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    FG456 Price and Stock

    AMD XC2VP4-6FG456C

    IC FPGA 248 I/O 456FBGA
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    AMD XC2VP4-5FG456I

    IC FPGA 248 I/O 456FBGA
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    AMD XCV150-4FG456I

    IC FPGA 260 I/O 456FBGA
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    AMD XCV200-5FG456C

    IC FPGA 284 I/O 456FBGA
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    AMD XCV150-4FG456C

    IC FPGA 260 I/O 456FBGA
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    FG456 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    PK034

    Abstract: FG456
    Text: R Fine-Pitch BGA FG456 Package PK034 (v1.0) June 1, 2000 2000 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.


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    FG456) PK034 PK034 FG456 PDF

    FF1152

    Abstract: FG256 BF957
    Text: R Package Specifications This section contains specifications for the following Virtex-II packages: 450 • "CS144 Chip-Scale BGA Package 0.80 mm Pitch " on page 451 • "FG256 Fine-Pitch BGA Package (1.00 mm Pitch)" on page 452 • "FG456 Fine-Pitch BGA Package (1.00 mm Pitch)" on page 453


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    CS144 FG256 FG456 FG676 BG575 BG728 FF896 FF1152 FF1517 BF957 PDF

    BF957

    Abstract: FF1517 FF1152 FG256 FF896 Virtex-II FG456 Fine-Pitch BGA Package
    Text: R Chapter 4: PCB Design Considerations FG256 Fine-Pitch BGA Package 1.00 mm Pitch Figure 4-22: 490 FG256 Fine-Pitch BGA Package www.xilinx.com 1-800-255-7778 UG012 (v1.0) January 31, 2002 Virtex-II Pro Platform FPGA Handbook R Package Specifications FG456 Fine-Pitch BGA Package (1.00 mm Pitch)


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    FG256 UG012 FG456 FF672 FF1152 BF957 FF1517 FF896 Virtex-II Fine-Pitch BGA Package PDF

    Untitled

    Abstract: No abstract text available
    Text: 100% Material Declaration Data Sheet for FG456 Package PK154 v1.4 August 24, 2012 Average Weight: 2.0021 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound 7440-21-3 100.00 Use in Product


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    FG456 PK154 PDF

    Untitled

    Abstract: No abstract text available
    Text: PK540 v1.1 January 11, 2012 100% Material Declaration Data Sheet for Spartan -3/-3E/-3A FG456 (Cu Wire) Package Average Weight: 2.3521 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound


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    PK540 FG456 PDF

    XC2V1000

    Abstract: XC2V1000 Pin-out IO-L93N XC2V80 XC2V40 XC2V250 XC2V500
    Text: R Pinout Information Introduction This section describes the pinouts for Virtex-II devices in the following packages: • • • • • CS144: wire-bond chip-scale ball grid array BGA of 0.80 mm pitch FG256, FG456, and FG676: wire-bond fine-pitch BGA of 1.00 mm pitch


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    CS144: FG256, FG456, FG676: FF896, FF1152, FF1517: BG575 BG728: BF957: XC2V1000 XC2V1000 Pin-out IO-L93N XC2V80 XC2V40 XC2V250 XC2V500 PDF

    34992

    Abstract: XCV600E FG680 BG680 XCV100 TQ144 XCV1000E XCV600E HQ240 XCV300 PQ240 XCV50 PQ240 CS144 BG560
    Text: Competitive Overview Virtex Series FPGA Competitive Cross Reference XCV100E 32K 30K-95K 2988 2/24 EP20K100E XCV200E 94 158 176 284 PQ240 FG256 BG432 FG456 158 176 316 312 83K 80K-400K 7116 2/24 PQ240 BG432 FG676 158 316 404 130K 130K-560K 10812 2/24 HQ240


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    XCV100E 30K-95K XCV200E 80K-400K PQ240 BG432 FG676 130K-560K HQ240 34992 XCV600E FG680 BG680 XCV100 TQ144 XCV1000E XCV600E HQ240 XCV300 PQ240 XCV50 PQ240 CS144 BG560 PDF

    BF957

    Abstract: 21M22
    Text: R Pinout Diagrams Pinout Diagrams This section contains pinout diagrams for the following Virtex-II Pro packages: • • • • • • • FG256 Fine-Pitch BGA Composite Pinout Diagram, page 461 - FG256 Bank Information - FG256 Dedicated Pins FG456 Fine-Pitch BGA Composite Pinout Diagram, page 465


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    FG256 FG456 FF672 FF896 BF957 21M22 PDF

    FG456

    Abstract: package drawings
    Text: R Package Drawings Ball Fine Pitch Packages - FG456 11-56 February 2, 1999 Version 1.3


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    FG456 FG456 package drawings PDF

    FGG456

    Abstract: FG456 456-BALL PK034
    Text: R PK034 v1.2.1 March 23, 2005 Fine-Pitch BGA (FG456/FGG456) Package 456-BALL FINE-PITCH BGA, 1.00MM PITCH (FG456/FGG456) 2004, 2005 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.


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    PK034 FG456/FGG456) 456-BALL FGG456 FG456 PK034 PDF

    FG456

    Abstract: No abstract text available
    Text: R Fine Pitch BGA FG456 Package PK034 (v1.1) April 6, 2001 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.


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    FG456) PK034 FG456 PDF

    socket am3 pinout

    Abstract: socket AM2 pinout AM2 pinout Socket F am2 socket pin diagram am3 socket pinout am3 socket pin diagram am2 socket pinout socket AM3 pinout diagram PCIe cable pinout LX5511
    Text: Broaddown4 User Manual Issue – 2.00 draft Enterpoint Ltd. - Broaddown4 Manual – Issue 2.00 11/04/2007 Kit Contents You should receive the following items with you Broaddown4 development kit: 1 - Broaddown4 Board 2 - Programming Cable Prog2 Figure 1 - Broaddown4 Board


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    PDF

    SPARTAN-3 XC3S400 PQ208

    Abstract: SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 tq144 SPARTAN-3 XC3S400 Spartan-3 FPGA Family XC3S4000-FG676 SPARTAN-3 XC3S400 pin SPARTAN-3 XC3S400 architecture XC3S4000FG676 XILINX SPARTAN VQG100
    Text: 06 Spartan-3 FPGA Family: Introduction and Ordering Information R DS099-1 v1.4 January 17, 2005 Preliminary Product Specification Introduction - The Spartan -3 family of Field-Programmable Gate Arrays is specifically designed to meet the needs of high volume,


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    DS099-1 XC3S50CP132, XC3S2000FG456, XC3S4000FG676 DS099-1, DS099-2, DS099-3, DS099-4, DS313, DS314-1, SPARTAN-3 XC3S400 PQ208 SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 tq144 SPARTAN-3 XC3S400 Spartan-3 FPGA Family XC3S4000-FG676 SPARTAN-3 XC3S400 pin SPARTAN-3 XC3S400 architecture XILINX SPARTAN VQG100 PDF

    xc2s300e pinouts

    Abstract: LP1-D12 L43P xc2s300e l36n xc2s50e L26N L28N XC2S200E L18P
    Text: Spartan-IIE 1.8V FPGA Family: Pinout Tables R DS077-4 v1.0 November 15, 2001 Preliminary Product Specification Pin Definitions Dedicated Pin Direction Description GCK0, GCK1, GCK2, GCK3 No Input Clock input pins that connect to Global Clock buffers. These pins


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    DS077-4 thT11 DS001-1, DS001-2, DS001-3, DS001-4, xc2s300e pinouts LP1-D12 L43P xc2s300e l36n xc2s50e L26N L28N XC2S200E L18P PDF

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga PDF

    XCV200E Device, FG456 Package

    Abstract: XCV300BG432 BG432 PCI33 XCV200 XCV300 XCV400 XCV400E p146 AE-29
    Text: Application Note - Virtex-E Virtex-E Package Compatibility Guide This package compatibility guide describes the Virtex-E pin-outs and establishes guidelines for package compatibility between Virtex and Virtex-E devices. by Robert Le, Sr. Applications Engineer,


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    XCV200E FG456 XCV200 XCV300E BG432 XCV200E Device, FG456 Package XCV300BG432 PCI33 XCV300 XCV400 XCV400E p146 AE-29 PDF

    XCF00S

    Abstract: spartan 3a FGG900 DS099 XCN07010
    Text: ds313.fm Page 1 Friday, April 18, 2008 10:26 AM Spartan-3L Low Power FPGA Family R DS313 v1.2 April 18, 2008 Product Specification This product is undergoing discontinuance. Please refer to XCN07010, Product Discontinuation Notice, for more information on last-time purchases and replacement products.


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    ds313 DS313 XCN07010, SSTL18 XCF00S spartan 3a FGG900 DS099 XCN07010 PDF

    2S100

    Abstract: SPARTAN-II 2S30 what the difference between the spartan and virtex 2S15 2S50 CS144 FG256 PQ208 TQ144
    Text: Spartan-II Family FAQ 1. What is the Spartan-II family? The Spartan-II family is the next generation family of the Spartan Series based on the industry-leading Virtex architecture. The Spartan-II family extends the portion of the ASIC market that Xilinx can address, while


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    18u/0 XC2S150-6 XC2S150-5. 2S100 SPARTAN-II 2S30 what the difference between the spartan and virtex 2S15 2S50 CS144 FG256 PQ208 TQ144 PDF

    SPARTAN XC2S50

    Abstract: SPARTAN-II SPARTAN-II xc2s100 pq208 CS144 FG256 PQ208 TQ144 VQ100 XC2S100 XC2S15
    Text: Robust Feature Set • Flexible on-chip memory Distributed and Block Memory • 4 Digital Delay Lock Loops per device Efficient chip level/ board level clock management • Select I/O Technology Interface to all major bus standards HSTL, GTL, SSTL, etc…


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    PQ208 FG256 FG456 SPARTAN XC2S50 SPARTAN-II SPARTAN-II xc2s100 pq208 CS144 FG256 PQ208 TQ144 VQ100 XC2S100 XC2S15 PDF

    SCHEMATIC DIAGRAM OF POWER SAVER DEVICE

    Abstract: diode zener nt 9838 Keller AG am3 socket pinout AT-610 XILINX vhdl code REED SOLOMON NORTEL OC-12 A26 zener w9 0780 specifications for multiplexer of nortel
    Text: Editorial contact: Ann Duft Xilinx, Inc. 408 879-4726 publicrelations@xilinx.com Kathy Keller Oak Ridge Public Relations (408) 253-5042 kathy.keller@oakridge.com Product Marketing contact: Bruce Jorgens Xilinx, Inc. (408) 879-5236 bruce.jorgens@xilinx.com


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    1998--Dramatically SCHEMATIC DIAGRAM OF POWER SAVER DEVICE diode zener nt 9838 Keller AG am3 socket pinout AT-610 XILINX vhdl code REED SOLOMON NORTEL OC-12 A26 zener w9 0780 specifications for multiplexer of nortel PDF

    Untitled

    Abstract: No abstract text available
    Text: HXILINX Virtex 2,5 ¥ Field Programmable Gate Arrays N ovem ber 9, 1998 Version 1.1 - AD VAN C E P roduct S pecification Features • • • • • • Fast, high-density Field-P rogram m able Gate Arrays - D ensities from 50 k to 1M system gates - System perform ance up to 200 MHz


    OCR Scan
    BG432 BG352 HQ240 FG600 FG680 XCV300-6PQ240C PDF

    Untitled

    Abstract: No abstract text available
    Text: f lX IL IN X Virtex 2.5 V Field Programmable Gate Arrays November 9 ,1 9 9 8 Version 1.1 - ADVAN CE Product Specification Features • • • • • • Fast, high-density Field-Programmable Gate Arrays - Densities from 50k to 1M system gates - System performance up to 200 MHz


    OCR Scan
    66-MHz 16-bit 32-bit ReV600 XCV800 XCV1000 XCV300-6PQ240C PDF

    Untitled

    Abstract: No abstract text available
    Text: £ XILINX Virtex 2.5 V Field Programmable Gate Arrays February 16, 1999 Version 1.3 Advance Product Specification Features • • • • • • Fast, high-density Field-Programmable Gate Arrays - Densities from 50k to 1M system gates - System performance up to 200 MHz


    OCR Scan
    66-MHz 16-bit 32-bit XCV400 XCV600 XCV800 XCV1000 XCV300 PDF

    Untitled

    Abstract: No abstract text available
    Text: V ir te x 2 .5 V £ XILINX Field Programmable Gate Arrays May 13, 1999 Version 1.5 Advance Product Specification Features • • • • • • Fast, high-density Field-Programmable Gate Arrays - Densities from 50k to 1M system gates - System performance up to 200 MHz


    OCR Scan
    66-MHz 16-bit 32-bit Regis00 XCV1000 XCV300 FG680 PDF