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    FG256 Price and Stock

    Microchip Technology Inc M2S005S-1VFG256I

    IC SOC CORTEX-M3 166MHZ 256FBGA
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    DigiKey M2S005S-1VFG256I Tray 476 1
    • 1 $28.55
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    Microchip Technology Inc M2GL005-VFG256I

    IC FPGA 161 I/O 256FBGA
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    DigiKey M2GL005-VFG256I Tray 361 1
    • 1 $18.38
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    Mouser Electronics M2GL005-VFG256I 3,759
    • 1 $18.38
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    Newark M2GL005-VFG256I Bulk 117 1
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    Microchip Technology Inc M2GL010-1VFG256I

    IC FPGA 138 I/O 256FBGA
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    DigiKey M2GL010-1VFG256I Tray 250 1
    • 1 $41.54
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    Newark M2GL010-1VFG256I Bulk 119
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    Microchip Technology Inc M2GL010-1VFG256I Tray 23 12 Weeks
    • 1 $41.54
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    NAC M2GL010-1VFG256I Tray 119
    • 1 $41.53
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    Avnet Silica M2GL010-1VFG256I 10 Weeks 119
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    Microchip Technology Inc M2S005-VFG256I

    IC SOC CORTEX-M3 166MHZ 256BGA
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    DigiKey M2S005-VFG256I Tray 233 1
    • 1 $22.29
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    Mouser Electronics M2S005-VFG256I 107
    • 1 $22.04
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    Microchip Technology Inc M2S005S-VFG256I

    IC SOC CORTEX-M3 166MHZ 256FBGA
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    DigiKey M2S005S-VFG256I Tray 228 1
    • 1 $25.77
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    Mouser Electronics M2S005S-VFG256I 116
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    FG256 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    FF1152

    Abstract: UG002 BG728 BF957 FG676 led flip-chip CS144 FG256 BGA Package
    Text: R Chapter 4: PCB Design Considerations Package Specifications This section contains specifications for the following Virtex-II packages: 426 • "CS144 Chip-Scale BGA Package 0.80 mm Pitch " on page 427 • "FG256 Fine-Pitch BGA Package (1.00 mm Pitch)" on page 428


    Original     		FG256 FG456 FG676 BG575 BG728 FF896 FF1152 FF1517 CS144 UG002 UG002 BF957 led flip-chip BGA Package PDF

    FF1152

    Abstract: FG256 BF957
    Text: R Package Specifications This section contains specifications for the following Virtex-II packages: 450 • "CS144 Chip-Scale BGA Package 0.80 mm Pitch " on page 451 • "FG256 Fine-Pitch BGA Package (1.00 mm Pitch)" on page 452 • "FG456 Fine-Pitch BGA Package (1.00 mm Pitch)" on page 453


    Original     		CS144 FG256 FG456 FG676 BG575 BG728 FF896 FF1152 FF1517 BF957 PDF

    BF957

    Abstract: FF1517 FF1152 FG256 FF896 Virtex-II FG456 Fine-Pitch BGA Package
    Text: R Chapter 4: PCB Design Considerations FG256 Fine-Pitch BGA Package 1.00 mm Pitch Figure 4-22: 490 FG256 Fine-Pitch BGA Package www.xilinx.com 1-800-255-7778 UG012 (v1.0) January 31, 2002 Virtex-II Pro Platform FPGA Handbook R Package Specifications FG456 Fine-Pitch BGA Package (1.00 mm Pitch)


    Original     		FG256 UG012 FG456 FF672 FF1152 BF957 FF1517 FF896 Virtex-II Fine-Pitch BGA Package PDF

    FG256

    Abstract: FGG256
    Text: R PK033 v1.2.1 April 12, 2005 Fine-Pitch BGA (FG256/FGG256) Package 256-BALL FINE-PITCH BGA, 1.00MM PITCH (FG256/FGG256) 2004, 2005 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.


    Original     		PK033 FG256/FGG256) 256-BALL FG256 FGG256 PDF

    XC2V1000

    Abstract: XC2V1000 Pin-out IO-L93N XC2V80 XC2V40 XC2V250 XC2V500
    Text: R Pinout Information Introduction This section describes the pinouts for Virtex-II devices in the following packages: • • • • • CS144: wire-bond chip-scale ball grid array BGA of 0.80 mm pitch FG256, FG456, and FG676: wire-bond fine-pitch BGA of 1.00 mm pitch


    Original     		CS144: FG256, FG456, FG676: FF896, FF1152, FF1517: BG575 BG728: BF957: XC2V1000 XC2V1000 Pin-out IO-L93N XC2V80 XC2V40 XC2V250 XC2V500 PDF

    34992

    Abstract: XCV600E FG680 BG680 XCV100 TQ144 XCV1000E XCV600E HQ240 XCV300 PQ240 XCV50 PQ240 CS144 BG560
    Text: Competitive Overview Virtex Series FPGA Competitive Cross Reference XCV100E 32K 30K-95K 2988 2/24 EP20K100E XCV200E 94 158 176 284 PQ240 FG256 BG432 FG456 158 176 316 312 83K 80K-400K 7116 2/24 PQ240 BG432 FG676 158 316 404 130K 130K-560K 10812 2/24 HQ240


    Original     		XCV100E 30K-95K XCV200E 80K-400K PQ240 BG432 FG676 130K-560K HQ240 34992 XCV600E FG680 BG680 XCV100 TQ144 XCV1000E XCV600E HQ240 XCV300 PQ240 XCV50 PQ240 CS144 BG560 PDF

    Arasan SD controller

    Abstract: Embedded SDIO micro sd connector sdio mmc connector CRC generator and checker Mmcplus commands verilog code for ahb bus slave CMD39 mmc ip core dma controller VERILOG
    Text: Features • • • • • • • • • • • • • • • • • • • • • • • Low-power Actel AGL600-FG256 IGLOO family FPGA Micro-SD connector for Micro-SD memory modules SD/MMC Connector for SD, MMC4, RS-MMC, Mini-SD, MMC Plus, RS


    Original     		AGL600-FG256 160-pin Arasan SD controller Embedded SDIO micro sd connector sdio mmc connector CRC generator and checker Mmcplus commands verilog code for ahb bus slave CMD39 mmc ip core dma controller VERILOG PDF

    Untitled

    Abstract: No abstract text available
    Text: Fusion Starter Kit Quickstart Card Kit Contents – AFS-EVAL-KIT Quantity Description 1 Evaluation board with an AFS600-FG256 Fusion device 1 FlashPro4 programmer 1 9 V power supply with international adapters Overview The Fusion Starter Kit contains basic requirements for fully experimenting with SoC Products


    Original     		AFS600-FG256 40-Pin PDF

    BF957

    Abstract: 21M22
    Text: R Pinout Diagrams Pinout Diagrams This section contains pinout diagrams for the following Virtex-II Pro packages: • • • • • • • FG256 Fine-Pitch BGA Composite Pinout Diagram, page 461 - FG256 Bank Information - FG256 Dedicated Pins FG456 Fine-Pitch BGA Composite Pinout Diagram, page 465


    Original     		FG256 FG456 FF672 FF896 BF957 21M22 PDF

    FG256

    Abstract: No abstract text available
    Text: R Fine Pitch BGA FG256 Package PK033 (v1.1) April 6, 2001 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.


    Original     		FG256) PK033 FG256 PDF

    FG256128b

    Abstract: 256x128 256 x 128 lcd module SED1335 Fenghua FG2561 vr-10k GRAPHIC LCD MODULE china LCD circuit diagram
    Text: Tovics Technology Corporation Standard Graphic LCD Module Feature 1. 2. 3. 4. 5. 6. 7. FG256128B Picture Information Dot Format 256 x 128 8-Bit parallel bus interface Built-in LCD controller (SED1335) Wide operating temperature range ( Option ) High contrast ratio


    Original     		FG256128B SED1335) FG256128b 256x128 256 x 128 lcd module SED1335 Fenghua FG2561 vr-10k GRAPHIC LCD MODULE china LCD circuit diagram PDF

    FG256

    Abstract: No abstract text available
    Text: Package Drawings February 2, 1999 Version 1.3 11 R Package Drawings Ball Fine Pitch Packages - FG256 11 February 2, 1999 (Version 1.3) 11-55


    Original     		FG256 FG256 PDF

    FG256

    Abstract: PK033
    Text: R Fine-Pitch BGA FG256 Package PK033 (v1.0) June 1, 2000 2000 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.


    Original     		FG256) PK033 FG256 PK033 PDF

    BF957

    Abstract: UG002
    Text: R Pinout Diagrams This section contains pinout diagrams for the following Virtex-II packages: • "CS144 Chip-Scale BGA Composite Pinout Diagram" on page 412 • "FG256 Fine-Pitch BGA Composite Pinout Diagram" on page 413 • • • • • • • • -


    Original     		CS144 FG256 FG456 FG676 BF957 UG002 PDF

    A3P600

    Abstract: A3P060 A3P1000 A3P125 A3P250 AECQ100 AEC-Q100 FG144 FG256 FG484
    Text: v1.0 Automotive ProASIC3 Flash Family FPGAs Features and Benefits Low Power • 1.5 V Core Voltage • Support for 1.5-V-Only Systems • Low-Impedance Flash Switches High-Temperature AEC-Q100–Qualified Devices • Grade 2 105°C TA 115°C TJ • Grade 1 125°C TA (135°C TJ)


    Original     		AEC-Q100 A3P600 A3P060 A3P1000 A3P125 A3P250 AECQ100 FG144 FG256 FG484 PDF

    A3PE3000L FG484

    Abstract: Actel pdf on radio emitter A3PE3000L FG144 FG256 FG324 FG484 PQ208 TDP 245 Y
    Text: v1.3 ProASIC3L Low-Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Low Power • Dramatic Reduction in Dynamic and Static Power Savings • 1.2 V to 1.5 V Core and I/O Voltage Support for Low Power • Low Power Consumption in Flash*Freeze Mode Allows for


    Original     		130-nm, A3PE3000L FG484 Actel pdf on radio emitter A3PE3000L FG144 FG256 FG324 FG484 PQ208 TDP 245 Y PDF

    CORE8051

    Abstract: FlashPro3 AES-128 FG256 PQ208 ac motor variable speed control rc oscillator
    Text: Preliminary v0.4 Actel Fusion Mixed-Signal FPGA for the MicroBlade Advanced Mezzanine Card Solution Features and Benefits • Targeted to Advanced Mezzanine Card AdvancedMC Designs • Designed in Partnership with MicroBlade • 8051-Based Module Management Controller (MMC)


    Original     		8051-Based 130-nm, 32ost CORE8051 FlashPro3 AES-128 FG256 PQ208 ac motor variable speed control rc oscillator PDF

    AFS600-FG256

    Abstract: zo 103 ma 75 607 A54 ZENER flashpro3 schematic mark AT0 Unipolar PC atx 400 P4 power supply diagram zener Diode B23 PQ208 QN108 QN180
    Text: Preliminary v1.7 Actel Fusion Mixed-Signal FPGAs Family with Optional ARM® Support Features and Benefits – Frequency: Input 1.5–350 MHz, Output 0.75–350 MHz Low Power Consumption High-Performance Reprogrammable Flash Technology • • • • • Single 3.3 V Power Supply with On-Chip 1.5 V Regulator


    Original     		130-nm, 128-Bit AFS600-FG256 zo 103 ma 75 607 A54 ZENER flashpro3 schematic mark AT0 Unipolar PC atx 400 P4 power supply diagram zener Diode B23 PQ208 QN108 QN180 PDF

    Untitled

    Abstract: No abstract text available
    Text: Revision 22 IGLOO Low Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Low Power • • • • • 1.2 V to 1.5 V Core Voltage Support for Low Power Supports Single-Voltage System Operation 5 µW Power Consumption in Flash*Freeze Mode


    Original     		PDF

    AES-128

    Abstract: FG256 FG484
    Text: v2.0 IGLOOe Low-Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Low Power • • • • 1.2 V to 1.5 V Core Voltage Support for Low Power Supports Single-Voltage System Operation Low-Power Active FPGA Operation Flash*Freeze Technology Enables Ultra-Low Power


    Original     		130-nm, AES-128 FG256 FG484 PDF

    A54 ZENER

    Abstract: AFS600-FG256 mark AT0 QN108 CORE8051 bipolar ROM
    Text: v2.0 Actel Fusion Family of Mixed-Signal FPGAs Features and Benefits In-System Programming ISP and Security High-Performance Reprogrammable Flash Technology Advanced Digital I/O • • • • • Secure ISP with 128-Bit AES via JTAG • FlashLock® to Secure FPGA Contents


    Original     		128-Bit 130-nm, A54 ZENER AFS600-FG256 mark AT0 QN108 CORE8051 bipolar ROM PDF

    XC9572XL

    Abstract: PC44 VQ44 XC9500 XC9500XL XC95144XL XC95288XL XC9536XL XC95288XL pinout
    Text: k XC9500XL High-Performance CPLD Family Data Sheet R DS054 v2.5 May 22, 2009 Product Specification Features • • Optimized for high-performance 3.3V systems - 5 ns pin-to-pin logic delays, with internal system frequency up to 208 MHz - Small footprint packages including VQFPs, TQFPs


    Original     		XC9500XL DS054 XC9572XL PC44 VQ44 XC9500 XC95144XL XC95288XL XC9536XL XC95288XL pinout PDF

    BLVDS-25

    Abstract: LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000
    Text: Xilinx Virtex-II Series FPGAs and RocketPHY Physical Layer Transceivers Transceiver Blocks 992 88 120 200 264 432 528 624 720 912 1104 1108 Chip Scale Packages CS – wire-bond chip-scale BGA (0.8 mm ball spacing) 144 8 88 92 FF896 92 8 FF1152 BGA Packages (BG) – wire-bond standard BGA (1.27 mm ball spacing)


    Original     		FF896 FF1152 FF11486 10Gbps BLVDS-25 LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000 PDF

    Untitled

    Abstract: No abstract text available
    Text: HXILINX Virtex 2,5 ¥ Field Programmable Gate Arrays N ovem ber 9, 1998 Version 1.1 - AD VAN C E P roduct S pecification Features • • • • • • Fast, high-density Field-P rogram m able Gate Arrays - D ensities from 50 k to 1M system gates - System perform ance up to 200 MHz


    OCR Scan     		BG432 BG352 HQ240 FG600 FG680 XCV300-6PQ240C PDF