Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    BF957 Search Results

    SF Impression Pixel

    BF957 Price and Stock

    AMD XC2V6000-4BF957C

    IC FPGA 684 I/O 957FCBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC2V6000-4BF957C Tray
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 -
    		Buy Now

    AMD XC2V2000-4BF957I

    IC FPGA 624 I/O 957FCBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC2V2000-4BF957I Tray
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 -
    		Buy Now

    AMD XC2V3000-5BF957I

    IC FPGA 684 I/O 957FCBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC2V3000-5BF957I Tray
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 -
    		Buy Now

    AMD XC2V6000-5BF957C

    IC FPGA 684 I/O 957FCBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC2V6000-5BF957C Tray
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 -
    		Buy Now

    AMD XC2V6000-5BF957I

    IC FPGA 684 I/O 957FCBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC2V6000-5BF957I Tray
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 -
    		Buy Now
    Find more BF957 price and stock on Findchips.com

    BF957 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    BF957

    Abstract: No abstract text available
    Text: R Plastic Flip-Chip BGA BF957 Package PK043 (v1.0) April 6, 2001 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.


    Original     		PDF BF957) PK043 BF957

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    63b46

    Abstract: B557B
    Text: 2341567896A2 tm 788CDB15EBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBB FBBB-3.& E # > ? : !8B577BF9 2B


    Original     		PDF 2341567896A2 88CDB15EBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBB 507AB8 987C5- 5A89A FD543 6789AB8CD@ 9F579F5F 079B8 63b46 B557B

    Untitled

    Abstract: No abstract text available
    Text: BB 234567896A2 tm 788CDB5EBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBB FBBB.34+ E'' $ E = !8B587BF9


    Original     		PDF 234567896A2 5A89A FD543 6789AB8CDG 9F579F5F BFD57 575C7 56789AB8CD5EF BF598

    BF895

    Abstract: No abstract text available
    Text: 9AB9CD7E8F555555555555555555555555555555555 E35B59 2 8F7*+58F+5,7#3 9%2' A'"-%" ? E,/5%5435,5$3 /@5& E5%543&-5*5%54 $B8#5 +B7FC5 0;E62$5 8#5 9DAFD5 #8'5 6789AB8CD5 EF8ADA9B#5 7D7AF5 !F9$9FAB5 9AF##5 B75 B7#5 :FF5


    Original     		PDF 6789AB8CD5 FA87CC35 95EF9 CF5123445367T FCC80 9CD-54 3989FT 08CCF9 6789AB8CD 6789AB8CD5EF BF895

    AB p89

    Abstract: No abstract text available
    Text: tm 8474 ABFDBBFC7F8F447 ! "8#B5EFFD5E8AB8#$5995%5&3 /BF5 666233E5 8 5 75 0977 5 9FA88F95 8B5 C5 979D C7#F5D95/B8 5DF8AF58 58FDFD595 F57 59FFBFFC8#57D


    Original     		PDF 8AF58 FA87CC 987C57 DF5555552 DF555 389FP 6789AB8CDQ 6789AB8CD5EF 5EF98F AB p89

    CLK180

    Abstract: MULT18X18 XAPP622 XC2V3000-FF1152 XC2V3000FF1152 sdr receiver
    Text: Application Note: Virtex-II Series R 644-MHz SDR LVDS Transmitter/Receiver Author: Ed McGettigan XAPP622 v1.2 July 2, 2002 Summary This application note describes single data rate (SDR) transmitter and receiver interfaces operating at up to 644 MHz, using 17 Low-Voltage Differential Signaling (LVDS) pairs (one


    Original     		PDF 644-MHz XAPP622 XC2V3000-FF1152 CLK180 MULT18X18 XAPP622 XC2V3000-FF1152 XC2V3000FF1152 sdr receiver

    XC2V1000 Pin-out

    Abstract: Virtex-II MAKING A10 BGA matrix m21 IEEE1532 XC2V1000 XC2V1500 XC2V250 XC2V40 XC2V500
    Text: Virtex-II 1.5V Field-Programmable Gate Arrays R DS031-1 v1.7 October 2, 2001 Advance Product Specification Summary of Virtex -II Features • Industry First Platform FPGA Solution • IP-Immersion Architecture - Densities from 40K to 8M system gates


    Original     		PDF DS031-1 18-Kbit 18-bige. XC2V1500 FG676 FF1152, FF1517, BF957 DS031-3, DS031-1, XC2V1000 Pin-out Virtex-II MAKING A10 BGA matrix m21 IEEE1532 XC2V1000 XC2V250 XC2V40 XC2V500

    datasheet transistor said horizontal tt 2222

    Abstract: interface of rs232 to UART in VHDL xc9500 80C31 instruction set apple ipad schematic drawing 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic apple ipad Apple iPad 2 panasonic inverter dv 700 manual TT 2222 Horizontal Output Transistor pins out
    Text: Virtex-II Platform FPGA User Guide UG002 v2.2 5 November 2007 R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG002 datasheet transistor said horizontal tt 2222 interface of rs232 to UART in VHDL xc9500 80C31 instruction set apple ipad schematic drawing 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic apple ipad Apple iPad 2 panasonic inverter dv 700 manual TT 2222 Horizontal Output Transistor pins out

    12x12 bga thermal resistance

    Abstract: XC2V6000-ff1152 xc2v3000fg XC2V3000-FG676 smd transistor J6 pin XC2V3000-BG728 XC2V80 IO-L93N UG002 Printed Circuit Boards PCB
    Text: R Chapter 4 PCB Design Considerations 1 Summary This chapter covers the following topics: • • • • • • • • • • 2 Pinout Information Pinout Diagrams Package Specifications 3 Flip-Chip Packages Thermal Data Printed Circuit Board Considerations


    Original     		PDF UG002 CS144: FG256, FG456, FG676: FF896, FF115XC2V40 CS144 XC2V40 FG256 12x12 bga thermal resistance XC2V6000-ff1152 xc2v3000fg XC2V3000-FG676 smd transistor J6 pin XC2V3000-BG728 XC2V80 IO-L93N UG002 Printed Circuit Boards PCB

    FG676

    Abstract: PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 TQ100 TQ128 TQ144 TQ176 VQ100 FG676 PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100

    1156-BALL

    Abstract: bga 896 411PI BF957 132-ball package
    Text: DataSource CD-ROM Q1-02 Contents Package Drawings Products Guide Product Data Sheets Package Drawings Packaging and Thermal Characteristics Application Notes White Papers Software/Hardware Manuals Xcell Journal Online Xcell Journal Archives Inside Out Columns


    Original     		PDF Q1-02 XAPP415 CG1156 CB100 CB164 CB196 CB228 PG120 PG132 PG156 1156-BALL bga 896 411PI BF957 132-ball package

    4x4 unsigned multiplier VERILOG coding

    Abstract: vhdl code for lvds driver 32x32 multiplier verilog code MULT18X18 12v relay interface with cpld in vhdl verilog/verilog code for lvds driver 80C31 instruction set vhdl code for 18x18 unSIGNED MULTIPLIER vhdl pulse interval encoder book national semiconductor
    Text: R Chapter 2 Design Considerations Summary This chapter covers the following topics: • • • • • • • • • • • • • • • • • Rocket I/O Transceiver Processor Block Global Clock Networks Digital Clock Managers DCMs Block SelectRAM Memory


    Original     		PDF UG012 4x4 unsigned multiplier VERILOG coding vhdl code for lvds driver 32x32 multiplier verilog code MULT18X18 12v relay interface with cpld in vhdl verilog/verilog code for lvds driver 80C31 instruction set vhdl code for 18x18 unSIGNED MULTIPLIER vhdl pulse interval encoder book national semiconductor

    MS-034-AAn-1

    Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 BF957 BG225 BG256 BG352 BG432 BG492 BG560 BG575 BG728 MS-034-AAn-1 ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002

    wireless encrypt

    Abstract: BF957
    Text: Virtex-II 1.5V Field-Programmable Gate Arrays R DS031 v1.1 December 6, 2000 Advance Product Specification Summary of Virtex -II Features • • Industry First Platform FPGA solution IP-Immersion architecture - Densities from 40K to 10M system gates


    Original     		PDF DS031 18-Kbit wireless encrypt BF957

    QF32

    Abstract: FG320 FF668 BF957 FF1513 CP132 PQ100 FF1148 TQ144 TQ176
    Text: TQFP VQFP TQ176 TQ160 TQ144 TQ100 22.0 x 22.0 mm 0.5 mm 26.0 x 26.0 mm (0.5 mm) 26.0 x 26.0 mm (0.5 mm) VQ64 12.0 x 12.0 mm (0.8 mm) 12.0 x 12.0 mm (0.5 mm) 9/18/07 16.0 x 16.0 mm (0.5 mm) VQ100 VQ44 MPM_1498_pmatrices_Q307_r1.qxd 22 16.0 x 16.0 mm (0.5 mm)


    Original     		PDF TQ176 TQ160 TQ144 TQ100 VQ100 HQ/PQ208 HQ304 HQ/PQ240 HQ/PQ160 PQ100 QF32 FG320 FF668 BF957 FF1513 CP132 PQ100 FF1148 TQ144 TQ176

    AB38R

    Abstract: tag l9 225 400 XC2VP20 XC2VP50
    Text: Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.0 June 13, 2002 Advance Product Specification Summary of Virtex-II Pro Features • • High-performance Platform FPGA solution including - Up to twenty-four Rocket I/O™ embedded multi-gigabit transceiver blocks (based on


    Original     		PDF DS083-1 18-bit and255-7778 DS083-4 AB38R tag l9 225 400 XC2VP20 XC2VP50

    B57513

    Abstract: 58A9
    Text: CDEA9FACBA9888888888888888888888888888888888 68E46776281C2 A*+899,-+89.F"3 C63#76& D6&27!/3!4 D E-05%52 2435-5$8 0 E5' E5%543'.5+5%54333 $B8#5 ,B7FC5 5?E67$5 8#5 9DAFD5 #8 5 6789AB8CD5 EF8ADA9J#5 7D7AF5 !F9$9FAB5 9AF##5 B75 B7#5 >FF5


    Original     		PDF CBA9888888888888888888888888888888888 6789AB8CD5 FA87CC85 F59FA F985AB79 D85D8 BC85F" 95EF9 433G5H B57513 58A9

    B57513

    Abstract: ed51
    Text: E35B5 !9"2 8D7,-58.7F-5C/D%3 9'2 A)$0'$ C &B8%5 .B7FC5 3=E64&5 8%5 9DAFD5 %8*5 6789AB8CD5 F%FA87CC55 78C9FD5 5 888GF5 BF5 .%7F5 9F%8%7AF5 7D5 5F5


    Original     		PDF 7CDE8DF555555555555555555555555555555555 6789AB8CD5 FA87CC55 95D98 123445367T FCC83 38CCF9 6789AB8CDU 6789AB8CD5EF 5EF98F B57513 ed51

    FF1152

    Abstract: UG002 BG728 BF957 FG676 led flip-chip CS144 FG256 BGA Package
    Text: R Chapter 4: PCB Design Considerations Package Specifications This section contains specifications for the following Virtex-II packages: 426 • "CS144 Chip-Scale BGA Package 0.80 mm Pitch " on page 427 • "FG256 Fine-Pitch BGA Package (1.00 mm Pitch)" on page 428


    Original     		PDF FG256 FG456 FG676 BG575 BG728 FF896 FF1152 FF1517 CS144 UG002 UG002 BF957 led flip-chip BGA Package

    ra1613

    Abstract: FB360 HSTL18 XC2V3000-BG728 XC3S1000-FT256 XC3S200-ft256 X2P376 X2P528 X2P680 BGA 728 35x35 1.27
    Text: XPressArray-II 0.15mm Structured ASIC Data Sheet 1.0 Key Features • Next-generation 0.15mm hybrid structured ASIC • Initializable distributed memory at speeds up to 210MHz • Platform for high-performance 1.5V/1.2V ASICs and FPGAto-ASIC conversions • Configurable signal, core and I/O power supply pin locations


    Original     		PDF 210MHz PCI33, PCI66, ra1613 FB360 HSTL18 XC2V3000-BG728 XC3S1000-FT256 XC3S200-ft256 X2P376 X2P528 X2P680 BGA 728 35x35 1.27

    XC2V1500

    Abstract: XC2V80 XC2V1000 XC2V2000 XC2V250 XC2V40 XC2V500 lightning event counter AF124 XC2V4000
    Text: Virtex -II Platform FPGAs: Introduction and Overview R DS031-1 v1.9 September 26, 2002 Advance Product Specification Summary of Virtex-II Features • Industry First Platform FPGA Solution • IP-Immersion Architecture - Densities from 40K to 8M system gates


    Original     		PDF DS031-1 18-bit 18-bit BG728 DS031-4 XC2V1500 XC2V80 XC2V1000 XC2V2000 XC2V250 XC2V40 XC2V500 lightning event counter AF124 XC2V4000

    BG728

    Abstract: CS144 FG256 FG676 xc2v1000 AE38 65B11 AF124 J377 Model 435 load cell
    Text: Virtex -II Platform FPGAs: Complete Data Sheet R DS031 October 14, 2003 Product Specification This document includes all four modules of the Virtex-II Platform FPGA data sheet. Module 1: Introduction and Overview Module 3: DC and Switching Characteristics


    Original     		PDF DS031 DS031-1 DS031-3 DS031-2 CS144) FG256) BG728) FF1152) BF957) DS031-4 BG728 CS144 FG256 FG676 xc2v1000 AE38 65B11 AF124 J377 Model 435 load cell

    Virtex-6 reflow

    Abstract: WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320
    Text: Device Reliability Report First Quarter 2010 UG116 v5.9 May 4, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, p∅ost, or transmit the


    Original     		PDF UG116 611GU FGG676 FFG1152 Virtex-6 reflow WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320