BGA754
Abstract: Solder ball shear
Text: SPECIFICATIONS BGA 754 DT BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.
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Original
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13kgf
1000gf
1000m
754Pos.
29X29
BGA754
Solder ball shear
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PDF
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bga solder ball shear
Abstract: foxconn
Text: SPECIFICATIONS BGA 754 LP BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 17 mΩ max. Insulation Resistance: 1000mΩ min.
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Original
|
13kgf
1000gf
1000m
754Pos
754Pos.
29X29
bga solder ball shear
foxconn
|
PDF
|
BGA754
Abstract: foxconn
Text: SPECIFICATIONS BGA 754 LP BG A CPU Socket BG A SM T Type 1.27X1.27mm [.05X. 05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 17 mΩ max.
|
Original
|
13kgf
1000gf
1000m
754Pic,
754Pos.
BGA754
foxconn
|
PDF
|
foxconn
Abstract: BGA754
Text: SPECIFICATIONS BGA 754 DT BG A CPU Socket BG A SM T Type 1.27X1.27mm[.05X. 05”]Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.
|
Original
|
13kgf
1000gf
1000m
754Pos.
29X29
foxconn
BGA754
|
PDF
|
BGA754
Abstract: Solder ball shear bga solder ball shear foxconn
Text: SPECIFICATIONS BGA 754 MB BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.
|
Original
|
13kgf
1000gf
1000m
754PoV-0
754Pos.
29X29
BGA754
Solder ball shear
bga solder ball shear
foxconn
|
PDF
|
BGA754
Abstract: Solder ball shear
Text: SPECIFICATIONS BGA 754 MB BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.
|
Original
|
13kgf
1000gf
1000m
754Pos.
29X29
BGA754
Solder ball shear
|
PDF
|