FeNi42
Abstract: Cu6Sn5 sn-pb-ag solder paste
Text: Whisker Formation on Tin Plated FeNi42 Results and Conclusion 29 October 2004 Outline • Introduction • Experimental procedure and inspection • Results • Summary and Conclusions Introduction Major mechanism and conditions for whisker formation FeNi42
|
Original
|
PDF
|
FeNi42
FeNi42=
FeNi42
SnPb10
Cu6Sn5
sn-pb-ag solder paste
|
FeNi42
Abstract: whisker TSOP-II-54 "leadframe material" DIP
Text: 06-June-03 Back-Up Block 2 Whisker on NiFe Whisker on NiFe 06-June-03 Ambient storage tin plated FeNi42 length of longest whisker in µm 10 TSOPII-54 FeNi42 ambient storage 8 3,7 µm Sn 6,6 µm Sn 9,5 µm Sn 6 11,7 µm Sn 14,7 µm Sn 4 2 time in days 100
|
Original
|
PDF
|
06-June-03
FeNi42
TSOPII-54
FeNi42)
FeNi42
whisker
TSOP-II-54
"leadframe material" DIP
|
SIL03-1A72-71D
Abstract: FeNi42
Text: Europe: +49 / 7731 8399 0 | Email: info@meder.com Artikel Nr.: USA: +1 / 508 295 0771 | Email: salesusa@meder.com Asia: +852 / 2955 1682 | Email: salesasia@meder.com 3303172171 Artikel: SIL03-1A72-71D Spulendaten bei 20 °C Spulenwiderstand Spulenspannung
|
Original
|
PDF
|
SIL03-1A72-71D
1A72-71D
SIL03-1A72-71D
FeNi42
|
SIL03-1A72-71L
Abstract: No abstract text available
Text: Europe: +49 / 7731 8399 0 | Email: info@meder.com Item No.: USA: +1 / 508 295 0771 | Email: salesusa@meder.com Asia: +852 / 2955 1682 | Email: salesasia@meder.com 3303172071 Item: SIL03-1A72-71L Conditions Coil Data at 20 °C Coil resistance Coil voltage Rated power
|
Original
|
PDF
|
SIL03-1A72-71L
SIL03-1A72-71L
|
AgCu28
Abstract: No abstract text available
Text: CHAPTER 7 ENVIRONMENTAL INFORMATION page Introduction 7-2 Explanation of the tables 7-2 General safety remarks 7-5 Substances not used by Philips Semiconductors 7-6 Disposal and recycling 7-7 General warnings 7-7 Chemical content tables: Diodes Transistors
|
Original
|
PDF
|
SC-74
OT457
representiveSOT23
FeNi42
SnPb20
AgCu28
|
Cu6Sn5
Abstract: FeNi42 Infineon diffusion solder smema smema specifications transistor k81 leadframe materials olin 7025
Text: Tin Whisker Formation – Results, Test Methods and Countermeasures Dittes, M*.; Oberndorff, P*.; Petit, L.* *Infineon Technologies, * Philips CFT, * STMicroelectronics Abstract Electroplated tin layers as used as lead-free solderable finish on the terminations of semiconductor devices are
|
Original
|
PDF
|
|
3at2
Abstract: MN102 PANASONIC pic writer
Text: MICROCOMPUTER MN102H MN102H60G/60K/F60G/F60K LSI User’s Manual Pub.No.22360-013E PanaX Series is a trademark of Matsushita Electric Industrial Co., Ltd. The other corporation names, logotype and product names written in this book are trademarks or registered trademarks of their
|
Original
|
PDF
|
MN102H
MN102H60G/60K/F60G/F60K
22360-013E
3at2
MN102 PANASONIC
pic writer
|
Infineon diffusion solder
Abstract: Cu6Sn5 C1870 equivalent transistor of C1870 Olin-194 C70250 C19400 C14415 F-38019 OLIN194
Text: Tin Whiskers on Lead-free Platings P.J.T.L. Oberndorff1, M. Dittes2, L. Petit3, C.C. Chen4, J. Klerk1 and E.E. de Kluizenaar1 Philips, Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 1000944, D-93009 Regensburg, Germany, marc.dittes@infineon .com
|
Original
|
PDF
|
D-93009
F-38019
Infineon diffusion solder
Cu6Sn5
C1870
equivalent transistor of C1870
Olin-194
C70250
C19400
C14415
OLIN194
|
SIL05-1A7
Abstract: No abstract text available
Text: Europe: +49 / 7731 8399 0 | Email: info@meder.com Item No.: USA: +1 / 508 295 0771 | Email: salesusa@meder.com Asia: +852 / 2955 1682 | Email: salesasia@meder.com 3305100571 Item: SIL05-1A72-71MHR Conditions Coil Data at 20 °C Coil resistance Coil voltage
|
Original
|
PDF
|
SIL05-1A72-71MHR
SIL05-1A7
|
ALLOY leadframe C7025
Abstract: ALLOY leadframe C7025 material property C19400 leadframe materials C18070 leadframe C7025 Cu6Sn5 MF202 C7025 c14415
Text: Whisker Testing: Reality or Fiction? P. Oberndorff 1, M. Dittes2, P. Crema 3 1 Philips Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 100944, D-93009 Regensburg, Germany,
|
Original
|
PDF
|
D-93009
ALLOY leadframe C7025
ALLOY leadframe C7025 material property
C19400
leadframe materials
C18070
leadframe C7025
Cu6Sn5
MF202
C7025
c14415
|
FeNi42
Abstract: C18070 LF-304 53RD J-STD-004 leadframe materials CuCrSiTi FeNi42-leadframe lf304 Cu6Sn5
Text: Whisker Root Cause and Respective Test Conditions Dittes, M*.; Oberndorff, P*.; Crema, P.* *Infineon Technologies, * Philips CFT, * STMicroelectronics marc.dittes@infineon.com pascal.oberndorff@philips.com paolo.crema@st.com Abstract Electroplated Tin on leadframe components is the leadfree alternative to SnPb plating of widest use worldwide.
|
Original
|
PDF
|
LF-304,
FeNi42
C18070
LF-304
53RD
J-STD-004
leadframe materials
CuCrSiTi
FeNi42-leadframe
lf304
Cu6Sn5
|
SIL03-1A72-71L
Abstract: No abstract text available
Text: Europe: +49 / 7731 8399 0 | Email: info@meder.com Artikel Nr.: USA: +1 / 508 295 0771 | Email: salesusa@meder.com Asia: +852 / 2955 1682 | Email: salesasia@meder.com 3303172071 Artikel: SIL03-1A72-71L Spulendaten bei 20 °C Spulenwiderstand Spulenspannung
|
Original
|
PDF
|
SIL03-1A72-71L
SIL03-1A72-71L
|
UWE W22
Abstract: mn102 MN102H60 BF400 X1000 16x16 LED Matrix DM 311 BG 35 EW23 MN102H60K MN10200
Text: MICROCOMPUTER MN102H00 MN102H60G/60K/F60G/F60K LSI User's Manual Pub.No.22360-011E PanaXSeries is a trademark of Matsushita Electric Industrial Co., Ltd. The other corporation names, logotypes and product names written in this manual are trademarks or registered trademarks
|
Original
|
PDF
|
MN102H00
MN102H60G/60K/F60G/F60K
22360-011E
MN102HF60G/F60K
UWE W22
mn102
MN102H60
BF400
X1000
16x16 LED Matrix
DM 311 BG 35
EW23
MN102H60K
MN10200
|
UWE W22
Abstract: EW23 mn102 16x16 LED Matrix mark AT0 rs232c protocol MN10200 MN102H00 MN102HF55G 70an
Text: MICROCOMPUTER MN102H00 MN102H55D/55G/F55G LSI User's Manual Pub.No.22355-020E PanaXSeries is a trademark of Matsushita Electric Industrial Co., Ltd. The other corporation names, logotypes and product names written in this manual are trademarks or registered trademarks
|
Original
|
PDF
|
MN102H00
MN102H55D/55G/F55G
22355-020E
MN102HF55G
UWE W22
EW23
mn102
16x16 LED Matrix
mark AT0
rs232c protocol
MN10200
MN102H00
70an
|
|
|
sil24-1a72-71d
Abstract: No abstract text available
Text: Europe: +49 / 7731 8399 0 | Email: info@meder.com Item No.: USA: +1 / 508 295 0771 | Email: salesusa@meder.com Asia: +852 / 2955 1682 | Email: salesasia@meder.com 3324100171 Item: SIL24-1A72-71D Conditions Coil Data at 20 °C Coil resistance Coil voltage Rated power
|
Original
|
PDF
|
SIL24-1A72-71D
sil24-1a72-71d
|
sil05-1a72-71qhr
Abstract: No abstract text available
Text: Europe: +49 / 7731 8399 0 | Email: info@meder.com Item No.: USA: +1 / 508 295 0771 | Email: salesusa@meder.com Asia: +852 / 2955 1682 | Email: salesasia@meder.com 3305172871 Item: SIL05-1A72-71QHR Conditions Coil Data at 20 °C Coil resistance Coil voltage
|
Original
|
PDF
|
SIL05-1A72-71QHR
sil05-1a72-71qhr
|
3324190071
Abstract: No abstract text available
Text: Europe: +49 / 7731 8399 0 | Email: info@meder.com Item No.: USA: +1 / 508 295 0771 | Email: salesusa@meder.com Asia: +852 / 2955 1682 | Email: salesasia@meder.com 3324190071 Item: SIL24-1B90-71L Conditions Coil Data at 20 °C Coil resistance Coil voltage Rated power
|
Original
|
PDF
|
SIL24-1B90-71L
3324190071
|
C18070
Abstract: Atotech c14415 Cu6Sn5 C18090 olin 194 Olin-194 CuCrSiTi Cu3Sn FeNi42
Text: Whisker Formation on Tin Plated Cu based Leadframes Results and Conclusion 29 October 2004 Content • • • • • Introduction Experience E4 Main cause whisker growth on Cu LF Countermeasures Conclusions Introduction Period of potential whisker growth
|
Original
|
PDF
|
FeNi42
ST-150
ST-200
150oC
C18070
Atotech
c14415
Cu6Sn5
C18090
olin 194
Olin-194
CuCrSiTi
Cu3Sn
|
On semiconductor date Code sot-143
Abstract: TR13
Text: Package Details - SOT-143 Mechanical Drawing Lead Code: Part Marking: 2-4 Character Alpha/Numeric Code. Reference individual device datasheet. Mounting Pad Geometry Dimensions in mm Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m R2 (5-December 2003)
|
Original
|
PDF
|
OT-143
EIA-481-1-A
FeNi42
SnPb10
11-February
On semiconductor date Code sot-143
TR13
|
Untitled
Abstract: No abstract text available
Text: Europe: +49 / 7731 8399 0 | Email: info@meder.com Item No.: USA: +1 / 508 295 0771 | Email: salesusa@meder.com Asia: +852 / 2955 1682 | Email: salesasia@meder.com 3303172271 Item: SIL03-1A72-71M Conditions Coil Data at 20 °C Coil resistance Coil voltage Rated power
|
Original
|
PDF
|
SIL03-1A72-71M
|
TRANSISTOR SMD CODE PACKAGE SOT89 52 10A
Abstract: smd transistor g1-L philips ic06 cmos databook Soldering guidelines and SMD footprint design MSB430 Philips Components, Soft Ferrites Data Handbook M display dc05 humidity sensor philips H1 soft ferrites philips handbook Philips Components, Soft Ferrites Data Handbook
Text: SC18_1999_.book : SC18_PREFACE_1999 i Wed May 12 11:40:55 1999 Philips Semiconductors Discrete Semiconductor Packages Preface TABLE OF CONTENTS Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii
|
Original
|
PDF
|
|
SnPb36Ag2
Abstract: Lead Free reflow soldering profile BGA Infineon diffusion solder semiconductors cross reference philips pb-free products FeNi42 BGA Ball Crack VSO56 BGA and QFP Package freescale HTQFP100
Text: Lead-free packaging for semiconductor devices E4 presentation Infineon Technologies / ST Microelectronics / Philips Semiconductors / Freescale Semiconductor 24 March 2005 Content 1 2 3 4 5 6 7 8 9 Aim of this document Legislation Target / Status Standardisation
|
Original
|
PDF
|
2002/95/E
SnPb36Ag2
Lead Free reflow soldering profile BGA
Infineon diffusion solder
semiconductors cross reference
philips pb-free products
FeNi42
BGA Ball Crack
VSO56
BGA and QFP Package freescale
HTQFP100
|
CuCrSiTi
Abstract: k75 leadframe "leadframe material" DIP 20 INFINEON cross reference FeNi42 solderability
Text: Solderability 06-June-03 Back Up Block 3 Solderability Solderability Source: STMicroelectronics 06-June-03 SO 8 Wetting force mN/mm No forced ageing Ageing : 16H150°C Good solderability of Sn coated components in SnPb Wetting balance test 235°C Zero cross time << 3 seconds
|
Original
|
PDF
|
06-June-03
16H150
10mN/mm
10seconds
06-Junitial
CuCrSiTi
k75 leadframe
"leadframe material" DIP 20
INFINEON cross reference
FeNi42
solderability
|
SIL24-1A72-71Q
Abstract: No abstract text available
Text: Europe: +49 / 7731 8399 0 | Email: info@meder.com Item No.: USA: +1 / 508 295 0771 | Email: salesusa@meder.com Asia: +852 / 2955 1682 | Email: salesasia@meder.com 3324172371 Item: SIL24-1A72-71Q Conditions Coil Data at 20 °C Coil resistance Coil voltage Rated power
|
Original
|
PDF
|
SIL24-1A72-71Q
SIL24-1A72-71Q
|