable □ Small Size Functional Block Diagram 1 CMM1301 CFK2062 I


    OCR Scan     		PDF CMM1301 CFK2062 CMM1301) SMD TRANSISTOR ANALOG SMD TRANSISTOR LIST CCS1930 CFK2062-P3 CMM1301 CMM1301-AM CSW2102 PB-CCS1930 SOIC-16

    Untitled

    Abstract: No abstract text available
    Text: m o le x Modular Jack FEATURES AND SPICIFfCifiMtS Features and Benefits Electrical • Meets U L 1086 Section 8 Electrical Probe and I I I 1863 Voltage: 125V Section 20 Childs Finger Test 42878 Current: 1.5A ■ No exposed leads to meet British Telecom 4000V test


    OCR Scan     		PDF for4401 27jnm

    B648

    Abstract: b3-12
    Text: m o l e x Modular Jack FEATURES AND SPECIFICATIONS Features and Benefits Electrical • Meets U L 1086 Section 8 Electrical Probe and U L 1863 Voltage: 125V Section 20 Childs Finger Test 42410 Current: 1.5A ■ No exposed leads to meet British Telecom 4000V test


    OCR Scan     		PDF RJl1/RJ13/RJ14 B648 b3-12

    m1301

    Abstract: CELERITEK SWITCH 6 PIN SMD 3236 D0805 transistor d 1933 smd transistor pin out data celeritek amplifier
    Text: e CELERITEK CCS1933 Product Information March 1 9 9 6 iof 2 1.85 to 2.0 GHz 2 Watt Amplifier Chip Set Features □ High Gain - 35 dB □ +33 dBm Output Power @ 5 Volts □ >45% Efficiency Achievable □ Small Size Functional Block Diagram CFK2162 I Applications


    OCR Scan     		PDF CCS1933 CFK2162 CMM1301 CMM1301) m1301 CELERITEK SWITCH 6 PIN SMD 3236 D0805 transistor d 1933 smd transistor pin out data celeritek amplifier