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    Abstract: Peters Lackwerke Kern mikroelektronik Berlin Hartmann mais MIKROELEKTRONIK Frankfurt
    Text: VDE/VDI-SCHULUNGSBLÄTTER FÜR DIE LEITERPLATTENFERTIGUNG Dank an die Autoren VDE/VDI 3711 Seite 1 Dank an die Autoren Die Berufe in der Leiterplattenfertigung werden mit der technologischen Weiterentwicklung anspruchsvoller und die Mitarbeiter, die diese Berufe ausfüllen müssen diesem Anspruch


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    IMCS 700

    Abstract: No abstract text available
    Text: STRATEGIES TO MITIGATE THE TIN WHISKER PHENOMENON Patrick Lavery, Principal Process Engineer, Vicor Corporation The tin whisker phenomenon is a failure mode associated with all electronic devices that use a number of low melting point elements e.g., Sn, Cd, In in operations such as


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    C18070

    Abstract: Atotech c14415 Cu6Sn5 C18090 olin 194 Olin-194 CuCrSiTi Cu3Sn FeNi42
    Text: Whisker Formation on Tin Plated Cu based Leadframes Results and Conclusion 29 October 2004 Content • • • • • Introduction Experience E4 Main cause whisker growth on Cu LF Countermeasures Conclusions Introduction Period of potential whisker growth


    Original     		PDF FeNi42 ST-150 ST-200 150oC C18070 Atotech c14415 Cu6Sn5 C18090 olin 194 Olin-194 CuCrSiTi Cu3Sn