daewon
Abstract: Trays DAEWON drawing 453-Pin
Text: u Chapter 7 Trays Ceramic Pin Grid Array: 321-Pin, 453-Pin CGF Notes: See next page for detailed views 1 All dimensions are in millimeters. 2 Trays can withstand continuous operation at temperatures up to 65°C. 3 This drawing is for trays manufactured by DaeWon Semiconductor Packaging Co.
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321-Pin,
453-Pin
daewon
Trays
DAEWON drawing
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daewon
Abstract: DAEWON drawing
Text: u Chapter 7 Trays Organic Pin Grid Array: 453-Pin OGF Notes: See next page for detailed views 1 All dimensions are in millimeters. 2 Trays can withstand continuous operation at temperatures up to 60°C. 3 This drawing is for trays manufactured by DaeWon Semiconductor Packaging C
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453-Pin
daewon
DAEWON drawing
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ADV0505
Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The
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ADV0505
and14
12C-0707-E19
12F-1111-119
1F3-1313-D19
1F1-1717-A19
12U-1919-G19
12Y-2323-919
12Y-3333-419
12Y-3535-419
ADV0505
FBGA-484
daewon tray
daewon
FBGA672
PEAK TRAY bga
1f1-1717-a19
12C-0707-E19
FBGA256
Daewon BGA 7x7
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hp6652a
Abstract: daewon DC100N TCXO dip 14 HP53131A HP665 MAS9270
Text: DC100N: COMPENSATION AND PROGRAMMING SYSTEM FOR MAS TCXOs Manufacturing system for producing digitally programmed, analog compensated TCXOs and VCTCXOs Features • Programming and testing of TCXOs and VCTCXOs • Suitable for MAS9270Cxxx Oscillator IC • 14 Pin DIP socket array programming and testing board for producing 4 x
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DC100N:
MAS9270Cxxx
64pcs)
000/ea
14pin
256pcs
hp6652a
daewon
DC100N
TCXO dip 14
HP53131A
HP665
MAS9270
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daewon tray
Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA
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AN-071-5
Hand-0444
daewon tray
Daewon T0809050
daewon tray 1F1-1717-AXX
strapack s-669
DAEWON tray 48
DAEWON JEDEC TRAY
DAEWON FBGA
KS-88085
1F1-1717-AXX
tray bga
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12B-0608-F19
Abstract: DAEWON tray 48 daewon daewon tray FBGA 6x8 TRAY fbga 6X8 DAEWON FBGA MPPO fBGA package tray 3466A
Text: Chapter 5 Trays Very Very Thin Small Outline No Lead Package: WNF 008 322.6 2.54 R. 4 PLACES * 315.0 VACCUM PICKUP CELLS 14 PLACES Y (12 CENTER CELLS, 2 SIDE CELLS) CLOSED CELLS 2 PLACES 6.35 SEE DETAIL "D" X BUMPS 12 PLACES * 7.62 Z SEE DETAIL "E" X
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0X45M
3466b
26022i
12B-0608-F19
DAEWON tray 48
daewon
daewon tray
FBGA 6x8
TRAY fbga 6X8
DAEWON FBGA
MPPO
fBGA package tray
3466A
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daewon
Abstract: DAEWON tray 48 daewon tray 260 9 130 451 044 DAEWON FBGA 9 140 010 044 daewon tray TRAY MPPO
Text: Chapter 5 Trays Fine-Pitch Ball Grid Array: NLB 044, VDA 044, VDD 044, NLB 056, NSB 056 3416 \ f27328a \ 12-13-07 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 17 Oct 2008 5-63
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f27328a
f29719a
f29858a
daewon
DAEWON tray 48
daewon tray 260
9 130 451 044
DAEWON FBGA
9 140 010 044
daewon tray
TRAY MPPO
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PEAK tray drawing
Abstract: 12C-1313-119 daewon 89HPES4T4ZBBCGI TRAY MPPO DAEWON tray drawing PBGA144 daewon tray 72T1 PBGA-144
Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: TB0908-03 DATE: 9/16/2009 Product Affected: 13 mm x 13 mm PBGA-144 & 13 mm x 13 mm CABGA-144 Date Effective: Contact: Title: Phone #:
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TB0908-03
PBGA-144
CABGA-144
72V36110L7-5BB
72V36110L7-5BBG
72V36110L7-5BBGI
72V36110L7-5BBI
72V3640L6BB
72V3640L6BBG
72V3640L7-5BB
PEAK tray drawing
12C-1313-119
daewon
89HPES4T4ZBBCGI
TRAY MPPO
DAEWON tray drawing
PBGA144
daewon tray
72T1
PBGA-144
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f82c735a
Abstract: intel date code marking f82c735 tm1977b daewon 1420 daewon B65555 6300HG intel code marking MP8000
Text: Product Change Notification Change Notification #: 887 Revision 1 Please respond to your distributor if you have any issues with the timeline or content of this change. No response from customers will be deemed as acceptance of the change and the change will be implemented pursuant to the key milestones set forth in this attached PCN.
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F82C735A
B65555A
f82c735a
intel date code marking
f82c735
tm1977b
daewon 1420
daewon
B65555
6300HG
intel code marking
MP8000
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alpine 3555
Abstract: Newport Components 1013 clare 852 unitronics JI 3009-2 1131L gentech A320 54711 74146
Text: You are in the Sales Info File • Click for Main Menu Product Categories CLICK ANY ITEM Return to Main Menu PC Card Power Protected Switches Low-Dropout Linear Voltage Regulators Switch-Mode Voltage Regulators Voltage References Switched-Capacitor Voltage Converters
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hp laptop MOTHERBOARD pcb CIRCUIT diagram
Abstract: AS Eltek smps 250 hp laptop battery pinout LM317 power supply 0.30 V. 20 amp LD33 VOLTAGE REGULATOR 2675M ld33 linear LA36 diode HP 4220 laptop ac adapter schematics diagram hp mini laptop MOTHERBOARD pcb CIRCUIT diagram
Text: Back Micrel’s Guide to Designing With Low-Dropout Voltage Regulators Bob Wolbert Applications Engineering Manager Revised Edition, December 1998 Table of Contents Index Micrel Semiconductor 1849 Fortune Drive San Jose, CA 95131 Phone: + 1 408 944-0800
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daewon
Abstract: VDJ044 TRAY MPPO Trays 14 x 20 DAEWON FBGA
Text: Chapter 5 Trays Fine-Pitch Ball Grid Array: NLD 044, VDE 044, VDJ 044 3648 \ f28384b \ 8.1.7 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 6 Dec 2007 5-39 Chapter 5 Trays Fine-Pitch Ball Grid Array: NLD 044, VDE 044, VDJ044
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f28384b
VDJ044
28805c
3477b
27776c
daewon
VDJ044
TRAY MPPO
Trays 14 x 20
DAEWON FBGA
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daewon
Abstract: DAEWON FBGA LAA064 FBGA 137 DAEWON LAA
Text: Chapter 5 Trays Fine-Pitch Ball Grid Array: LAA 064, LSA 064, LSE 064, LAA 080, LSB 080, MMB 112, FTM 115, FTM 137, FVE 137, FWC 137, FWD 137 3694 \ f27326 \ 5.21.8 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook
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f27326
3474b
27327d
daewon
DAEWON FBGA
LAA064
FBGA 137
DAEWON LAA
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daewon
Abstract: 3472A DAEWON tray 10 x 9 12B-8116-119 12B-0811-119 DAEWON FBGA 8X11 daewon* fbga DAEWON FBGA TRAY MPPO daewon* fbga 8*11
Text: Chapter 5 Trays Fine-Pitch Ball Grid Array: FLA 069, VBG 080, FEE 088, TLE 088, TSA 088, VBG 088, VBL 088 322.6 2.54 R. 4 PLACES * 315.0 VACUUM PICKUP CELLS 14 PLACES SEE DETAIL "D" X Y (12 CENTER CELLS, 2 SIDE CELLS) 6.35 * 7.62 BUMPS 11 PLACES Z SEE DETAIL "E"
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3472b
26946h
f27839b-opt2
daewon
3472A
DAEWON tray 10 x 9
12B-8116-119
12B-0811-119
DAEWON FBGA 8X11
daewon* fbga
DAEWON FBGA
TRAY MPPO
daewon* fbga 8*11
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daewon
Abstract: TRAY MPPO DAEWON tray 48 33 x 33 DAEWON tray FBD63 tray 8X14 FBC 30 A DAEWON 64 8X14 12b-0809-f19
Text: Chapter 5 Trays Fine-Pitch Ball Grid Array: FBC 048, VBD 064 322.6 REF. 2.54 R. 4 PLACES 6.35* 315.0* VACUUM PICKUP CELLS 18 PLACES 16 CENTER CELLS, 2 SIDE CELLS SEE DETAIL "D" X Y CLOSED CELLS 8 PLACES 7.62 Z SEE DETAIL "E" X X 119.9 ±0.25 135.9* 92.1
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26048i
3412-2a
26396f
FBD63
12F-0814-D19
3412-2b
daewon
TRAY MPPO
DAEWON tray 48
33 x 33 DAEWON tray
FBD63
tray 8X14
FBC 30 A
DAEWON 64
8X14
12b-0809-f19
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DAEWON tray drawing
Abstract: 124-48LD-119 DAEWON JEDEC TRAY daewon 1EC-08LD-919 Kostat tray daewon tray FBGA tray kostat Kostat TSOP Tray KS8503
Text: Chapter 5 Trays CHAPTER 5 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers Tray Dimensions Packages and Packing Methodologies Handbook 17 Oct 2008 5-1 Chapter 5 Trays INTRODUCTION Trays are used instead of tubes to protect
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intel 80219
Abstract: XScale 80219
Text: Intel 80219 General Purpose PCI Processor Datasheet Extended Temperature Support Product Features • ■ ■ ■ Core Features — Integrated Intel XScale® Core — ARM* V5T Instruction Set — ARM V5E DSP Extensions — 400 MHz and 600 MHz — Write Buffer, Write-back Cache
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64-bit/66
--64-bit/133
32-bit
64-bit
--PC200
VCC33
intel 80219
XScale 80219
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Kostat tray
Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher
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and5-741-9148
Kostat tray
KS-8308
CAMTEX
Kostat
DAEWON tray 48
DAEWON tray drawing
JEDEC Kostat
CERAMIC PIN GRID ARRAY CPGA AMD
daewon
D-12G-56LD-A13
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DAEWON JEDEC TRAY 10 X 10
Abstract: daewon MPSU 140 LEI-4 DAEWON JEDEC TRAY CABGA 7 X 7 JEDEC TRAY 10 X 10
Text: <322.65 — 6.35 • 315.0 - VACUUM PICKUP CELLS 14 PLACES 12 CENTER CELLS, 2 SIDE CELI — 7.62 V BBUMPS l 7 PLACES = 1 E jE E T ilB D ii] mo.20(H iAiz(n>i - 311.15-+0.25 -0.13 - 132.08-+0.25 -0.13 Vj r a X H* Da +0.25 -0.13 - 132.59-M0.20(H)IAIZ<H>
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59----M0
0X45\M
JCL-6575-0
DAEWON JEDEC TRAY 10 X 10
daewon
MPSU 140
LEI-4
DAEWON JEDEC TRAY CABGA 7 X 7
JEDEC TRAY 10 X 10
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DAEWON JEDEC TRAY 10 X 10
Abstract: DAEWON JEDEC TRAY CABGA 7 X 7 DAEWON tray drawing JEDEC TRAY 10 X 10
Text: 12_I_ U _ I_ 10_ I_ 9_ I_ 8_ I_ 7_ I_ 6_ I_ 5_ I_ 4_ I_ 3_ I_ 2_ I_ 1
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0X45NM
JCL-0795-1
DAEWON JEDEC TRAY 10 X 10
DAEWON JEDEC TRAY CABGA 7 X 7
DAEWON tray drawing
JEDEC TRAY 10 X 10
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Syntek Semiconductor 1261
Abstract: Nam Tai Electronics Es325 syntek Dynatek 110
Text: LG Semicon SALES NETWORK OVERSEAS SUBSIDIARIES & OFFICES U.SJV LG Semicon America, Inc. 3003 North First Street San Jose, CA 95134-2004 Tel : 1 408-432-5000 Fax : (1)408-432-6067 LGSA Raleigh Office 5511 Capital Center Drive, Suite 430, Raleigh, NC 27606
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SF-33720
Syntek Semiconductor 1261
Nam Tai Electronics
Es325
syntek
Dynatek 110
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DAEWON tray drawing
Abstract: TRAY 15X15 daewon tray daewon CABGA daewon msc1701 TRAY MPPO Package tray 15X15 DAEWON drawing MSA-3032
Text: REVISIONS REV 02 OBS D E S C R IP T IO N ADDED NEW PACKAGE - D A TE B C /B C G 196 & B F /B F G 2 8 9 OBSOLETE THE DRAWING CONVERTED TO P 7 - 2 4 6 - 0 0 0 A PPRO V ED 1 1 /0 1 / 0 7 0 5 /1 5 /0 9 KK Thee KK Thee 6 .3 5 S E E D E T A IL 'D ' !-»! o.go (H) I a T x W I
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P7-246-000)
15X15
-30VS
MSC17011
P7-139-
MSC-1707
DAEWON tray drawing
TRAY 15X15
daewon tray
daewon CABGA
daewon
msc1701
TRAY MPPO
Package tray 15X15
DAEWON drawing
MSA-3032
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DAEWON JEDEC TRAY 10 X 10
Abstract: DAEWON JEDEC TRAY DAEWON JEDEC TRAY CABGA 7 X 7 DAEWON tray drawing DAEWON drawing daewon tray 41AL daewon JEDEC TRAY 10 X 10
Text: M IE APPROVED 06/85/99 SB KVMC — 6.35 rx l /“ SEE DETAIL 'D' 10.20 0 a zq O.gQWlAlXj — 7.62 in 311.15- • +0.25 -0.13 - 132.08- -I +0.25 -0.13 +0.25 -0.13 311.66 -■ +0.25 -0.13 - 132.59- - 0.20(H lA|xq <IH0.20 (R) 1A1Z (R) 92.1 SECTIDN 'X-X*
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30\MH
0X45\M
DAEWON JEDEC TRAY 10 X 10
DAEWON JEDEC TRAY
DAEWON JEDEC TRAY CABGA 7 X 7
DAEWON tray drawing
DAEWON drawing
daewon tray
41AL
daewon
JEDEC TRAY 10 X 10
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DAEWON JEDEC TRAY
Abstract: DAEWON JEDEC TRAY 10 X 10 JEDEC tray standard 17 x 17 JEDEC tray standard 13 jedec tray scale TRAY DAEWON MPSU DAEWON JEDEC TRAY CABGA 7 X 7 JEDEC TRAY 10 X 10
Text: 06/09/8000 SA CHUNG • 3 2 2 .6 - -6.35 SEE DETAIL 'D' VACUUM PICKUP C E L L S 14 P L A C E S (IE CENTER CELLS, 2 SIDE CELI ■0.20 A Xd -7.62 V BUMPS \17 P L A C E S 0IO.2O®IAIZ®I - 132.08- +0.25 -0.13 ♦ +H+0 * +0.25 -0.13 - 132.59- - XaESAlrií5,9
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