jsm 5800
Abstract: 5800-LV 1200C JEOL SEM Ishida scale Cu6Sn5
Text: The Anomalous Microstructural, Tensile and Aging Response of Thin Cast Sn3.9Ag0.6Cu Lead Free Solder Qiang Xiao,1 Luu Nguyen,2 William D. Armstrong1,3 1. Department of Mechanical Engineering, University of Wyoming, Laramie, WY 82071. 2. National Semiconductor Corporation, Santa Clara, CA 95052. 3. Email: wda@uwyo.edu
|
Original
|
as-1200C
1200C.
as-1800C
1800C.
jsm 5800
5800-LV
1200C
JEOL SEM
Ishida scale
Cu6Sn5
|
PDF
|
JESD22-B111
Abstract: Olympus bx60 heraeus Sn37Pb-bumped Heraeus paste ws 8704B5000 electroless nickel environmental test Cu OSP 6335F Cu6Sn5
Text: Drop Test Reliability of Wafer Level Chip Scale Packages Mikko Alajoki, Luu Nguyen * and Jorma Kivilahti Lab. of Electronics Production Technology Helsinki University of Technology P.O.Box 3000, 02150 Espoo, Finland * National Semiconductor Corporation P.O.Box 58090, Mail Stop 19-100, Santa Clara, USA
|
Original
|
|
PDF
|
Cu6Sn5
Abstract: Cu6Sn5 surface energy sem 2006 IPACK2005
Text: APPLIED PHYSICS LETTERS 88, 012106 ͑2006͒ Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints Lingyun Zhang,a͒ Shengquan Ou, Joanne Huang, and K. N. Tu Department of Materials Science and Engineering, University of California, Los Angeles,
|
Original
|
|
PDF
|
36804-10M
Abstract: Cu6Sn5 SnAgCu
Text: Influence of Solder Microstructure and Oxide Layers on High Frequency Electrical Losses of WL-CSP Pb-free Interconnections Dragos Burlacu, Luu Nguyen* and Jorma Kivilahti Laboratory of Electronics Production Technology Helsinki University of Technology P.O. Box 3000, FIN-02150, Finland
|
Original
|
FIN-02150,
36804-10M
Cu6Sn5
SnAgCu
|
PDF
|
Cu6Sn5
Abstract: FeNi42 Infineon diffusion solder smema smema specifications transistor k81 leadframe materials olin 7025
Text: Tin Whisker Formation – Results, Test Methods and Countermeasures Dittes, M*.; Oberndorff, P*.; Petit, L.* *Infineon Technologies, * Philips CFT, * STMicroelectronics Abstract Electroplated tin layers as used as lead-free solderable finish on the terminations of semiconductor devices are
|
Original
|
|
PDF
|
AN10896
Abstract: finger print sensor pcb with circuit Mounting and Soldering of RF transistors heller 1700 ipc 610D JEDEC J-STD-020d Moisture/Reflow sensitivity HVQFN48 J-STD-020D bga rework graphite thermal spreader
Text: AN10896 Mounting and Soldering of RF transistors Rev. 01 — 17 May 2010 Application note Document information Info Content Keywords Surface mount, reflow soldering, bolt down Abstract This application note provides bolt down and soldering guidelines for NXP’s RF transistor packages
|
Original
|
AN10896
AN10896
finger print sensor pcb with circuit
Mounting and Soldering of RF transistors
heller 1700
ipc 610D
JEDEC J-STD-020d Moisture/Reflow sensitivity
HVQFN48
J-STD-020D
bga rework
graphite thermal spreader
|
PDF
|
FLUX TYPE ROL0
Abstract: ALLOY leadframe C7025 ST-300 C7025 strip specification smd EDL 63 ST-50 adrian borg 10X10 C151 C194
Text: The Qualification of a Pure Tin Plating Process as a Lead Free Finish for I.C. Packaging Joseph Gauci, Adrian-Michael Borg and Robert Caruana, ST Microelectronics, Malta Keith Whitlaw and Jeff Crosby, Rohm and Haas Electronic Materials, Coventry, UK Abstract
|
Original
|
ST-300
Workshop/54th
FLUX TYPE ROL0
ALLOY leadframe C7025
C7025 strip specification
smd EDL 63
ST-50
adrian borg
10X10
C151
C194
|
PDF
|
Infineon diffusion solder
Abstract: Cu6Sn5 C1870 equivalent transistor of C1870 Olin-194 C70250 C19400 C14415 F-38019 OLIN194
Text: Tin Whiskers on Lead-free Platings P.J.T.L. Oberndorff1, M. Dittes2, L. Petit3, C.C. Chen4, J. Klerk1 and E.E. de Kluizenaar1 Philips, Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 1000944, D-93009 Regensburg, Germany, marc.dittes@infineon .com
|
Original
|
D-93009
F-38019
Infineon diffusion solder
Cu6Sn5
C1870
equivalent transistor of C1870
Olin-194
C70250
C19400
C14415
OLIN194
|
PDF
|
DE-AC03-76SF00098
Abstract: Cu3Sn sncu0.7 Cu6Sn5 Ortec Cu6Sn5 formation whisker Cu base b110c
Text: Structure and Kinetics of Sn Whisker Growth on Pb-free Solder Finish *W. J. Choi, T. Y Lee, and K. N. Tu Dept. of Materials Science and Engineering, UCLA, Los Angeles, CA 90095-1595 N. Tamura, R. S. Celestre, and A. A. MacDowell Advanced Light Source, LBNL, Berkeley, CA 94720
|
Original
|
|
PDF
|
schematic diagram intel atom
Abstract: DE-AC03-76SF00098 schematic diagram atom Cu6Sn5 Acta Materialia
Text: Acta Materialia 51 2003 6253–6261 www.actamat-journals.com Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction W.J. Choi a,∗ 1, T.Y. Lee a 2, K.N. Tu a, N. Tamura b, R.S. Celestre b, A.A. MacDowell b, Y.Y. Bong c, Luu Nguyen c
|
Original
|
|
PDF
|
ALLOY leadframe C7025
Abstract: ALLOY leadframe C7025 material property C19400 leadframe materials C18070 leadframe C7025 Cu6Sn5 MF202 C7025 c14415
Text: Whisker Testing: Reality or Fiction? P. Oberndorff 1, M. Dittes2, P. Crema 3 1 Philips Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 100944, D-93009 Regensburg, Germany,
|
Original
|
D-93009
ALLOY leadframe C7025
ALLOY leadframe C7025 material property
C19400
leadframe materials
C18070
leadframe C7025
Cu6Sn5
MF202
C7025
c14415
|
PDF
|
FeNi42
Abstract: C18070 LF-304 53RD J-STD-004 leadframe materials CuCrSiTi FeNi42-leadframe lf304 Cu6Sn5
Text: Whisker Root Cause and Respective Test Conditions Dittes, M*.; Oberndorff, P*.; Crema, P.* *Infineon Technologies, * Philips CFT, * STMicroelectronics marc.dittes@infineon.com pascal.oberndorff@philips.com paolo.crema@st.com Abstract Electroplated Tin on leadframe components is the leadfree alternative to SnPb plating of widest use worldwide.
|
Original
|
LF-304,
FeNi42
C18070
LF-304
53RD
J-STD-004
leadframe materials
CuCrSiTi
FeNi42-leadframe
lf304
Cu6Sn5
|
PDF
|
DE-AC03-76SF00098
Abstract: Cu3Sn Cu6Sn5 sncu0.7
Text: Structure and Kinetics of Sn Whisker Growth on Pb-free Solder Finish *W. J. Choi, T. Y Lee, and K. N. Tu Dept. of Materials Science and Engineering, UCLA, Los Angeles, CA 90095-1595 N. Tamura, R. S. Celestre, and A. A. MacDowell Advanced Light Source, LBNL, Berkeley, CA 94720
|
Original
|
|
PDF
|
induction cooker fault finding diagrams
Abstract: induction cooker schematic diagram th 20594 JEDEC JESD22-B116 free datasheet transistor said horizontal tt 2222 8 PIN DIL 20594 JEDEC JESD22-B109 JESD22-B108A schematic diagram induction cooker induction cooker coil design
Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
|
Original
|
REJ27L0001-0101
induction cooker fault finding diagrams
induction cooker schematic diagram
th 20594
JEDEC JESD22-B116 free
datasheet transistor said horizontal tt 2222
8 PIN DIL 20594
JEDEC JESD22-B109
JESD22-B108A
schematic diagram induction cooker
induction cooker coil design
|
PDF
|
|
|
AN10365
Abstract: ipc 610D Cu3Sn JEDEC J-STD-033b.1 SSOP20 LAND PATTERN JEDEC J-STD-033b J-STD-033b.1 Cu6Sn5 ipc 610 non-wetting Solder Paste, Indium, Type 3
Text: AN10365 Surface mount reflow soldering description Rev. 04 — 13 August 2009 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling Abstract This application note provides guidelines for the board mounting and
|
Original
|
AN10365
AN10365
ipc 610D
Cu3Sn
JEDEC J-STD-033b.1
SSOP20 LAND PATTERN
JEDEC J-STD-033b
J-STD-033b.1
Cu6Sn5
ipc 610 non-wetting
Solder Paste, Indium, Type 3
|
PDF
|
JESD22A121
Abstract: IC SEM 2005 SZZA051B chopin JEDEC no 21 environmental acceptance requirements for tin whiskers susceptibility of tin and tin al JESD22a121 measuring whisker growth on tin and tin alloy surfaces finishes SZZA031
Text: Application Report SZZA051B – August 2005 – Revised August 2005 Whisker Evaluation of Pb-Free Component Leads Donald C. Abbott, Stu Grenney, Larry Nye, Douglas W. Romm . SLL Logic ABSTRACT Integrated circuits ICs with both tin-lead (SnPb) and Pb-free finished leads were
|
Original
|
SZZA051B
JESD22A121
IC SEM 2005
SZZA051B
chopin
JEDEC no 21 environmental acceptance requirements for tin whiskers susceptibility of tin and tin al
JESD22a121 measuring whisker growth on tin and tin alloy surfaces finishes
SZZA031
|
PDF
|
Lead Free reflow soldering profile BGA
Abstract: AN10365 HVQFN48 SSOP20 Solder Paste, Indium, Type 3 Cu3Sn philips pb-free products
Text: AN10365 Surface mount reflow soldering description Rev. 01 — 24 May 2005 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.
|
Original
|
AN10365
AN10365
Lead Free reflow soldering profile BGA
HVQFN48
SSOP20
Solder Paste, Indium, Type 3
Cu3Sn
philips pb-free products
|
PDF
|
ansys darveaux
Abstract: JXA8900R IPACK2005-73239 pitarresi 53RD IPACK2005 Ansys led 5800-LV SMD 5AG A333
Text: Proceedings of IPACK2005 Proceedings of IPACK2005 ASME InterPACK '05 ASME InterPACK July 17-22, San Francisco, California,'05 USA July 17-22, San Francisco, California, USA IPACK2005-73239 IPACK2005-73239 Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD
|
Original
|
IPACK2005
IPACK2005-73239
ansys darveaux
JXA8900R
IPACK2005-73239
pitarresi
53RD
IPACK2005
Ansys led
5800-LV
SMD 5AG
A333
|
PDF
|
study of alloy
Abstract: Cu6Sn5 63Sn37Pn 63Sn37Pb
Text: Aging and Creep Behavior of Sn3.9Ag0.6Cu Solder Alloy Qiang Xiao*, Luu Nguyen*, William D. Armstrong* * Department of Mechanical Engineering, University of Wyoming, Laramie, WY 82071 * National Semiconductor Corporation, Santa Clara, CA 95052 Abstract Aging effects and creep behavior along with
|
Original
|
|
PDF
|
sensors mttf
Abstract: SAC405 UM 3841 4953 sac 405 "Hall Effect Sensor" mttf resistor activation energy sURVEY OF Hall Effect Current Measurements WLCSP Cu6Sn5
Text: Mean Time To Failure in Wafer Level-CSP Packages with SnPb and SnAgCu Solder Bumps Stephen Gee and Luu Nguyen National Semiconductor M/S 19-100 3875 Kifer Rd. Santa Clara, CA 95051 stephen.gee@nsc.com luu.nguyen@nsc.com ABSTRACT In this test setup, embedded die surface temperature sensors are
|
Original
|
ED-16
IPACK2005-73417,
sensors mttf
SAC405
UM 3841
4953
sac 405
"Hall Effect Sensor" mttf
resistor activation energy
sURVEY OF Hall Effect Current Measurements
WLCSP
Cu6Sn5
|
PDF
|
C18070
Abstract: Atotech c14415 Cu6Sn5 C18090 olin 194 Olin-194 CuCrSiTi Cu3Sn FeNi42
Text: Whisker Formation on Tin Plated Cu based Leadframes Results and Conclusion 29 October 2004 Content • • • • • Introduction Experience E4 Main cause whisker growth on Cu LF Countermeasures Conclusions Introduction Period of potential whisker growth
|
Original
|
FeNi42
ST-150
ST-200
150oC
C18070
Atotech
c14415
Cu6Sn5
C18090
olin 194
Olin-194
CuCrSiTi
Cu3Sn
|
PDF
|
FeNi42
Abstract: Cu6Sn5 sn-pb-ag solder paste
Text: Whisker Formation on Tin Plated FeNi42 Results and Conclusion 29 October 2004 Outline • Introduction • Experimental procedure and inspection • Results • Summary and Conclusions Introduction Major mechanism and conditions for whisker formation FeNi42
|
Original
|
FeNi42
FeNi42=
FeNi42
SnPb10
Cu6Sn5
sn-pb-ag solder paste
|
PDF
|
Cu3Sn
Abstract: HVQFN48 J-STD-020D SSOP20 Cu6Sn5 Solder Paste, Indium 5.1, Type 3 AN10365
Text: AN10365 Surface mount reflow soldering description Rev. 03 — 22 April 2008 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.
|
Original
|
AN10365
AN10365
Cu3Sn
HVQFN48
J-STD-020D
SSOP20
Cu6Sn5
Solder Paste, Indium 5.1, Type 3
|
PDF
|
intel packaging handbook 240800
Abstract: Ultrasonic cleaner circuit diagram moisture sensitive handling and packaging MIL-B-81705 intel 815 reflow profile INTEL PLCC 68 dimensions tape LEAD FRAME SURFACE MOUNT Intel Packaging Handbook 240800 solder PQFP die size PQFP moisture sensitive handling and packaging
Text: 2 8 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 1/22/97 10:19 AM CH08WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 8 MOISTURE SENSITIVITY/DESICCANT PACKAGING/HANDLING OF PSMCS 8.1. INTRODUCTION This chapter of the Packaging Handbook examines surface mount assembly processes and
|
Original
|
CH08WIP
intel packaging handbook 240800
Ultrasonic cleaner circuit diagram
moisture sensitive handling and packaging
MIL-B-81705
intel 815 reflow profile
INTEL PLCC 68 dimensions tape
LEAD FRAME SURFACE MOUNT
Intel Packaging Handbook 240800 solder
PQFP die size
PQFP moisture sensitive handling and packaging
|
PDF
|