Untitled
Abstract: No abstract text available
Text: 4 1 +9 SOT619-1 HVQFN48; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending, 518 or Y Ordering code 12NC) ending 518 Rev. 1 — 21 October 2013 Packing information 1. Packing method %DUFRGHODEHO 'U\DJHQW %DJ (6'SULQW
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OT619-1
HVQFN48;
OT619-1
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.9 mm D SOT619-5 A B terminal 1 index area E A A1 c detail X C e1 e 1/2 e v w b 13 24 L M M y y1 C C A B C 25 12 e e2 Eh 1/2 e 1 36 terminal 1
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HVQFN48:
OT619-5
MO-220
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HVQFN48
Abstract: sot778
Text: PDF: 2002 Jul 05 Philips Semiconductors Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm A B D SOT778-1 terminal 1 index area A E A1 c detail X C e1 e 1/2 e v M C A B w M C b 13 24
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HVQFN48:
OT778-1
HVQFN48
sot778
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HVQFN48
Abstract: MO-220 sot619
Text: Package outline Philips Semiconductors HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.9 mm D SOT619-5 A B terminal 1 index area E A A1 c detail X C e1 e 1/2 e v w b 13 M M y1 C C A B C y 24 L 25 12 e e2
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HVQFN48:
OT619-5
MO-220
HVQFN48
MO-220
sot619
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HVQFN48
Abstract: sot778
Text: Package outline Philips Semiconductors HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm A B D SOT778-4 terminal 1 index area E A A1 c detail X C e1 e v w b 1/2 e 13 M M y1 C C A B C y 24 L 25 12 e
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HVQFN48:
OT778-4
HVQFN48
sot778
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HVQFN48
Abstract: MO-220 k MO-220 sot619 e1a4
Text: PDF: 2000 Sep 29 Philips Semiconductors Package outline HVQFN48: plastic, heatsink very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm SOT619-2 B D D1 A terminal 1 index area A E1 A4 A1 E detail X k k e1 b e C v M B y y1 C w M 13 24 v M A
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HVQFN48:
OT619-2
MO-220
HVQFN48
MO-220 k
MO-220
sot619
e1a4
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HVQFN48
Abstract: P-HVQFN48-6x6
Text: JEITA Package Code P-HVQFN48-6x6-0.40 RENESAS Code PVQN0048LA-A Previous Code ⎯ MASS[Typ.] 0.09g NOTES 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. b1,c1: DIMENSION BEFORE PLATING HD *1 4.4 D A 25 e 36 37 24 4.4 *2 E HE B 13 ZE 48 1 12 ZD t b
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P-HVQFN48-6x6-0
PVQN0048LA-A
HVQFN48
P-HVQFN48-6x6
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm A B D SOT619-11 terminal1 index area E A A1 c detail X e1 e L 1/2 e 13 24 12 C C A B C v w b y1 C y 25 e e2 Eh 1/2 e 1 terminal1 index area
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HVQFN48:
OT619-11
MO-220
sot619-11
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN48 package SOT619-2 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout
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HVQFN48
OT619-2
OT619-2
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CIRCUIT DIAGRAM OF PHILIPS AMPLIFIER DH 892
Abstract: 5.1 5 band equalizer parameters of a fully parametric equalizer mosfet audio amplifier circuit 7 band equalizer sony stereo audio amplifiers audio limiter analog power audio amplifier circuit diagram class D class d circuit diagram schematics class d power amplifier
Text: TFA9812 BTL stereo Class-D audio amplifier with I2S input Rev. 02 — 22 January 2009 Preliminary data sheet 1. General description The TFA9812 is a high-efficiency Bridge Tied Load BTL stereo Class-D audio amplifier with a digital I2S audio input. It is available in a HVQFN48 package with exposed die
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TFA9812
TFA9812
HVQFN48
CIRCUIT DIAGRAM OF PHILIPS AMPLIFIER DH 892
5.1 5 band equalizer
parameters of a fully parametric equalizer
mosfet audio amplifier circuit
7 band equalizer
sony stereo audio amplifiers
audio limiter analog
power audio amplifier circuit diagram class D
class d circuit diagram schematics
class d power amplifier
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm B D SOT619-8 A terminal 1 index area E A A1 c detail X e1 e 1/2 e v w b 13 24 L M M C C A B C y1 C y 25 12 e e2 Eh 1/2 e 1 36 terminal 1
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HVQFN48:
OT619-8
met75
MO-220
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HVQFN48
Abstract: MO-220
Text: PDF: 2002 Oct 18 Philips Semiconductors Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm A B D SOT619-1 terminal 1 index area A E A1 c detail X C e1 1/2 e e 13 24 y y1 C v M C A B w M C
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HVQFN48:
OT619-1
MO-220
HVQFN48
MO-220
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm D SOT778-2 A B terminal 1 index area E A A1 c detail X C e1 e v w b 1/2 e 13 24 M M y1 C C A B C y L 25 12 e e2 Eh 1/2 e 1 terminal 1
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HVQFN48:
OT778-2
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN48 package SOT619-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout
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HVQFN48
OT619-1
OT619-1
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Untitled
Abstract: No abstract text available
Text: PDF: 2000 Sep 29 Philips Semiconductors Package outline HVQFN48: plastic, heatsink very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm A B D SOT619-1 terminal 1 index area A4 A E detail X e1 b e C v M B 13 y y1 C w M 24 v M A L 25 12
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HVQFN48:
OT619-1
MO-220
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B13W
Abstract: HVQFN48 Thin Quad flat package mo-220 MO-220 sot619
Text: PDF: 2001 Sep 07 Philips Semiconductors Package outline HVQFN48: plastic, heatsink very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm SOT619-3 B D D1 A terminal 1 index area A E1 A4 A1 E detail X C e1 1/2 e e y y1 C ∅v M C A B b 13
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HVQFN48:
OT619-3
MO-220
B13W
HVQFN48
Thin Quad flat package mo-220
MO-220
sot619
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm D SOT619-6 A B terminal 1 index area E A A1 c detail X e1 C e 1/2 e v w b 13 24 L M M y y1 C C A B C 25 12 e e2 Eh 1/2 e 1 36 terminal 1
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HVQFN48:
OT619-6
Pla075
MO-220
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm SOT778-5 B D A D1 terminal 1 index area E1 E A4 A A1 c detail X e1 e v w 1/2 e b 13 24 C C A B C M M y y1 C L 25 12 e e2 Eh 1/2 e 1
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HVQFN48:
OT778-5
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm D SOT778-4 A B terminal 1 index area E A A1 c detail X C e1 e v w b 1/2 e 13 24 M M y y1 C C A B C L 25 12 e e2 Eh 1/2 e 1 36 terminal 1
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HVQFN48:
OT778-4
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm D SOT778-3 A B terminal 1 index area E A A1 c detail X C e1 e v w b 1/2 e 13 24 M M y y1 C C A B C L 25 12 e e2 Eh 1/2 e 1 terminal 1
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HVQFN48:
OT778-3
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CIRCUIT DIAGRAM OF PHILIPS AMPLIFIER DH 892
Abstract: 5.1 5 band equalizer dual audio amplifier circuit diagram 7 band equalizer class d circuit diagram schematics class d power amplifier design and implementation of class D audio amplifier sony stereo audio amplifiers rms audio amplifier circuit diagram 5.1 audio amplifier board
Text: TFA9812 BTL stereo Class-D audio amplifier with I2S input Rev. 01 — 30 October 2008 Preliminary data sheet 1. General description The TFA9812 is a high-efficiency Bridge Tied Load BTL stereo Class-D audio amplifier with a digital I2S audio input. It is available in a HVQFN48 package with exposed die
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TFA9812
TFA9812
HVQFN48
CIRCUIT DIAGRAM OF PHILIPS AMPLIFIER DH 892
5.1 5 band equalizer
dual audio amplifier circuit diagram
7 band equalizer
class d circuit diagram schematics
class d power amplifier
design and implementation of class D audio amplifier
sony stereo audio amplifiers
rms audio amplifier circuit diagram
5.1 audio amplifier board
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HVQFN48
Abstract: sot778
Text: PDF: 2004 Feb 16 Philips Semiconductors Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm A B D SOT778-2 terminal 1 index area E A A1 c detail X C e1 e v w b 1/2 e 13 M M y y1 C C A B
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HVQFN48:
OT778-2
HVQFN48
sot778
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HVQFN48
Abstract: No abstract text available
Text: PDF: 2004 Feb 11 Philips Semiconductors Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm A B D SOT778-1 terminal 1 index area E A A1 c detail X C e1 e v w b 1/2 e 13 M M y y1 C C A B
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HVQFN48:
OT778-1
HVQFN48
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HVQFN48
Abstract: Thin Quad flat package mo-220 MO-220 sot619
Text: PDF: 2001 Aug 14 Philips Semiconductors Package outline HVQFN48: plastic, heatsink very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm A B D SOT619-1 terminal 1 index area A A4 E detail X C e1 1/2 e e 13 y y1 C ∅v M C A B b ∅w M C
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HVQFN48:
OT619-1
MO-220
HVQFN48
Thin Quad flat package mo-220
MO-220
sot619
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