fBGA package tray
Abstract: JEDEC FBGA FBGA tray JEDEC TRAY DIMENSIONS FBGA NEC 208pin FBGA JEDEC tray JEDEC tray standard
Text: TRAY CONTAINER 110.1 A A' 7 135°C MAX 15.74 18.35 FBGA15x15ESP 12.90 NEC 135.9 PPE 7×17=119 Unit : mm 15.74 18.10 289.6 12.70 315.0 322.6 SECTION A – A' 15.74 (5.91) 5.62 7.62 15.00 Applied Package Quantity(PCS) Tray FBGA 15×15ESP 176-pin PLASTIC FBGA (15×15)
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FBGA15
15ESP
176-pin
208-pin
273-pin
362-pin
385-pin
SSD-A-H7025-3
fBGA package tray
JEDEC FBGA
FBGA tray
JEDEC TRAY DIMENSIONS FBGA
NEC 208pin
FBGA JEDEC tray
JEDEC tray standard
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fBGA package tray
Abstract: fBGA package tray 12
Text: UNIT : mm 112.5 7x16=112 JAPAN 135°C MAX. 18.75 FBGA15×15×1.46 11.70 15.15 15.15 19.40 12.00 291.0 315.0 322.6 SECTION A – A' 6.32 (6.35) 15.15 7.62 135.9 NEC A' A Applied Package 176-pin Plastic FBGA ( 15) Quantity (pcs) MAX. 112 Tray Material Heat Proof Temp.
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FBGA15
176-pin
fBGA package tray
fBGA package tray 12
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TRAY DIMENSIONS
Abstract: NEC a
Text: UNIT : mm 7x16=112 135°C MAX. 18.75 15.15 15.15 19.40 12.00 291.0 315.0 322.6 SECTION A – A' 6.32 (6.35) 15.15 7.62 135.9 A' FBGA15×15×1.46 Rev2 11.70 112.5 NEC A Applied Package 176-pin • Plastic FBGA ( 15) 208-pin • Plastic FBGA ( 15) Quantity (pcs)
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FBGA15
176-pin
208-pin
TRAY DIMENSIONS
NEC a
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Achronix Semiconductor
Abstract: No abstract text available
Text: I Speedster22i HD FPGA Family DS004 Rev. 2.6 – May 8, 2014 Preliminary Highlights • • • Advanced highest-density and highest‐bandwidth FPGA • Over 1.7 million effective look‐up‐tables • Abundant embedded hard IP for communica‐
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Speedster22i
DS004
Achronix Semiconductor
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H26M* hynix
Abstract: Hynix eMMC 4.5 controller hynix emmc H26M3100 FBGA153 H26M4 FBGA169 H26M31001FPR Hynix eMMC 5.1 controller h26m5
Text: 26nm 32Gb based e-NAND product Family This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 1.1 / Apr. 2011 1 Document Title
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150ms)
512KB
220ms
247ms
262ms
H26M* hynix
Hynix eMMC 4.5 controller
hynix emmc
H26M3100
FBGA153
H26M4
FBGA169
H26M31001FPR
Hynix eMMC 5.1 controller
h26m5
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1f1-1717-a19
Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O
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60WMBG
60M/54WBGA-8
10X15
10-8X12-A
LA69-00635A
48TBGA
48-TBGA-10
0-8X16-O
LA69-00267A
ADS11981
1f1-1717-a19
153FBGA
BGA 6x6 tray
FBGA tray kostat
tray bga 6x6
169fbga-12.0x16.0-8x16-0
78BOC-11
78BOC
ePAK BGA 5x5 tray
153FBGA-9
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1 gb micro sd card
Abstract: THNS512GG8BB FBGA153 SDXC THNS128GG4BB sata ssd controller msata THNSNB062GMSJ FBGA169 THNSNB062GMCJ
Text: 製品カタログ 2010-3 東芝半導体 製品カタログ メモリ・ストレージデバイス h t t p : / / w w w. s e m i c o n . t o s h i b a . c o . j p / メモリ・ストレージデバイス メモリ・ストレージデバイス 東芝は1984年にフラッシュメモリを世界で初めて開発しその後開発したNAND型フラッシュメモリでは最先端の技術、
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512Mbit4Gbit
BCJ0092A
1 gb micro sd card
THNS512GG8BB
FBGA153
SDXC
THNS128GG4BB
sata ssd controller
msata
THNSNB062GMSJ
FBGA169
THNSNB062GMCJ
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eMMC
Abstract: 8GB eMMC SLC emmc controller emmc 4.41 32GB emmc FBGA153 emmc4.41 KE4BT4B6A FBGA169 16GB emmc
Text: KINGSTON.COM e•MMC — the perfect storage solution for mobile applications Overview Kingston’s current e•MMC product follows the JEDEC e•MMC4.41 standard. It is an ideal universal storage solution for many electronic devices, including smartphones, tablet PCs, PDAs, eBook readers, MIDs, digital cameras and recorders, MP3, MP4
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MKF-428
eMMC
8GB eMMC SLC
emmc controller
emmc 4.41
32GB emmc
FBGA153
emmc4.41
KE4BT4B6A
FBGA169
16GB emmc
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EM47FM3288SBB
Abstract: No abstract text available
Text: EM47FM3288SBB 16Gb 64Mx8Bank×32 Double DATA RATE 3 Stack SDRAM Features Description • JEDEC Standard VDD/VDDQ = 1.5V±0.075V. • All inputs and outputs are compatible with SSTL_15 interface. • Fully differential clock inputs (CK, /CK) operation. • Eight Banks
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EM47FM3288SBB
136Ball-FBGA
EM47FM3288SBB
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Untitled
Abstract: No abstract text available
Text: PRODUCT BRIEF Speedster 22i HD FPGA Platform SPEEDSTER22i HD HIGHLIGHTS • World’s most advanced FPGAs with up to: –– Half the power and half the cost of competing FPGAs –– 1.1 million programmable LUTs and 1.7 million equivalent 4-input LUTs –– 145 Mb of on-chip RAM
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SPEEDSTER22i
10/40/100G
22-nm
PB024
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Untitled
Abstract: No abstract text available
Text: 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 EM47FM3288SBB 16Gb 64Mx8Bank×32 Double DATA RATE 3 Stack SDRAM Features Description • JEDEC Standard VDD/VDDQ = 1.5V±0.075V. • All inputs and outputs are compatible with SSTL_15 interface. • Fully differential clock inputs (CK, /CK) operation.
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EM47FM3288SBB
136Ball-FBGA
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