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    Hammond Manufacturing C18070E-3

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    Hammond Manufacturing C18070E-1

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    Hammond Manufacturing C18070E-2

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    C18070 Datasheets Context Search

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    ALLOY leadframe C7025

    Abstract: ALLOY leadframe C7025 material property C19400 leadframe materials C18070 leadframe C7025 Cu6Sn5 MF202 C7025 c14415
    Text: Whisker Testing: Reality or Fiction? P. Oberndorff 1, M. Dittes2, P. Crema 3 1 Philips Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 100944, D-93009 Regensburg, Germany,


    Original     		PDF D-93009 ALLOY leadframe C7025 ALLOY leadframe C7025 material property C19400 leadframe materials C18070 leadframe C7025 Cu6Sn5 MF202 C7025 c14415

    FeNi42

    Abstract: C18070 LF-304 53RD J-STD-004 leadframe materials CuCrSiTi FeNi42-leadframe lf304 Cu6Sn5
    Text: Whisker Root Cause and Respective Test Conditions Dittes, M*.; Oberndorff, P*.; Crema, P.* *Infineon Technologies, * Philips CFT, * STMicroelectronics marc.dittes@infineon.com pascal.oberndorff@philips.com paolo.crema@st.com Abstract Electroplated Tin on leadframe components is the leadfree alternative to SnPb plating of widest use worldwide.


    Original     		PDF LF-304, FeNi42 C18070 LF-304 53RD J-STD-004 leadframe materials CuCrSiTi FeNi42-leadframe lf304 Cu6Sn5

    C18070

    Abstract: Atotech c14415 Cu6Sn5 C18090 olin 194 Olin-194 CuCrSiTi Cu3Sn FeNi42
    Text: Whisker Formation on Tin Plated Cu based Leadframes Results and Conclusion 29 October 2004 Content • • • • • Introduction Experience E4 Main cause whisker growth on Cu LF Countermeasures Conclusions Introduction Period of potential whisker growth


    Original     		PDF FeNi42 ST-150 ST-200 150oC C18070 Atotech c14415 Cu6Sn5 C18090 olin 194 Olin-194 CuCrSiTi Cu3Sn

    Untitled

    Abstract: No abstract text available
    Text: REV RoHS COMPLIANT 592-0002F ECN NO REVISIONS A Part Numbers with the "F" suffix ending are RoHS Compliant. Packaging is marked with "RoHS Compliant" label or equivalent markings. These parts can be used with RoHS reflow profile. Parts can be wave soldered, dip soldered or hand soldered


    Original     		PDF 592-0002F 592-0002F. C-18070

    C18070

    Abstract: C1807 smema C70250 FeNi42 Cu6Sn5 CuCrSiTi Infineon diffusion solder C19400 C1441
    Text: Tin Whisker Formation – Results, Test Methods and Countermeasures Dittes, M*.; Oberndorff, P*.; Petit, L.* *Infineon Technologies, * Philips CFT, * STMicroelectronics marc.dittes@infineon.com pascal.oberndorff@philips.com luc.petit@st.com Abstract


    Original     		PDF