CDA 194
Abstract: jedec mo-142 footprint jedec ms-024 D2863-77 leadframe C7025 ALJ- 1300 footprint WSON leadframe Cu C7025 MO-052 MO-108
Text: Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Flammability Rating Oxygen Index Fine-Pitch Ball Grid Array Leadframe Packages Packages and Packing Methodologies Handbook 17 Oct 2008 2-1 Chapter 2 Package Design FLAMMABILITY RATING The UL Rating for all Spansion products is 94 V-0.
|
Original
|
D2863-77,
CDA 194
jedec mo-142 footprint
jedec ms-024
D2863-77
leadframe C7025
ALJ- 1300
footprint WSON
leadframe Cu C7025
MO-052
MO-108
|
PDF
|
ALLOY leadframe C7025
Abstract: ALLOY leadframe C7025 material property C19400 leadframe materials C18070 leadframe C7025 Cu6Sn5 MF202 C7025 c14415
Text: Whisker Testing: Reality or Fiction? P. Oberndorff 1, M. Dittes2, P. Crema 3 1 Philips Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 100944, D-93009 Regensburg, Germany,
|
Original
|
D-93009
ALLOY leadframe C7025
ALLOY leadframe C7025 material property
C19400
leadframe materials
C18070
leadframe C7025
Cu6Sn5
MF202
C7025
c14415
|
PDF
|
C18070
Abstract: Atotech c14415 Cu6Sn5 C18090 olin 194 Olin-194 CuCrSiTi Cu3Sn FeNi42
Text: Whisker Formation on Tin Plated Cu based Leadframes Results and Conclusion 29 October 2004 Content • • • • • Introduction Experience E4 Main cause whisker growth on Cu LF Countermeasures Conclusions Introduction Period of potential whisker growth
|
Original
|
FeNi42
ST-150
ST-200
150oC
C18070
Atotech
c14415
Cu6Sn5
C18090
olin 194
Olin-194
CuCrSiTi
Cu3Sn
|
PDF
|
Infineon diffusion solder
Abstract: Cu6Sn5 C1870 equivalent transistor of C1870 Olin-194 C70250 C19400 C14415 F-38019 OLIN194
Text: Tin Whiskers on Lead-free Platings P.J.T.L. Oberndorff1, M. Dittes2, L. Petit3, C.C. Chen4, J. Klerk1 and E.E. de Kluizenaar1 Philips, Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 1000944, D-93009 Regensburg, Germany, marc.dittes@infineon .com
|
Original
|
D-93009
F-38019
Infineon diffusion solder
Cu6Sn5
C1870
equivalent transistor of C1870
Olin-194
C70250
C19400
C14415
OLIN194
|
PDF
|
C18070
Abstract: C1807 smema C70250 FeNi42 Cu6Sn5 CuCrSiTi Infineon diffusion solder C19400 C1441
Text: Tin Whisker Formation – Results, Test Methods and Countermeasures Dittes, M*.; Oberndorff, P*.; Petit, L.* *Infineon Technologies, * Philips CFT, * STMicroelectronics marc.dittes@infineon.com pascal.oberndorff@philips.com luc.petit@st.com Abstract
|
Original
|
|
PDF
|
leadframe Cu C194
Abstract: ALLOY leadframe C7025 ALLOY leadframe C7025 material property SEM 2004 SEM 2006 leadframe C7025 SO044 electronics nasa study of alloy C194
Text: Matte Tin Sn Plating Of Semiconductor Devices – Whisker Growth Study Anocha Sriyarunya Spansion (Thailand) Limited Pakkerd, Nonthaburi, Thailand Dhiraj Bansal Spansion LLC (US) Sunnyvale, CA, USA Abstract In the industry’s drive towards becoming lead free (Pb-free) by July 1, 2006, as dictated by the WEEE Directive, several Pbfree terminal finishes have been proposed and evaluated. Some of them were rejected as soon as evaluations began. Others
|
Original
|
|
PDF
|
TSG 3255
Abstract: ALLOY leadframe C7025 leadframe C7025 tsg 271 C7025 certificate c7025
Text: Index INDEX A alloy 42 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10 B boxes intermediate see Q-PACK boxes outer (see outer container boxes) tubes, protection from . . . . . . . . . . . . . . . . . . . . . . . . . . 7-2
|
Original
|
|
PDF
|
EFTEC-64
Abstract: eftec HQ208 HQ240 OPQ0014 OPQ0019 OPQ0020 XC4013E XC4020E leadframe C7025
Text: Xilinx Thermally Enhanced Packaging April 1996 Application Note The Package Offering Xilinx Code Body mm HQ304 HQ240 HQ208 THK (mm) Mass (gm) Heatsink Location JEDEC No. Xilinx No. 3.80 3.40 3.37 26.2 15.0 10.0 TOP DOWN DOWN MO-143-JA MO-143-GA MO-143-FA
|
Original
|
HQ304
HQ240
HQ208
MO-143-JA
MO-143-GA
MO-143-FA
OPQ0014
OPQ0019
OPQ0020
40x40
EFTEC-64
eftec
HQ208
HQ240
OPQ0014
OPQ0019
OPQ0020
XC4013E
XC4020E
leadframe C7025
|
PDF
|
EFTEC-64
Abstract: OPQ0014
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel
|
Original
|
Q1-02
HQ160
HQ208
HQ240
HQ304
MO-108DDI
OPQ0021
143-FA
OPQ0020
MO-143-GA
EFTEC-64
OPQ0014
|
PDF
|
ALLOY leadframe C7025
Abstract: leadframe C7025 leadframe Cu C7025 C7025 alloy USBQNM50424C N03C QFN-143 USBQNM50403C C7025 TR7 SOT
Text: USBQNM50403C to USBQNM50424C 500W, Bi-directional TVS array Main product characteristics RoHS VWM 3.3V – 24.0V COMPLIANT VBR min / VBR(max) 4.0V / 26.7V HALOGEN CMAX 3pF PPP 500W FREE QFN-143 NON MAGNETIC FOR MRI Description and applications This Transient Voltage Suppressor (TVS) is assembled in a QFN143 package which is compatible (pin for pin)
|
Original
|
USBQNM50403C
USBQNM50424C
QFN-143
QFN143
OT-143
USBQNM504xxCe3/TR7
QFN143
ALLOY leadframe C7025
leadframe C7025
leadframe Cu C7025
C7025 alloy
USBQNM50424C
N03C
QFN-143
C7025
TR7 SOT
|
PDF
|
leadframe C7025
Abstract: Ablestik 84-1 EME7351T Ablestik 84-1 lmis-r4 74LCXR162245MTX Ablestik LMISR4 FSTUD16211MTDX Sumitomo 7351T Ablestik leadframe Cu C7025
Text: Date Created: 4/21/2004 Date Issued: 5/3/2004 PCN # 20033907-B DESIGN/PROCESS CHANGE NOTIFICATION - FINAL This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence.
|
Original
|
20033907-B
epax02
6437211EXT
74VCXH16374MTDX
74VHC161284MTD
FIN1108MTDX
FIN1216MTD
FIN1217MTDX
FIN3383MTD
FIN3385MTDX
leadframe C7025
Ablestik 84-1
EME7351T
Ablestik 84-1 lmis-r4
74LCXR162245MTX
Ablestik LMISR4
FSTUD16211MTDX
Sumitomo 7351T
Ablestik
leadframe Cu C7025
|
PDF
|
FLUX TYPE ROL0
Abstract: ALLOY leadframe C7025 ST-300 C7025 strip specification smd EDL 63 ST-50 adrian borg 10X10 C151 C194
Text: The Qualification of a Pure Tin Plating Process as a Lead Free Finish for I.C. Packaging Joseph Gauci, Adrian-Michael Borg and Robert Caruana, ST Microelectronics, Malta Keith Whitlaw and Jeff Crosby, Rohm and Haas Electronic Materials, Coventry, UK Abstract
|
Original
|
ST-300
Workshop/54th
FLUX TYPE ROL0
ALLOY leadframe C7025
C7025 strip specification
smd EDL 63
ST-50
adrian borg
10X10
C151
C194
|
PDF
|
Untitled
Abstract: No abstract text available
Text: RTL8110SB L INTEGRATED GIGABIT ETHERNET CONTROLLER (LOM) DATASHEET Rev. 1.5 05 October 2004 Track ID: JATR-1076-21 RTL8110SB(L) Datasheet COPYRIGHT 2004 Realtek Semiconductor Corp. All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any
|
Original
|
RTL8110SB
JATR-1076-21
RTL8110SBL*
RTL8110SBL
RTL8110SB-LF*
RTL8110SB-LF
RTL8110SBL-LF*
RTL8110SBL-LF
128-pin
|
PDF
|
Untitled
Abstract: No abstract text available
Text: RTL8169SB L INTEGRATED GIGABIT ETHERNET CONTROLLER (NIC) DATASHEET Rev. 1.6 05 October 2004 Track ID: JATR-1076-21 RTL8169SB(L) Datasheet COPYRIGHT 2004 Realtek Semiconductor Corp. All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any
|
Original
|
RTL8169SB
JATR-1076-21
includinRTL8169SBL*
RTL8169SBL
RTL8169SB-LF*
RTL8169SB-LF
RTL8169SBL-LF*
RTL8169SBL-LF
128-pin
|
PDF
|
|
|
Ablestik 84-1
Abstract: KMC-184 sumitomo epoxy olin 7025 Sumitomo 7351T eme6600cs SUMITOMO EME6600cs 74std kmc184-7 megatest tester
Text: TM Fairchild Semiconductor Salt Lake 3333 West 9000 South West Jordan, UT 84088-8838 Fax: 1.801.562.7500 CS100HEE MICROWIRE INTERFACE EEPROM QUALIFICATION PACKAGE 1.0um CMOS technology Advanced Semiconductor Manufacturing Corp. of Shanghai Product: .Serial EEPROM
|
Original
|
CS100HEE
CS100HEE
200mA
200mA)
200mA
FM93C46EA
FM93C56CA
FM93C66BA
FM93C86AA
FM93CS46AA
Ablestik 84-1
KMC-184
sumitomo epoxy
olin 7025
Sumitomo 7351T
eme6600cs
SUMITOMO EME6600cs
74std
kmc184-7
megatest tester
|
PDF
|
footprint jedec MS-026 TQFP
Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
|
Original
|
|
PDF
|
JEDEC Package Code MS-026-AED
Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
Text: • Packages and Thermal Characteristics November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
|
Original
|
|
PDF
|
schematic impulse sealer
Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
Text: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").
|
Original
|
PK100
060ROM
schematic impulse sealer
qfp 64 0.4 mm pitch land pattern
Rotron
pk100 power supply
XC4013E-PQ240
EFTEC-64
XC4010E-PQ208
MO-151-AAN-1
PK100
land pattern for TSOP 2 86 PIN
|
PDF
|
schematic impulse sealer
Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
|
Original
|
|
PDF
|
RTL8110SC
Abstract: RTL8110SCL-GR RTL8110SC-GR Realtek RTL8110sc RTL8110SCL Realtek RTL8110 RTL8110 pci realtek programming Magic rtl811
Text: RTL8110SC-GR RTL8110SCL-GR INTEGRATED GIGABIT ETHERNET CONTROLLER LOM (MiniPCI) DATASHEET Rev. 1.3 09 January 2007 Track ID: JATR-1076-21 Realtek Semiconductor Corp. No. 2, Innovation Road II, Hsinchu Science Park, Hsinchu 300, Taiwan Tel.: +886-3-578-0211. Fax: +886-3-577-6047
|
Original
|
RTL8110SC-GR
RTL8110SCL-GR
JATR-1076-21
RTL8110SC
DC128-SW1
128-Pin
RTL8110SCL-GR
RTL8110SC-GR
Realtek RTL8110sc
RTL8110SCL
Realtek RTL8110
RTL8110
pci realtek programming
Magic
rtl811
|
PDF
|
footprint jedec MS-026 TQFP 128
Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
|
Original
|
FG860
FG900
FG1156
footprint jedec MS-026 TQFP 128
schematic impulse sealer
footprint jedec MS-026 TQFP
TSOP 86 land pattern
BAV 235
BGA and QFP Package
xc4010e-pq208
leadframe C7025
QFP PACKAGE thermal resistance
CB228
|
PDF
|
schematic impulse sealer
Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
|
Original
|
FG860
FG900
FG1156
schematic impulse sealer
leadframe C7025
MO-151-BAR
PG223-XC4013E
XC4010E-PQ208
BGA 31 x 31 mm
footprint jedec MS-026 TQFP 128
footprint jedec mo-067
XC4013E-PQ240
EIA standards 481
|
PDF
|
Untitled
Abstract: No abstract text available
Text: RTL8110SB-VD RTL8110SB-VD-LF RTL8110SBL-VD RTL8110SBL-VD-LF INTEGRATED GIGABIT ETHERNET CONTROLLER LOM DATASHEET Rev. 1.6 26 October 2005 Track ID: JATR-1076-21 Realtek Semiconductor Corp. No. 2, Innovation Road II, Hsinchu Science Park, Hsinchu 300, Taiwan
|
Original
|
RTL8110SB-VD
RTL8110SB-VD-LF
RTL8110SBL-VD
RTL8110SBL-VD-LF
JATR-1076-21
RTL8110SB
DC128-SW1
|
PDF
|
eme-g770
Abstract: No abstract text available
Text: InvenSense Inc. 1197 Borregas Ave, Sunnyvale, CA 94089 U.S.A. Tel: +1 408 988-7339 Fax: +1 (408) 988-8104 Website: www.invensense.com PS-ISZ-0650B-00-03 Release Date: 04/13/10 ISZ-650 Single-Axis Z-Gyro Product Specification A printed copy of this document is
|
Original
|
PS-ISZ-0650B-00-03
ISZ-650
ISZ-650TM
eme-g770
|
PDF
|