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    FBGA13 Search Results

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    Qualcomm DK-QCC3084-VFBGA134-A-0

    DEV KIT, DK-QCC3084-VFBGA134-A-0
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    DigiKey DK-QCC3084-VFBGA134-A-0 Bulk 1
    • 1 $851.2
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    Qualcomm DK-QCC3083-VFBGA134-A-0

    DEV KIT, DK-QCC3083-VFBGA134-A-0
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    DigiKey DK-QCC3083-VFBGA134-A-0 Bulk 1
    • 1 $851.2
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    Qualcomm DB-QCC3083-VFBGA134-A-0

    DEV KIT, DB-QCC3083-VFBGA134-A-0
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    • 1 $212.8
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    Qualcomm DB-QCC3084-VFBGA134-A-0

    DEV KIT, DB-QCC3084-VFBGA134-A-0
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    DigiKey DB-QCC3084-VFBGA134-A-0 Bulk 1
    • 1 $212.8
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    FBGA13 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    FBGA 152

    Abstract: JEDEC tray standard 13 fBGA package tray JEDEC FBGA JEDEC TRAY DIMENSIONS FBGA
    Text: TRAY CONTAINER UNIT : mm 8x19=152 112.0 NEC A' 13.40 16.15 12.15 13.40 16.00 11.95 FBGA13×13ESP 135°C MAX. 135.9 PPE A 290.7 315.0 322.6 SECTION A – A' 13.40 (5.95) (5.62) 7.62 13.00 Applied Package 144-pin Plastic FBGA (13×13) 160-pin Plastic FBGA (13×13)


    Original     		PDF FBGA13 13ESP 144-pin 160-pin 161-pin 180-pin 197-pin 212-pin 225-pin 249-pin FBGA 152 JEDEC tray standard 13 fBGA package tray JEDEC FBGA JEDEC TRAY DIMENSIONS FBGA

    JEDEC tray standard 13

    Abstract: JEDEC tray standard
    Text: TRAY CONTAINER UNIT : mm 8x19=152 112.0 NEC A' 13.40 16.15 12.15 13.40 16.00 11.95 FBGA13×13ESP 135°C MAX. 135.9 PPE A 290.7 315.0 322.6 SECTION A – A' 13.40 (5.82) (5.62) 7.62 12.70 Applied Package 261-pin Plastic FLGA (12.7×12.7) Quantity (pcs) 152 MAX.


    Original     		PDF FBGA13 13ESP 261-pin SSD-A-H7576 JEDEC tray standard 13 JEDEC tray standard

    SSD-A-H7391-2

    Abstract: FBGA 152 JEDEC TRAY DIMENSIONS FBGA
    Text: TRAY CONTAINER UNIT : mm 8x19=152 112.0 NEC 135°C MAX. A' 16.15 13.40 16.00 FBGA13×13ESP 13.40 12.15 290.7 315.0 322.6 Section A – A' 13.40 (5.62) (5.82) 12.70 7.62 11.95 135.9 PPE A Applied Package Quantity (pcs) Tray FBGA 13×13 ESP 381-pin Plastic FBGA (12.7×12.7)


    Original     		PDF FBGA13 13ESP 381-pin 384-pin 481-pin 509-pin 525-pin SSD-A-H7391-2 SSD-A-H7391-2 FBGA 152 JEDEC TRAY DIMENSIONS FBGA

    13x13

    Abstract: nec 13A JEDEC tray standard SSD-A-H7551-1 FBGA13x13A JEDEC TRAY 10 X 10 TRAY DIMENSIONS JEDEC TRAY DIMENSIONS
    Text: TRAY CONTAINER UNIT : mm 8x19=152 135.9 112.0 PPE A A 11.95 13.50 16.00 135°CMAX NEC FBGA13×13A 16.15 13.50 290.7 315.0 322.6 12.15 <SECTION A-A> 13.5±0.05 (6.03) 7.62 5.62 13.00 Applied Package Quantity(pcs) 144-pin Plastic FBGA(13x13) Tray Material


    Original     		PDF FBGA13 144-pin 13x13) 152MAX. 456-pin FBGA13x13A SSD-A-H7551-1 13x13 nec 13A JEDEC tray standard SSD-A-H7551-1 FBGA13x13A JEDEC TRAY 10 X 10 TRAY DIMENSIONS JEDEC TRAY DIMENSIONS

    JEDEC tray standard 13

    Abstract: No abstract text available
    Text: UNIT : mm 7x18=126 JAPAN 112.5 A' 135°C MAX. 18.75 FBGA13×13×1.46 11.70 13.15 17.25 10.88 13.15 293.25 315.0 322.6 SECTION A – A' 13.15 6.32 6.35 7.62 135.9 NEC A Applied Package 144-pin Plastic FBGA ( 13) Quantity (pcs) MAX. 126 Tray Material Heat Proof Temp.


    Original     		PDF FBGA13 144-pin JEDEC tray standard 13

    Untitled

    Abstract: No abstract text available
    Text: 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 EM47EM3288SBA Revision History Revision 0.1 May. 2012 -First release. Revision 0.2 (Feb. 2013) -Update ZQ pins description. May. 2012 1/38 www.eorex.com 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 EM47EM3288SBA 8Gb (32Mx8Bank×32) Double DATA RATE 3 Stack SDRAM


    Original     		PDF EM47EM3288SBA 136Ball-FBGA

    RTS5158

    Abstract: northbridge G41 se u10i layout GM965 28K1 IC NS0013 sla5t bga676 rtl8010 C1087
    Text: A B C D E X'TAL 14.318MHz Merom Processor System Power Rail Management Dual-Core CLOCK GEN ICS9LPR358AGLFT uFCPGA 478 2 3,4 FSB (667/800 MHz) FSB 4 GM965/PM965 ATI M74M USB 1 LVDS ＊V ＊VS HIGH HIGH ON ON ON ON S3 (Suspend to RAM) LOW HIGH HIGH HIGH ON


    Original     		PDF 318MHz ICS9LPR358AGLFT GM965/PM965 965GM 965PM 512MB 3B817 2R1066 74U23 76U23 RTS5158 northbridge G41 se u10i layout GM965 28K1 IC NS0013 sla5t bga676 rtl8010 C1087

    Untitled

    Abstract: No abstract text available
    Text: AFE5804 SBOS442C – JUNE 2008 – REVISED OCTOBER 2011 www.ti.com FULLY-INTEGRATED, 8-CHANNEL ANALOG FRONT-END FOR ULTRASOUND 0.89nV/√Hz, 12-Bit, 40MSPS, 101mW/Channel Check for Samples: AFE5804 FEATURES DESCRIPTION • The AFE5804 is a complete analog front-end device


    Original     		PDF AFE5804 SBOS442C 89nV/â 12-Bit, 40MSPS, 101mW/Channel AFE5804 23nV/â

    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


    Original     		PDF 60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9

    EM47EM3288SBA

    Abstract: No abstract text available
    Text: EM47EM3288SBA Revision History Revision 0.1 May. 2012 -First release. Revision 0.2 (Feb. 2013) -Update ZQ pins description. Revision 0.3 (Apr. 2014) -Update tFAW. Apr. 2014 1/39 www.eorex.com EM47EM3288SBA 8Gb (32Mx8Bank×32) Double DATA RATE 3 Stack SDRAM


    Original     		PDF EM47EM3288SBA 12x14x1 136Ball-FBGA 5x14x1 EM47EM3288SBA

    128M-BIT

    Abstract: MCP market sram 128m image distribution 128-MBIT
    Text: New products MB84VZ128A Stacked MCP Mounted with 128M-bit x16 Page Mode NOR-type Dual Operation Flash Memories (2 chips), 16M-bit (×16) Mobile FCRAMTM, and 4M-bit (×16) SRAM MB84VZ128A This is an MCP with a 256M-bit ROM and 20M-bit RAM. The combined density, 276M-bit, is the world's largest density for mobile purposes.


    Original     		PDF MB84VZ128A 128M-bit 16M-bit 256M-bit 20M-bit 276M-bit, FBGA-139BGA-139P-M01 128M-BIT MCP market sram 128m image distribution 128-MBIT

    EM47EM3288MBA

    Abstract: No abstract text available
    Text: EM47EM3288MBA 8Gb 32Mx8Bank×32 Double DATA RATE 3 Stack SDRAM Features Description • VDD/VDDQ = 1.35V -0.065/+0.1V. • Backward compatible to VDD = VDDQ = 1.5V ±0.075V.Supports DDR3L devices to be backward compatible in 1.5V applications. • Fully differential clock inputs (CK, /CK) operation.


    Original     		PDF EM47EM3288MBA 136Ball-FBGA EM47EM3288MBA

    EM47FM3288SBB

    Abstract: No abstract text available
    Text: EM47FM3288SBB 16Gb 64Mx8Bank×32 Double DATA RATE 3 Stack SDRAM Features Description • JEDEC Standard VDD/VDDQ = 1.5V±0.075V. • All inputs and outputs are compatible with SSTL_15 interface. • Fully differential clock inputs (CK, /CK) operation. • Eight Banks


    Original     		PDF EM47FM3288SBB 136Ball-FBGA EM47FM3288SBB

    H2JTDG8UD2MBR

    Abstract: H26M42003GMR H26M31003GMR H26M52002EQR H26M64002DQR H26M78003BFR H26M3100 H26M52002CKR H26M21001FPR H26M* hynix
    Text: Page 1 Product Tech Density Block Size Stack Vcc/ Org Package Availability HY27US08281A 9xnm class 128Mb 16KB SDP 3.3v/ X8 TSOP Now HY27US08561A 9xnm class 256Mb 16KB SDP 3.3v/ X8 TSOP/ FBGA Now H27U518S2C 5xnm class 512Mb 16KB SDP 3.3v/ X8 TSOP/ LGA Now H27U1G8F2B


    Original     		PDF HY27US08281A 128Mb HY27US08561A 256Mb H27U518S2C 512Mb H27U1G8F2B 128KB H27S1G8F2B H2JTDG8UD2MBR H26M42003GMR H26M31003GMR H26M52002EQR H26M64002DQR H26M78003BFR H26M3100 H26M52002CKR H26M21001FPR H26M* hynix

    C1470 LM

    Abstract: se u10i layout RTS5158 bga676 zd801 RTL8101E-GR PM965 hy5rs123235b W651DI R1287
    Text: A B C D E X'TAL 14.318MHz Merom Processor System Power Rail Management Dual-Core CLOCK GEN ICS9LPR358AGLFT uFCPGA 478 2 3,4 FSB (667/800 MHz) FSB 4 PM965 ATI M74M USB 1 LVDS ＊V ＊VS HIGH HIGH ON ON ON ON S3 (Suspend to RAM) LOW HIGH HIGH HIGH ON ON OFF


    Original     		PDF 318MHz ICS9LPR358AGLFT PM965 965GM 965PM 512MB 703ms W651DI 40GAB2030-FXXX 40GAB1700-FXXX C1470 LM se u10i layout RTS5158 bga676 zd801 RTL8101E-GR PM965 hy5rs123235b W651DI R1287