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    FG676 Search Results

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    FG676 Price and Stock

    AMD XC7Z030-1FFG676I

    IC SOC CORTEX-A9 667MHZ 676FCBGA
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    DigiKey XC7Z030-1FFG676I Tray 113 1
    • 1 $469.3
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    Newark XC7Z030-1FFG676I Bulk 30 1
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    AMD XC7K160T-1FFG676C

    IC FPGA 400 I/O 676FCBGA
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    DigiKey XC7K160T-1FFG676C Tray 108 1
    • 1 $501.25
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    Mouser Electronics XC7K160T-1FFG676C 3
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    Newark XC7K160T-1FFG676C Bulk 20 1
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    Avnet Asia XC7K160T-1FFG676C 19 Weeks 1
    • 1 $572.8571
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    AMD XC7K160T-1FFG676I

    IC FPGA 400 I/O 676FCBGA
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    DigiKey XC7K160T-1FFG676I Tray 106 1
    • 1 $626.6
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    Newark XC7K160T-1FFG676I Bulk 14 1
    • 1 $626.54
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    Avnet Asia XC7K160T-1FFG676I 5 19 Weeks 1
    • 1 $634.2105
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    AMD XC7K160T-2FFG676C

    IC FPGA 400 I/O 676FCBGA
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    DigiKey XC7K160T-2FFG676C Tray 99 1
    • 1 $626.6
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    Newark XC7K160T-2FFG676C Bulk 75 1
    • 1 $626.58
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    AMD XC7Z045-2FFG676I

    IC SOC CORTEX-A9 800MHZ 676FCBGA
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    DigiKey XC7Z045-2FFG676I Tray 90 1
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    Avnet Asia XC7Z045-2FFG676I 25 Weeks 1
    • 1 $2961.4285
    • 10 $2559.2593
    • 100 $2438.8235
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    Find more FG676 price and stock on Findchips.com

    FG676 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    FGG676

    Abstract: fg676 PK035
    Text: R PK035 v1.2.1 April 12, 2005 Fine-Pitch BGA (FG676/FGG676) Package 676-BALL FINE-PITCH BGA, 1.00MM PITCH (FG676/FGG676) 2004, 2005 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.


    Original     		PDF PK035 FG676/FGG676) 676-BALL FGG676 fg676 PK035

    Untitled

    Abstract: No abstract text available
    Text: R Fine Pitch BGA FG676 Package PK035 (v1.1) April 6, 2001 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.


    Original     		PDF FG676) PK035

    fg676

    Abstract: 676-Pin bga pin 676
    Text: R Package Drawings Ball Fine Pitch Packages - FG676 676-PIN FINE PITCH BGA FG676 11-62 August 12, 1999 (Version 1.4)


    Original     		PDF FG676 676-PIN FG676) fg676 bga pin 676

    XC2V1000

    Abstract: XC2V1000 Pin-out IO-L93N XC2V80 XC2V40 XC2V250 XC2V500
    Text: R Pinout Information Introduction This section describes the pinouts for Virtex-II devices in the following packages: • • • • • CS144: wire-bond chip-scale ball grid array BGA of 0.80 mm pitch FG256, FG456, and FG676: wire-bond fine-pitch BGA of 1.00 mm pitch


    Original     		PDF CS144: FG256, FG456, FG676: FF896, FF1152, FF1517: BG575 BG728: BF957: XC2V1000 XC2V1000 Pin-out IO-L93N XC2V80 XC2V40 XC2V250 XC2V500

    34992

    Abstract: XCV600E FG680 BG680 XCV100 TQ144 XCV1000E XCV600E HQ240 XCV300 PQ240 XCV50 PQ240 CS144 BG560
    Text: Competitive Overview Virtex Series FPGA Competitive Cross Reference XCV100E 32K 30K-95K 2988 2/24 EP20K100E XCV200E 94 158 176 284 PQ240 FG256 BG432 FG456 158 176 316 312 83K 80K-400K 7116 2/24 PQ240 BG432 FG676 158 316 404 130K 130K-560K 10812 2/24 HQ240


    Original     		PDF XCV100E 30K-95K XCV200E 80K-400K PQ240 BG432 FG676 130K-560K HQ240 34992 XCV600E FG680 BG680 XCV100 TQ144 XCV1000E XCV600E HQ240 XCV300 PQ240 XCV50 PQ240 CS144 BG560

    30255

    Abstract: 34590-94-8 744050
    Text: 100% Material Declaration Data Sheet for Spartan -3/-3A FG676 Cu Wire Package PK534 (v1.2) March 19, 2012 Average Weight: 3.0582 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound 7440-21-3


    Original     		PDF FG676 PK534 30255 34590-94-8 744050

    fg676

    Abstract: PK035
    Text: R Fine-Pitch BGA FG676 Package PK035 (v1.0) June 1, 2000 2000 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.


    Original     		PDF FG676) PK035 fg676 PK035

    XC3S700A

    Abstract: xc3s200aft256 XC3S400AFT256 XC3S50A L01P L02P FG320 UG331 L05P xc3s400a ftg256
    Text: Spartan-3A FPGA Family: Data Sheet R DS529 July 10, 2007 Product Specification Module 1: Introduction and Ordering Information - DS529-1 v1.4.1 July 10, 2007 • • • • • • • Introduction Features Architectural and Configuration Overview General I/O Capabilities


    Original     		PDF DS529 DS529-1 DS529-2 DS529-3 XC3S50A XC3S200A FT256 DS529-4 XC3S700A xc3s200aft256 XC3S400AFT256 L01P L02P FG320 UG331 L05P xc3s400a ftg256

    ACTEL FUSION AFS1500

    Abstract: FlashPro3 PQ208 QN108 QN180 M1AFS1500 AFS250 rc oscillator M-LVDS
    Text: Preliminary v1.7 Actel Fusion Mixed-Signal FPGAs Family with Optional ARM® Support Features and Benefits – Frequency: Input 1.5–350 MHz, Output 0.75–350 MHz Low Power Consumption High-Performance Reprogrammable Flash Technology • • • • • Single 3.3 V Power Supply with On-Chip 1.5 V Regulator


    Original     		PDF 130-nm, 128-Bit ACTEL FUSION AFS1500 FlashPro3 PQ208 QN108 QN180 M1AFS1500 AFS250 rc oscillator M-LVDS

    AFS600-FG256

    Abstract: zo 103 ma 75 607 A54 ZENER flashpro3 schematic mark AT0 Unipolar PC atx 400 P4 power supply diagram zener Diode B23 PQ208 QN108 QN180
    Text: Preliminary v1.7 Actel Fusion Mixed-Signal FPGAs Family with Optional ARM® Support Features and Benefits – Frequency: Input 1.5–350 MHz, Output 0.75–350 MHz Low Power Consumption High-Performance Reprogrammable Flash Technology • • • • • Single 3.3 V Power Supply with On-Chip 1.5 V Regulator


    Original     		PDF 130-nm, 128-Bit AFS600-FG256 zo 103 ma 75 607 A54 ZENER flashpro3 schematic mark AT0 Unipolar PC atx 400 P4 power supply diagram zener Diode B23 PQ208 QN108 QN180

    A54 ZENER

    Abstract: AFS600-FG256 mark AT0 QN108 CORE8051 bipolar ROM
    Text: v2.0 Actel Fusion Family of Mixed-Signal FPGAs Features and Benefits In-System Programming ISP and Security High-Performance Reprogrammable Flash Technology Advanced Digital I/O • • • • • Secure ISP with 128-Bit AES via JTAG • FlashLock® to Secure FPGA Contents


    Original     		PDF 128-Bit 130-nm, A54 ZENER AFS600-FG256 mark AT0 QN108 CORE8051 bipolar ROM

    UG628

    Abstract: No abstract text available
    Text: Spartan-6 FPGA Configuration User Guide UG380 v2.5 January 23, 2013 Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		PDF UG380 UG628

    SPARTAN-3 XC3S400 PQ208

    Abstract: SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 tq144 SPARTAN-3 XC3S400 Spartan-3 FPGA Family XC3S4000-FG676 SPARTAN-3 XC3S400 pin SPARTAN-3 XC3S400 architecture XC3S4000FG676 XILINX SPARTAN VQG100
    Text: 06 Spartan-3 FPGA Family: Introduction and Ordering Information R DS099-1 v1.4 January 17, 2005 Preliminary Product Specification Introduction - The Spartan -3 family of Field-Programmable Gate Arrays is specifically designed to meet the needs of high volume,


    Original     		PDF DS099-1 XC3S50CP132, XC3S2000FG456, XC3S4000FG676 DS099-1, DS099-2, DS099-3, DS099-4, DS313, DS314-1, SPARTAN-3 XC3S400 PQ208 SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 tq144 SPARTAN-3 XC3S400 Spartan-3 FPGA Family XC3S4000-FG676 SPARTAN-3 XC3S400 pin SPARTAN-3 XC3S400 architecture XILINX SPARTAN VQG100

    XC3S700AN FGG484

    Abstract: XC3S400AN-FGG400 XC3S700A FGG484 xc3s200an XC3S400AN FGG400 FGG676 SPARTAN 3an XC3S50A XC3S700AN-FG484 XC3S700AN
    Text: Spartan-3AN FPGA Family Data Sheet R DS557 June 2, 2008 Module 1: Introduction and Ordering Information - DS557-1 v3.1 June 2, 2008 • • • • • • • • Introduction Features Architectural Overview Configuration Overview In-system Flash Memory Overview


    Original     		PDF DS557 DS557-1 XC3S50AN. XC3S700AN FG484 XC3S1400AN FGG676 DS557-4 XC3S700AN FGG484 XC3S400AN-FGG400 XC3S700A FGG484 xc3s200an XC3S400AN FGG400 SPARTAN 3an XC3S50A XC3S700AN-FG484

    BLVDS-25

    Abstract: LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000
    Text: Xilinx Virtex-II Series FPGAs and RocketPHY Physical Layer Transceivers Transceiver Blocks 992 88 120 200 264 432 528 624 720 912 1104 1108 Chip Scale Packages CS – wire-bond chip-scale BGA (0.8 mm ball spacing) 144 8 88 92 FF896 92 8 FF1152 BGA Packages (BG) – wire-bond standard BGA (1.27 mm ball spacing)


    Original     		PDF FF896 FF1152 FF11486 10Gbps BLVDS-25 LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    XCV200E Device, FG456 Package

    Abstract: XCV300BG432 BG432 PCI33 XCV200 XCV300 XCV400 XCV400E p146 AE-29
    Text: Application Note - Virtex-E Virtex-E Package Compatibility Guide This package compatibility guide describes the Virtex-E pin-outs and establishes guidelines for package compatibility between Virtex and Virtex-E devices. by Robert Le, Sr. Applications Engineer,


    Original     		PDF XCV200E FG456 XCV200 XCV300E BG432 XCV200E Device, FG456 Package XCV300BG432 PCI33 XCV300 XCV400 XCV400E p146 AE-29

    XCF00S

    Abstract: spartan 3a FGG900 DS099 XCN07010
    Text: ds313.fm Page 1 Friday, April 18, 2008 10:26 AM Spartan-3L Low Power FPGA Family R DS313 v1.2 April 18, 2008 Product Specification This product is undergoing discontinuance. Please refer to XCN07010, Product Discontinuation Notice, for more information on last-time purchases and replacement products.


    Original     		PDF ds313 DS313 XCN07010, SSTL18 XCF00S spartan 3a FGG900 DS099 XCN07010

    SCHEMATIC DIAGRAM OF POWER SAVER DEVICE

    Abstract: diode zener nt 9838 Keller AG am3 socket pinout AT-610 XILINX vhdl code REED SOLOMON NORTEL OC-12 A26 zener w9 0780 specifications for multiplexer of nortel
    Text: Editorial contact: Ann Duft Xilinx, Inc. 408 879-4726 publicrelations@xilinx.com Kathy Keller Oak Ridge Public Relations (408) 253-5042 kathy.keller@oakridge.com Product Marketing contact: Bruce Jorgens Xilinx, Inc. (408) 879-5236 bruce.jorgens@xilinx.com


    Original     		PDF 1998--Dramatically SCHEMATIC DIAGRAM OF POWER SAVER DEVICE diode zener nt 9838 Keller AG am3 socket pinout AT-610 XILINX vhdl code REED SOLOMON NORTEL OC-12 A26 zener w9 0780 specifications for multiplexer of nortel

    XC9572PC44

    Abstract: XC9572-PC44 XCS20XL PQ208 XCS20 PQ208 XC9536-PC44 Xilinx jtag cable Schematic XC95144 PQ100 interfacing cpld xc9572 with keyboard 6552 XC4010XL PQ160
    Text: R Release Document Foundation Series 2.1i Installation Guide and Release Notes July 1999 Read This Before Installation Foundation Series 2.1i Installation Guide and Release Notes R The Xilinx logo shown above is a registered trademark of Xilinx, Inc. FPGA Architect, FPGA Foundry, NeoCAD, NeoCAD EPIC, NeoCAD PRISM, NeoROUTE, Timing Wizard, TRACE,


    Original     		PDF XC2064, XC3090, XC4005, XC5210, XC-DS501 95/98/NT, XC4000 XC9572PC44 XC9572-PC44 XCS20XL PQ208 XCS20 PQ208 XC9536-PC44 Xilinx jtag cable Schematic XC95144 PQ100 interfacing cpld xc9572 with keyboard 6552 XC4010XL PQ160

    a51 ZENER DIODE

    Abstract: transistor 2n2222 bipolar ROM EQUIVALENCES TRANSISTOR LIST ProASIC3 lvds yl 1060
    Text: Revision 3 Fusion Family of Mixed Signal FPGAs Features and Benefits In-System Programming ISP and Security • ISP with 128-Bit AES via JTAG • FlashLock Designed to Protect FPGA Contents High-Performance Reprogrammable Flash Technology • • • •


    Original     		PDF 130-nm, 128-Bit a51 ZENER DIODE transistor 2n2222 bipolar ROM EQUIVALENCES TRANSISTOR LIST ProASIC3 lvds yl 1060

    Untitled

    Abstract: No abstract text available
    Text: Spartan-3A DSP FPGA Family: Complete Data Sheet R DS610 April 2, 2007 Advance Product Specification Module 1: Introduction and Ordering Information • DS610-1 v1.0 April 2, 2007 • • • • • • • Introduction Features Architectural Overview Configuration Overview


    Original     		PDF DS610 DS610-1 DS610-2 UG331: XC3SD1800A XC3SD3400A FG676 DS610-4

    Untitled

    Abstract: No abstract text available
    Text: £ XILINX Virtex 2.5 V Field Programmable Gate Arrays February 16, 1999 Version 1.3 Advance Product Specification Features • • • • • • Fast, high-density Field-Programmable Gate Arrays - Densities from 50k to 1M system gates - System performance up to 200 MHz


    OCR Scan     		PDF 66-MHz 16-bit 32-bit XCV400 XCV600 XCV800 XCV1000 XCV300

    Untitled

    Abstract: No abstract text available
    Text: V ir te x 2 .5 V £ XILINX Field Programmable Gate Arrays May 13, 1999 Version 1.5 Advance Product Specification Features • • • • • • Fast, high-density Field-Programmable Gate Arrays - Densities from 50k to 1M system gates - System performance up to 200 MHz


    OCR Scan     		PDF 66-MHz 16-bit 32-bit Regis00 XCV1000 XCV300 FG680