ansys darveaux
Abstract: JXA8900R IPACK2005-73239 pitarresi 53RD IPACK2005 Ansys led 5800-LV SMD 5AG A333
Text: Proceedings of IPACK2005 Proceedings of IPACK2005 ASME InterPACK '05 ASME InterPACK July 17-22, San Francisco, California,'05 USA July 17-22, San Francisco, California, USA IPACK2005-73239 IPACK2005-73239 Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD
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IPACK2005
IPACK2005-73239
ansys darveaux
JXA8900R
IPACK2005-73239
pitarresi
53RD
IPACK2005
Ansys led
5800-LV
SMD 5AG
A333
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Loctite hysol 501
Abstract: LOCTITE HYSOL FP4549 Epotek 600-2 h20E FP4549 laser Displacement linear ccd nikon ROGERS DUROID Loctite hysol IPACK2005
Text: Proceedings IPACK2005 Proceedings IPACK2005 ASME InterPACK '05 ASME InterPACK '05 JulyJuly 17-22, San Francisco, California, USA 17-22, San Francisco, California, USA IPACK2005-73258 IPACK2005-73258 HIGH RESOLUTION CHARACTERIZATION OF MATERIALS USED IN PACKAGES
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IPACK2005
IPACK2005-73258
Loctite hysol 501
LOCTITE HYSOL FP4549
Epotek 600-2
h20E
FP4549
laser Displacement linear ccd
nikon
ROGERS DUROID
Loctite hysol
IPACK2005
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Untitled
Abstract: No abstract text available
Text: PROCEEDINGS OF IPACK2005 ASME INTERPACK '05 JULY 17-22, SAN FRANCISCO, CALIFORNIA, USA IPACK2005-73445 TESTING THE THERMAL RESISTANCE AND POWER CAPACITY OF PRODUCTION HEAT PIPES Sukhvinder Kang, Randy Cook, Dave Gailus Aavid Thermalloy LLC Concord, NH kang@aavid.com
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IPACK2005
IPACK2005-73445
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IPACK2005
Abstract: Odonnell crack flip chip 519T2 50-pin d-sub computer science engineering board ed16 smd sensor nodes mttf
Text: Proceedings of IPACK2005 ASME InterPACK '05 Proceedings of IPACK2005 July 17-22, San Francisco, California, ASME InterPACK '05USA July 17-22, San Francisco, California, USA IPACK2005-73417 IPACK2005-73417 Lead-Free and PbSn Bump Electromigration Testing Stephen Gee and Nikhil Kelkar
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IPACK2005
IPACK2005-73417
IPACK2005
Odonnell
crack flip chip
519T2
50-pin d-sub
computer science engineering board
ed16 smd
sensor nodes mttf
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sac 405
Abstract: WLCSP flip chip IPACK2005 sensors mttf WLCSP chip mount SAC405 thetaja wlcsp "sac 405"
Text: The Effect of Electromigration on Eutectic SnPb and Pb-free Solders in Wafer Level-Chip Scale Packages Joanne Huang1, Stephen Gee2, Luu Nguyen2, King-Ning Tu1 1 Department of Materials Science and Engineering, University of California - Los Angeles, Los Angeles,
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IPACK200573417.
sac 405
WLCSP flip chip
IPACK2005
sensors mttf
WLCSP chip mount
SAC405
thetaja wlcsp
"sac 405"
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sensors mttf
Abstract: SAC405 UM 3841 4953 sac 405 "Hall Effect Sensor" mttf resistor activation energy sURVEY OF Hall Effect Current Measurements WLCSP Cu6Sn5
Text: Mean Time To Failure in Wafer Level-CSP Packages with SnPb and SnAgCu Solder Bumps Stephen Gee and Luu Nguyen National Semiconductor M/S 19-100 3875 Kifer Rd. Santa Clara, CA 95051 stephen.gee@nsc.com luu.nguyen@nsc.com ABSTRACT In this test setup, embedded die surface temperature sensors are
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ED-16
IPACK2005-73417,
sensors mttf
SAC405
UM 3841
4953
sac 405
"Hall Effect Sensor" mttf
resistor activation energy
sURVEY OF Hall Effect Current Measurements
WLCSP
Cu6Sn5
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X23-7772-4
Abstract: ipad3
Text: TM i.MX 6 Series Thermal Management Guidelines Document Number: AN4579 Rev. 0, 11/2012 Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. ARM is the registered trademark of ARM Limited. ARM Cortex -A9 is a trademark of ARM Limited. All other product or service names are the property of their respective owners.
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AN4579
X23-7772-4
ipad3
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