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    PACKAGE TRAY DIMENSION Search Results

    PACKAGE TRAY DIMENSION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGE TRAY DIMENSION Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    JEDEC TRAY DIMENSIONS

    Abstract: JEDEC tray standard JEDEC tray standard 13 tsop Shipping Trays 32 jedec tray Shipping Trays jedec tray 32 0925D
    Text: TRAY SPECIFICATIONS 32-pin TSOP-I Package Tray Critical Dimensions TEMP. RATING A B NOTES: 1. Surface electric resistivity of tray ranges from: < 1E+7 Ohm/sq. 2. The molded tray’s material shall be rigid enough to avoid damage to the components during handling, loading,


    Original     		32-pin 865495TG5 T944G 545-FRAM, JEDEC TRAY DIMENSIONS JEDEC tray standard JEDEC tray standard 13 tsop Shipping Trays 32 jedec tray Shipping Trays jedec tray 32 0925D PDF

    JEDEC TRAY DIMENSIONS

    Abstract: JEDEC tray standard tsop Shipping Trays tsop-ii tray RAMTRON T944
    Text: TRAY SPECIFICATIONS 44-pin TSOP-II Package Tray Critical Dimensions A B NOTES: 1. Surface electric resistivity of tray ranges from: 1E+5 to 1E+12 Ohm/sq. 2. The molded tray’s material shall be rigid enough to avoid damage to the components during handling, loading,


    Original     		44-pin 865495TG5 T944G 545-FRAM, JEDEC TRAY DIMENSIONS JEDEC tray standard tsop Shipping Trays tsop-ii tray RAMTRON T944 PDF

    TRAY DIMENSIONS

    Abstract: QFP44-A1 QFP64-G1 Hard Tray Dimensions QFP44-A1 QFP 14 14 tray
    Text: TRAY DIMENSIONS 4. TRAY DIMENSIONS Tray dimensions for QFP package are shown in below. 1 Hard Tray Dimensions for QFP44-A1 42- Ø5.0 3.4 2- R2.5 3- R1.5 A 3.4 B ±0.1 x4=100 B' ±0.1 20.0 228.0 17.9 3.4 C5 23.9 20.0 135.8 25.0 A' 113.6 ±0.1 ±0.1 13.9


    Original     		QFP44-A1 50pcs QFP64-G1 TRAY DIMENSIONS QFP44-A1 QFP64-G1 Hard Tray Dimensions QFP44-A1 QFP 14 14 tray PDF

    Kostat tray

    Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
    Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher


    Original     		and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13 PDF

    ADV0505

    Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
    Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The


    Original     		ADV0505 and14 12C-0707-E19 12F-1111-119 1F3-1313-D19 1F1-1717-A19 12U-1919-G19 12Y-2323-919 12Y-3333-419 12Y-3535-419 ADV0505 FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7 PDF

    ROADM

    Abstract: ROADM JDSU Polatis EIA-526-14A rs232 protocol
    Text: Reconfigurable VOA & Power Meter Switch Tray VST Reconfigurable VOA & Power Meter Switch Tray The Polatis VST family of products offers an ideal integration of optical switching, attenuation and power monitoring in a single, compact package. This class of switch is unique to


    Original     		16x16 PROD-414-02-0-S ROADM ROADM JDSU Polatis EIA-526-14A rs232 protocol PDF

    13x13

    Abstract: nec 13A JEDEC tray standard SSD-A-H7551-1 FBGA13x13A JEDEC TRAY 10 X 10 TRAY DIMENSIONS JEDEC TRAY DIMENSIONS
    Text: TRAY CONTAINER UNIT : mm 8x19=152 135.9 112.0 PPE A A 11.95 13.50 16.00 135°CMAX NEC FBGA13×13A 16.15 13.50 290.7 315.0 322.6 12.15 <SECTION A-A> 13.5±0.05 (6.03) 7.62 5.62 13.00 Applied Package Quantity(pcs) 144-pin Plastic FBGA(13x13) Tray Material


    Original     		FBGA13 144-pin 13x13) 152MAX. 456-pin FBGA13x13A SSD-A-H7551-1 13x13 nec 13A JEDEC tray standard SSD-A-H7551-1 FBGA13x13A JEDEC TRAY 10 X 10 TRAY DIMENSIONS JEDEC TRAY DIMENSIONS PDF

    ROADM

    Abstract: ROADM JDSU Polatis rs232 protocol
    Text: VOA & Power Meter Switch Tray VST VOA & Power Meter Switch Tray The Polatis VST family of products offers an ideal integration of optical switching, attenuation and power monitoring in a single, compact package. This class of switch is unique to Polatis and delivers significant cost savings for a highly


    Original     		PDF

    nec 2565

    Abstract: NEC C 324 C 2565 nec nec 1026 JEDEC TRAY DIMENSIONS BGA package tray tray bga
    Text: TRAY CONTAINER 135°C MAX 19.65 NEC 102.6 A' 16.65 25.65 FBGA 19x19A A 19.65 22.00 286.0 14.50 315.0 322.6 SECTION A-A' (5.62) (5.80) 19.65 19.00 7.62 135.9 PPE 5×14=70 UNIT : mm Applied Package Quantity (pcs) 324-pin Plastic BGA (19×19) 70 MAX. Tray


    Original     		324-pin BGA19 SSD-A-H7599 nec 2565 NEC C 324 C 2565 nec nec 1026 JEDEC TRAY DIMENSIONS BGA package tray tray bga PDF

    FBGA16

    Abstract: 393 NEC
    Text: TRAY CONTAINER UNIT : mm 6x16=96 135°C MAX. 19.20 16.30 7 NEC 107.0 21.40 FBGA16×16ESP A' 14.45 16.30 13.50 288.0 315.0 322.6 Section A – A' 16.30 (5.62) (6.09) 16.00 7.62 135.9 PPE A Applied Package Quantity (pcs) Tray FBGA16×16ESP 224-pin Plastic FBGA (16×16)


    Original     		FBGA16 16ESP 224-pin 240-pin 241-pin 303-pin 393-pin 697-pin 393 NEC PDF

    676 BGA package tray

    Abstract: BGA package tray NEC 2415 tray bga 676-Pin 596-PIN 27ES jedec tray BGA tray datasheet bga BGA JEDEC tray
    Text: TRAY CONTAINER UNIT : mm 4x10=40 NEC 7 135°C MAX. 27.50 29.20 262.8 315.0 322.6 26.10 Section A – A' 27.50 27.00 (5.95) (6.35) 7.62 27.50 29.20 87.6 BGA27×27ESP A' 24.15 135.9 PPE A Applied Package Quantity (pcs) Tray BGA27×27ESP 225-pin Plastic BGA (27×27)


    Original     		BGA27 27ESP 225-pin 256-pin 272-pin 316-pin 320-pin 352-pin 676 BGA package tray BGA package tray NEC 2415 tray bga 676-Pin 596-PIN 27ES jedec tray BGA tray datasheet bga BGA JEDEC tray PDF

    fBGA package tray

    Abstract: JEDEC FBGA FBGA tray JEDEC TRAY DIMENSIONS FBGA NEC 208pin FBGA JEDEC tray JEDEC tray standard
    Text: TRAY CONTAINER 110.1 A A' 7 135°C MAX 15.74 18.35 FBGA15x15ESP 12.90 NEC 135.9 PPE 7×17=119 Unit : mm 15.74 18.10 289.6 12.70 315.0 322.6 SECTION A – A' 15.74 (5.91) 5.62 7.62 15.00 Applied Package Quantity(PCS) Tray FBGA 15×15ESP 176-pin PLASTIC FBGA (15×15)


    Original     		FBGA15 15ESP 176-pin 208-pin 273-pin 362-pin 385-pin SSD-A-H7025-3 fBGA package tray JEDEC FBGA FBGA tray JEDEC TRAY DIMENSIONS FBGA NEC 208pin FBGA JEDEC tray JEDEC tray standard PDF

    fBGA package tray 12

    Abstract: JEDEC TRAY DIMENSIONS FBGA JEDEC FBGA 236-PIN fBGA package tray FBGA-10 FBGA10 236PIN 277-PIN
    Text: TRAY CONTAINER NEC A' 10.65 7 135°C MAX. 12.80 A FBGA10x10ESP 10.35 135.9 115.2 PPE 10×24=240 UNIT : mm 10.65 12.80 10.30 294.4 315.0 322.6 SECTION A – A' 10.65 (5.95) (5.62) 7.62 10.00 Applied Package Quantity (pcs) FBGA10×10 ESP Tray 113-pin Plastic FBGA (10×10)


    Original     		FBGA10 10ESP 113-pin 161-pin 236-pin 277-pin 289-pin SSD-A-H6961-4 fBGA package tray 12 JEDEC TRAY DIMENSIONS FBGA JEDEC FBGA fBGA package tray FBGA-10 236PIN PDF

    fBGA package tray

    Abstract: No abstract text available
    Text: TRAY CONTAINER NEC 119.6 7 FBGA8x6ESP 135°C MAX. A' 6.50 9.20 A 8.50 10.60 296.8 9.10 315.0 322.6 8.50 8.00 (5.62) (5.91) Section A – A' 7.62 8.15 135.9 PPE 14×29=406 UNIT : mm Applied Package 48-pin Plastic FBGA (8×6) Quantity (pcs) 406 MAX. Tray


    Original     		48-pin SSD-A-H7792 fBGA package tray PDF

    H7665

    Abstract: SOP package tray SSOP36 SOP JEDEC tray H7665 DATA SHEET JEDEC TRAY DIMENSIONS JEDEC tray standard 490
    Text: TRAY CONTAINER UNIT : mm 120.9 14 x 35=490 135° C MAX. 3.9 8.85 7.05 6.8 NEC A' 9.30 7.50 SSOP3.6 × 4.4A 135.9 PPE A 300.9 315.0 322.6 SECTION A-A' 5.92 6.35 7.62 3.90 Applied Package 10-pin Plastic Shrink SOP Quantity (pcs) 490 MAX. Tray SSOP3.6×4.4A


    Original     		10-pin SSD-A-H7665 H7665 SOP package tray SSOP36 SOP JEDEC tray H7665 DATA SHEET JEDEC TRAY DIMENSIONS JEDEC tray standard 490 PDF

    QFP JEDEC tray

    Abstract: JEDEC TRAY QFP QFP 14 14 tray SSD-A-H5899-1 QFp Package tray JEDEC tray standard
    Text: TRAY CONTAINER 105.0 150°C MAX A' 27.00 18.6 21.00 MQFP 14x20 2.7mm A 15.45 24.6 22.50 270.0 315.0 322.6 SECTION A – A' 24.6 Applied Package 4.82 6.35 19.6 7.62 135.9 UNIT : mm Quantity (pcs) MQFP 14 × 20 2.7mm Tray Carbon PPE 64-pin Plastic QFP (2.7mm thick)


    Original     		64-pin 80-pin 100-pin SSD-A-H5899-1 QFP JEDEC tray JEDEC TRAY QFP QFP 14 14 tray SSD-A-H5899-1 QFp Package tray JEDEC tray standard PDF

    84 FBGA

    Abstract: JEDEC FBGA 141-PIN tray fbga 84
    Text: TRAY CONTAINER NEC 135.9 119.6 PPE 14x35=490 UNIT : mm 135°C MAX. 7 FBGA 6×6ESP A' 6.50 8.15 9.20 A 6.50 8.80 299.2 7.90 315.0 322.6 Section A – A' 6.50 (6.16) (5.62) 7.62 6.00 Applied Package Quantity (pcs) Tray FBGA 6×6 ESP 64-pin Plastic FBGA (6×6)


    Original     		64-pin 65-pin 84-pin 85-pin 97-pin 141-pin SSD-A-H7453-3 84 FBGA JEDEC FBGA tray fbga 84 PDF

    JEDEC qfn tray

    Abstract: QFn Package tray JEDEC tray standard 13 QFN tray JEDEC TRAY QFN Package tray JEDEC TRAY DIMENSIONS QFN QFN JEDEC TRAY JEDEC tray standard JEDEC TRAY DIMENSIONS
    Text: TRAY CONTAINER A' 7.39 10.00 7.50 7.39 A 135° C MAX. 10.10 7.35 QFN7x7B NEC 121.2 135.9 PPE 13 × 31=403 UNIT : mm 300.0 315.0 322.6 SECTION A-A' 5.92 6.35 7.62 7.39 Applied Package Quantity (pcs) 48-pin Plastic WQFN (7×7) 403 MAX. Tray QFN 7×7B Material


    Original     		48-pin SSD-A-H7741 JEDEC qfn tray QFn Package tray JEDEC tray standard 13 QFN tray JEDEC TRAY QFN Package tray JEDEC TRAY DIMENSIONS QFN QFN JEDEC TRAY JEDEC tray standard JEDEC TRAY DIMENSIONS PDF

    JEDEC FBGA

    Abstract: 624-Pin JEDEC TRAY DIMENSIONS FBGA
    Text: TRAY CONTAINER UNIT : mm 6x15=90 20.50 17.25 287.0 14.00 17.25 107.0 NEC 135°C MAX. A' 14.45 21.40 FBGA17×17A-1 315.0 322.6 Section A – A' 17.25 (5.62) (6.05) 17.00 7.62 135.9 PPE A Applied Package Quantity (pcs) Tray FBGA 17×17A-1 281-pin Plastic FBGA (17×17)


    Original     		FBGA17 281-pin 305-pin 433-pin 624-pin 865-pin SSD-A-H7277-4 JEDEC FBGA JEDEC TRAY DIMENSIONS FBGA PDF

    JEDEC FBGA

    Abstract: FBGA-12 JEDEC TRAY DIMENSIONS FBGA fBGA package tray
    Text: TRAY CONTAINER UNIT : mm 8x20=160 NEC 114.8 135.9 PPE 12.30 7 A' 135°C MAX. 16.40 10.55 FBGA12×12ESP-1 A 12.30 15.50 294.5 10.25 315.0 322.6 SECTION A – A' (6.29) (6.35) 7.62 12.30 12.00 Applied Package Quantity (pcs) FBGA 12×12ESP-1 Tray 121-pin Plastic FBGA (12×12)


    Original     		FBGA12 12ESP-1 121-pin 144-pin 160-pin 180-pin 209-pin 337-pin 397-pin JEDEC FBGA FBGA-12 JEDEC TRAY DIMENSIONS FBGA fBGA package tray PDF

    MOLEX mxj 5

    Abstract: SD Card Package tray 709 P mxj 13 MOLEX
    Text: CIRCUIT No. 2 M > — 2.95 CIRCUIT No. - /3XCL05MAXO, „0.IMAX. A - A ÏCALEs 5- □ REAR-NAIL CIRCUIT NOo SEMI-HARD TRAY PACKAGE SORT TRAY RACKAGR PACKING TRAY FORM q;- FINISH f t ± \1 _ i LU u or x n WIRE RANGE a s m 15 E INS. RANGE ÎS S ^S SEE NC DIMENSIONS:


    OCR Scan     		/3XCL05MAXO, SD-55365-003 EN-02J MXJ-54 MOLEX mxj 5 SD Card Package tray 709 P mxj 13 MOLEX PDF

    Untitled

    Abstract: No abstract text available
    Text: _LL PACKAGING TRAY-STANDARD PACKAGE 1000 TAPE AND REEL 54.00 50.2 42.545 - TRAY-STANDARD PACKAGE 200 H— .635 67X 2.9 .280 — |f-~ (68X) A II TAPE AND REEL 14.9 Propriete <te B£RC ELECTRONICS. Droits de reproduction BERG ELECTRONICS INC.


    OCR Scan     		PDF

    tin cad plating

    Abstract: J 5027 R
    Text: Ln C IR CU IT m in rn in in n LJ . 0 . IMAX. Ì3 \ 0 . 0 5 M A X . , A - A NAIL REAR-N A IL 16.29 .6 9 ?4 .6 9 5 E M I- H A R D SOFT TRAY TRAY P A C K IN G PACKAGE PACKAGE TRAY 5 5 5 5 9 - 5 0 2 7 55559-5029 FORM M A TER IA L D IM E N S IO N S : SHEET


    OCR Scan     		70lerances 30OVER WB3/22 55359-5B29 10LEX SD-55359-0I5. SD-55359-0I5 EN-02J tin cad plating J 5027 R PDF

    vqfp100 package

    Abstract: S2P24 BA4558F-T1
    Text: Packaging Packaging type Package DIP/SDIP Tube SIP/HSIP/ZtP/SZIP Tube Packaging code Tube SOP/SSOP/HSOP QFP/SQFP/VQFP Paper taping T l, T2 Difference in taping direction Embossed taping E1, E2 (Difference in taping direction) Tray VP Tray (dry pack) FTR/TO-92/TO-220/TO-220FP


    OCR Scan     		FTR/TO-92/TO-220/TO-220FP vqfp100 package S2P24 BA4558F-T1 PDF