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    FBGA672

    Abstract: ioa18 fbga672 paging EPF8282A EPF8282AV EPF8636A EPF8820A EPM7032S EPM7064S AGILENT TECHNOLOGIES 3070
    Text: IEEE 1149.1 JTAG Boundary-Scan Testing in Altera Devices June 2005, ver. 6.0 Introduction Application Note 39 As printed circuit boards (PCBs) become more complex, the need for thorough testing becomes increasingly important. Advances in surfacemount packaging and PCB manufacturing have resulted in smaller


    Original     		PDF 1980s, FBGA672 ioa18 fbga672 paging EPF8282A EPF8282AV EPF8636A EPF8820A EPM7032S EPM7064S AGILENT TECHNOLOGIES 3070

    PCN0515

    Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
    Text: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera FineLine BGA® FBGA device packages. Devices in FBGA packages currently


    Original     		PDF PCN0515 HC-100 UL-94 1x1011 PCN0515 sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC

    FBGA672

    Abstract: IOAD16 8 IOG20 AGILENT TECHNOLOGIES 3070 ioa18 ieee 1532 EPC16 EPF81500A EPF8282A EPF8636A
    Text: IEEE 1149.1 JTAG Boundary-Scan Testing in Altera Devices June 2005, ver. 6.0 Introduction Application Note 39 As printed circuit boards PCBs become more complex, the need for thorough testing becomes increasingly important. Advances in surfacemount packaging and PCB manufacturing have resulted in smaller


    Original     		PDF 1980s, FBGA672 IOAD16 8 IOG20 AGILENT TECHNOLOGIES 3070 ioa18 ieee 1532 EPC16 EPF81500A EPF8282A EPF8636A

    ADV0505

    Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
    Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The


    Original     		PDF ADV0505 and14 12C-0707-E19 12F-1111-119 1F3-1313-D19 1F1-1717-A19 12U-1919-G19 12Y-2323-919 12Y-3333-419 12Y-3535-419 ADV0505 FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7