AN10896
Abstract: finger print sensor pcb with circuit Mounting and Soldering of RF transistors heller 1700 ipc 610D JEDEC J-STD-020d Moisture/Reflow sensitivity HVQFN48 J-STD-020D bga rework graphite thermal spreader
Text: AN10896 Mounting and Soldering of RF transistors Rev. 01 — 17 May 2010 Application note Document information Info Content Keywords Surface mount, reflow soldering, bolt down Abstract This application note provides bolt down and soldering guidelines for NXP’s RF transistor packages
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AN10896
AN10896
finger print sensor pcb with circuit
Mounting and Soldering of RF transistors
heller 1700
ipc 610D
JEDEC J-STD-020d Moisture/Reflow sensitivity
HVQFN48
J-STD-020D
bga rework
graphite thermal spreader
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FLUX TYPE ROL0
Abstract: ALLOY leadframe C7025 ST-300 C7025 strip specification smd EDL 63 ST-50 adrian borg 10X10 C151 C194
Text: The Qualification of a Pure Tin Plating Process as a Lead Free Finish for I.C. Packaging Joseph Gauci, Adrian-Michael Borg and Robert Caruana, ST Microelectronics, Malta Keith Whitlaw and Jeff Crosby, Rohm and Haas Electronic Materials, Coventry, UK Abstract
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ST-300
Workshop/54th
FLUX TYPE ROL0
ALLOY leadframe C7025
C7025 strip specification
smd EDL 63
ST-50
adrian borg
10X10
C151
C194
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Infineon diffusion solder
Abstract: Cu6Sn5 C1870 equivalent transistor of C1870 Olin-194 C70250 C19400 C14415 F-38019 OLIN194
Text: Tin Whiskers on Lead-free Platings P.J.T.L. Oberndorff1, M. Dittes2, L. Petit3, C.C. Chen4, J. Klerk1 and E.E. de Kluizenaar1 Philips, Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 1000944, D-93009 Regensburg, Germany, marc.dittes@infineon .com
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D-93009
F-38019
Infineon diffusion solder
Cu6Sn5
C1870
equivalent transistor of C1870
Olin-194
C70250
C19400
C14415
OLIN194
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DE-AC03-76SF00098
Abstract: Cu3Sn sncu0.7 Cu6Sn5 Ortec Cu6Sn5 formation whisker Cu base b110c
Text: Structure and Kinetics of Sn Whisker Growth on Pb-free Solder Finish *W. J. Choi, T. Y Lee, and K. N. Tu Dept. of Materials Science and Engineering, UCLA, Los Angeles, CA 90095-1595 N. Tamura, R. S. Celestre, and A. A. MacDowell Advanced Light Source, LBNL, Berkeley, CA 94720
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ALLOY leadframe C7025
Abstract: ALLOY leadframe C7025 material property C19400 leadframe materials C18070 leadframe C7025 Cu6Sn5 MF202 C7025 c14415
Text: Whisker Testing: Reality or Fiction? P. Oberndorff 1, M. Dittes2, P. Crema 3 1 Philips Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 100944, D-93009 Regensburg, Germany,
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D-93009
ALLOY leadframe C7025
ALLOY leadframe C7025 material property
C19400
leadframe materials
C18070
leadframe C7025
Cu6Sn5
MF202
C7025
c14415
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DE-AC03-76SF00098
Abstract: Cu3Sn Cu6Sn5 sncu0.7
Text: Structure and Kinetics of Sn Whisker Growth on Pb-free Solder Finish *W. J. Choi, T. Y Lee, and K. N. Tu Dept. of Materials Science and Engineering, UCLA, Los Angeles, CA 90095-1595 N. Tamura, R. S. Celestre, and A. A. MacDowell Advanced Light Source, LBNL, Berkeley, CA 94720
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induction cooker fault finding diagrams
Abstract: induction cooker schematic diagram th 20594 JEDEC JESD22-B116 free datasheet transistor said horizontal tt 2222 8 PIN DIL 20594 JEDEC JESD22-B109 JESD22-B108A schematic diagram induction cooker induction cooker coil design
Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
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REJ27L0001-0101
induction cooker fault finding diagrams
induction cooker schematic diagram
th 20594
JEDEC JESD22-B116 free
datasheet transistor said horizontal tt 2222
8 PIN DIL 20594
JEDEC JESD22-B109
JESD22-B108A
schematic diagram induction cooker
induction cooker coil design
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AN10365
Abstract: ipc 610D Cu3Sn JEDEC J-STD-033b.1 SSOP20 LAND PATTERN JEDEC J-STD-033b J-STD-033b.1 Cu6Sn5 ipc 610 non-wetting Solder Paste, Indium, Type 3
Text: AN10365 Surface mount reflow soldering description Rev. 04 — 13 August 2009 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling Abstract This application note provides guidelines for the board mounting and
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AN10365
AN10365
ipc 610D
Cu3Sn
JEDEC J-STD-033b.1
SSOP20 LAND PATTERN
JEDEC J-STD-033b
J-STD-033b.1
Cu6Sn5
ipc 610 non-wetting
Solder Paste, Indium, Type 3
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Lead Free reflow soldering profile BGA
Abstract: AN10365 HVQFN48 SSOP20 Solder Paste, Indium, Type 3 Cu3Sn philips pb-free products
Text: AN10365 Surface mount reflow soldering description Rev. 01 — 24 May 2005 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.
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AN10365
AN10365
Lead Free reflow soldering profile BGA
HVQFN48
SSOP20
Solder Paste, Indium, Type 3
Cu3Sn
philips pb-free products
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C18070
Abstract: Atotech c14415 Cu6Sn5 C18090 olin 194 Olin-194 CuCrSiTi Cu3Sn FeNi42
Text: Whisker Formation on Tin Plated Cu based Leadframes Results and Conclusion 29 October 2004 Content • • • • • Introduction Experience E4 Main cause whisker growth on Cu LF Countermeasures Conclusions Introduction Period of potential whisker growth
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FeNi42
ST-150
ST-200
150oC
C18070
Atotech
c14415
Cu6Sn5
C18090
olin 194
Olin-194
CuCrSiTi
Cu3Sn
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Cu3Sn
Abstract: HVQFN48 J-STD-020D SSOP20 Cu6Sn5 Solder Paste, Indium 5.1, Type 3 AN10365
Text: AN10365 Surface mount reflow soldering description Rev. 03 — 22 April 2008 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.
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AN10365
AN10365
Cu3Sn
HVQFN48
J-STD-020D
SSOP20
Cu6Sn5
Solder Paste, Indium 5.1, Type 3
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GE4F
Abstract: UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00
Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written
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C10535EJ9V0IF00
GE4F
UPD65013
74022a
SMD BGA 672 DRAWING
ULF-210R
TRANSISTOR SMD MARKING CODE 352
UPD7514
UPC451G2
smd TRANSISTOR code YW
UPD74HC00
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Untitled
Abstract: No abstract text available
Text: AN11183 Mounting and soldering of RF transistors in over-molded plastic packages Rev. 1 — 6 November 2012 Application note Document information Info Content Keywords Over-Molded Plastic OMP packages, heat sink, footprint, surface mount, reflow soldering, component handling, exposed heat spreader, SMDP,
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AN11183
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Cu6Sn5
Abstract: 22A121 AN2035 Cu3Sn an2035 st Cu6Sn5 surface energy 176L FeNi42 SO36L
Text: AN2035 Application note Control of whisker growth in Tin alloy coatings 1 Nature of whiskers and whisker mitigation techniques Some metals show an unusual metallurgical phenomenon: a single, microscopic crystal filament of the metal grows “spontaneously” from its surface. The metals concerned include
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AN2035
Cu6Sn5
22A121
AN2035
Cu3Sn
an2035 st
Cu6Sn5 surface energy
176L
FeNi42
SO36L
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Cu3Sn
Abstract: ipc 610 non-wetting
Text: AN10365 Surface mount reflow soldering Rev. 6 — 30 July 2012 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling Abstract This application note provides guidelines for the board mounting and handling of NXP semiconductor packages.
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AN10365
Cu3Sn
ipc 610 non-wetting
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AN10896
Abstract: No abstract text available
Text: AN10896 Mounting and Soldering of RF transistors Rev. 2 — 13 Nov 2012 Application note Document information Info Content Keywords Surface mount, reflow soldering, bolt down Abstract This application note provides bolt down and soldering guidelines for NXP’s RF transistor packages
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AN10896
AN10896
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M9627
Abstract: uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire
Text: SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL 1989 Document No. C10535EJ8V0IF00 8th edition Date Published February 1997 N Printed in Japan No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
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C10535EJ8V0IF00
M9627
uPC451g
SMD 6PIN IC MARKING CODE
PR-53365
NIHON SMD MARKING codes
sealed relay ge mil 7451
UPD65013
smd code marking NEC g
GE4F
tanaka AL wire
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marking code SMD Transistor 2ak
Abstract: smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste
Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written
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C10535EJ9V0IF00
marking code SMD Transistor 2ak
smd code marking NEC g
TRANSISTOR SMD MARKING CODE 3401
transistor 5dx smd
fairy liquid
marking code AE SMD Transistor
UPD65013
1.6/SmD TRANSISTOR av
Ultrasonic humidifier circuit
koki solder paste
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