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    FeNi42

    Abstract: Cu6Sn5 sn-pb-ag solder paste
    Text: Whisker Formation on Tin Plated FeNi42 Results and Conclusion 29 October 2004 Outline • Introduction • Experimental procedure and inspection • Results • Summary and Conclusions Introduction Major mechanism and conditions for whisker formation FeNi42


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    FeNi42 FeNi42= FeNi42 SnPb10 Cu6Sn5 sn-pb-ag solder paste PDF

    FeNi42

    Abstract: whisker TSOP-II-54 "leadframe material" DIP
    Text: 06-June-03 Back-Up Block 2 Whisker on NiFe Whisker on NiFe 06-June-03 Ambient storage tin plated FeNi42 length of longest whisker in µm 10 TSOPII-54 FeNi42 ambient storage 8 3,7 µm Sn 6,6 µm Sn 9,5 µm Sn 6 11,7 µm Sn 14,7 µm Sn 4 2 time in days 100


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    06-June-03 FeNi42 TSOPII-54 FeNi42) FeNi42 whisker TSOP-II-54 "leadframe material" DIP PDF

    SIL03-1A72-71D

    Abstract: FeNi42
    Text: Europe: +49 / 7731 8399 0 | Email: info@meder.com Artikel Nr.: USA: +1 / 508 295 0771 | Email: salesusa@meder.com Asia: +852 / 2955 1682 | Email: salesasia@meder.com 3303172171 Artikel: SIL03-1A72-71D Spulendaten bei 20 °C Spulenwiderstand Spulenspannung


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    SIL03-1A72-71D 1A72-71D SIL03-1A72-71D FeNi42 PDF

    SIL03-1A72-71L

    Abstract: No abstract text available
    Text: Europe: +49 / 7731 8399 0 | Email: info@meder.com Item No.: USA: +1 / 508 295 0771 | Email: salesusa@meder.com Asia: +852 / 2955 1682 | Email: salesasia@meder.com 3303172071 Item: SIL03-1A72-71L Conditions Coil Data at 20 °C Coil resistance Coil voltage Rated power


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    SIL03-1A72-71L SIL03-1A72-71L PDF

    AgCu28

    Abstract: No abstract text available
    Text: CHAPTER 7 ENVIRONMENTAL INFORMATION page Introduction 7-2 Explanation of the tables 7-2 General safety remarks 7-5 Substances not used by Philips Semiconductors 7-6 Disposal and recycling 7-7 General warnings 7-7 Chemical content tables: Diodes Transistors


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    SC-74 OT457 representiveSOT23 FeNi42 SnPb20 AgCu28 PDF

    Cu6Sn5

    Abstract: FeNi42 Infineon diffusion solder smema smema specifications transistor k81 leadframe materials olin 7025
    Text: Tin Whisker Formation – Results, Test Methods and Countermeasures Dittes, M*.; Oberndorff, P*.; Petit, L.* *Infineon Technologies, * Philips CFT, * STMicroelectronics Abstract Electroplated tin layers as used as lead-free solderable finish on the terminations of semiconductor devices are


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    3at2

    Abstract: MN102 PANASONIC pic writer
    Text: MICROCOMPUTER MN102H MN102H60G/60K/F60G/F60K LSI User’s Manual Pub.No.22360-013E PanaX Series is a trademark of Matsushita Electric Industrial Co., Ltd. The other corporation names, logotype and product names written in this book are trademarks or registered trademarks of their


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    MN102H MN102H60G/60K/F60G/F60K 22360-013E 3at2 MN102 PANASONIC pic writer PDF

    Infineon diffusion solder

    Abstract: Cu6Sn5 C1870 equivalent transistor of C1870 Olin-194 C70250 C19400 C14415 F-38019 OLIN194
    Text: Tin Whiskers on Lead-free Platings P.J.T.L. Oberndorff1, M. Dittes2, L. Petit3, C.C. Chen4, J. Klerk1 and E.E. de Kluizenaar1 Philips, Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 1000944, D-93009 Regensburg, Germany, marc.dittes@infineon .com


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    D-93009 F-38019 Infineon diffusion solder Cu6Sn5 C1870 equivalent transistor of C1870 Olin-194 C70250 C19400 C14415 OLIN194 PDF

    SIL05-1A7

    Abstract: No abstract text available
    Text: Europe: +49 / 7731 8399 0 | Email: info@meder.com Item No.: USA: +1 / 508 295 0771 | Email: salesusa@meder.com Asia: +852 / 2955 1682 | Email: salesasia@meder.com 3305100571 Item: SIL05-1A72-71MHR Conditions Coil Data at 20 °C Coil resistance Coil voltage


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    SIL05-1A72-71MHR SIL05-1A7 PDF

    ALLOY leadframe C7025

    Abstract: ALLOY leadframe C7025 material property C19400 leadframe materials C18070 leadframe C7025 Cu6Sn5 MF202 C7025 c14415
    Text: Whisker Testing: Reality or Fiction? P. Oberndorff 1, M. Dittes2, P. Crema 3 1 Philips Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 100944, D-93009 Regensburg, Germany,


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    D-93009 ALLOY leadframe C7025 ALLOY leadframe C7025 material property C19400 leadframe materials C18070 leadframe C7025 Cu6Sn5 MF202 C7025 c14415 PDF

    FeNi42

    Abstract: C18070 LF-304 53RD J-STD-004 leadframe materials CuCrSiTi FeNi42-leadframe lf304 Cu6Sn5
    Text: Whisker Root Cause and Respective Test Conditions Dittes, M*.; Oberndorff, P*.; Crema, P.* *Infineon Technologies, * Philips CFT, * STMicroelectronics marc.dittes@infineon.com pascal.oberndorff@philips.com paolo.crema@st.com Abstract Electroplated Tin on leadframe components is the leadfree alternative to SnPb plating of widest use worldwide.


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    LF-304, FeNi42 C18070 LF-304 53RD J-STD-004 leadframe materials CuCrSiTi FeNi42-leadframe lf304 Cu6Sn5 PDF

    SIL03-1A72-71L

    Abstract: No abstract text available
    Text: Europe: +49 / 7731 8399 0 | Email: info@meder.com Artikel Nr.: USA: +1 / 508 295 0771 | Email: salesusa@meder.com Asia: +852 / 2955 1682 | Email: salesasia@meder.com 3303172071 Artikel: SIL03-1A72-71L Spulendaten bei 20 °C Spulenwiderstand Spulenspannung


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    SIL03-1A72-71L SIL03-1A72-71L PDF

    UWE W22

    Abstract: mn102 MN102H60 BF400 X1000 16x16 LED Matrix DM 311 BG 35 EW23 MN102H60K MN10200
    Text: MICROCOMPUTER MN102H00 MN102H60G/60K/F60G/F60K LSI User's Manual Pub.No.22360-011E PanaXSeries is a trademark of Matsushita Electric Industrial Co., Ltd. The other corporation names, logotypes and product names written in this manual are trademarks or registered trademarks


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    MN102H00 MN102H60G/60K/F60G/F60K 22360-011E MN102HF60G/F60K UWE W22 mn102 MN102H60 BF400 X1000 16x16 LED Matrix DM 311 BG 35 EW23 MN102H60K MN10200 PDF

    UWE W22

    Abstract: EW23 mn102 16x16 LED Matrix mark AT0 rs232c protocol MN10200 MN102H00 MN102HF55G 70an
    Text: MICROCOMPUTER MN102H00 MN102H55D/55G/F55G LSI User's Manual Pub.No.22355-020E PanaXSeries is a trademark of Matsushita Electric Industrial Co., Ltd. The other corporation names, logotypes and product names written in this manual are trademarks or registered trademarks


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    MN102H00 MN102H55D/55G/F55G 22355-020E MN102HF55G UWE W22 EW23 mn102 16x16 LED Matrix mark AT0 rs232c protocol MN10200 MN102H00 70an PDF

    sil24-1a72-71d

    Abstract: No abstract text available
    Text: Europe: +49 / 7731 8399 0 | Email: info@meder.com Item No.: USA: +1 / 508 295 0771 | Email: salesusa@meder.com Asia: +852 / 2955 1682 | Email: salesasia@meder.com 3324100171 Item: SIL24-1A72-71D Conditions Coil Data at 20 °C Coil resistance Coil voltage Rated power


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    SIL24-1A72-71D sil24-1a72-71d PDF

    sil05-1a72-71qhr

    Abstract: No abstract text available
    Text: Europe: +49 / 7731 8399 0 | Email: info@meder.com Item No.: USA: +1 / 508 295 0771 | Email: salesusa@meder.com Asia: +852 / 2955 1682 | Email: salesasia@meder.com 3305172871 Item: SIL05-1A72-71QHR Conditions Coil Data at 20 °C Coil resistance Coil voltage


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    SIL05-1A72-71QHR sil05-1a72-71qhr PDF

    3324190071

    Abstract: No abstract text available
    Text: Europe: +49 / 7731 8399 0 | Email: info@meder.com Item No.: USA: +1 / 508 295 0771 | Email: salesusa@meder.com Asia: +852 / 2955 1682 | Email: salesasia@meder.com 3324190071 Item: SIL24-1B90-71L Conditions Coil Data at 20 °C Coil resistance Coil voltage Rated power


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    SIL24-1B90-71L 3324190071 PDF

    C18070

    Abstract: Atotech c14415 Cu6Sn5 C18090 olin 194 Olin-194 CuCrSiTi Cu3Sn FeNi42
    Text: Whisker Formation on Tin Plated Cu based Leadframes Results and Conclusion 29 October 2004 Content • • • • • Introduction Experience E4 Main cause whisker growth on Cu LF Countermeasures Conclusions Introduction Period of potential whisker growth


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    FeNi42 ST-150 ST-200 150oC C18070 Atotech c14415 Cu6Sn5 C18090 olin 194 Olin-194 CuCrSiTi Cu3Sn PDF

    On semiconductor date Code sot-143

    Abstract: TR13
    Text: Package Details - SOT-143 Mechanical Drawing Lead Code: Part Marking: 2-4 Character Alpha/Numeric Code. Reference individual device datasheet. Mounting Pad Geometry Dimensions in mm Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m R2 (5-December 2003)


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    OT-143 EIA-481-1-A FeNi42 SnPb10 11-February On semiconductor date Code sot-143 TR13 PDF

    Untitled

    Abstract: No abstract text available
    Text: Europe: +49 / 7731 8399 0 | Email: info@meder.com Item No.: USA: +1 / 508 295 0771 | Email: salesusa@meder.com Asia: +852 / 2955 1682 | Email: salesasia@meder.com 3303172271 Item: SIL03-1A72-71M Conditions Coil Data at 20 °C Coil resistance Coil voltage Rated power


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    SIL03-1A72-71M PDF

    TRANSISTOR SMD CODE PACKAGE SOT89 52 10A

    Abstract: smd transistor g1-L philips ic06 cmos databook Soldering guidelines and SMD footprint design MSB430 Philips Components, Soft Ferrites Data Handbook M display dc05 humidity sensor philips H1 soft ferrites philips handbook Philips Components, Soft Ferrites Data Handbook
    Text: SC18_1999_.book : SC18_PREFACE_1999 i Wed May 12 11:40:55 1999 Philips Semiconductors Discrete Semiconductor Packages Preface TABLE OF CONTENTS Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii


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    SnPb36Ag2

    Abstract: Lead Free reflow soldering profile BGA Infineon diffusion solder semiconductors cross reference philips pb-free products FeNi42 BGA Ball Crack VSO56 BGA and QFP Package freescale HTQFP100
    Text: Lead-free packaging for semiconductor devices E4 presentation Infineon Technologies / ST Microelectronics / Philips Semiconductors / Freescale Semiconductor 24 March 2005 Content 1 2 3 4 5 6 7 8 9 Aim of this document Legislation Target / Status Standardisation


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    2002/95/E SnPb36Ag2 Lead Free reflow soldering profile BGA Infineon diffusion solder semiconductors cross reference philips pb-free products FeNi42 BGA Ball Crack VSO56 BGA and QFP Package freescale HTQFP100 PDF

    CuCrSiTi

    Abstract: k75 leadframe "leadframe material" DIP 20 INFINEON cross reference FeNi42 solderability
    Text: Solderability 06-June-03 Back Up Block 3 Solderability Solderability Source: STMicroelectronics 06-June-03 SO 8 Wetting force mN/mm No forced ageing Ageing : 16H150°C Good solderability of Sn coated components in SnPb Wetting balance test 235°C Zero cross time << 3 seconds


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    06-June-03 16H150 10mN/mm 10seconds 06-Junitial CuCrSiTi k75 leadframe "leadframe material" DIP 20 INFINEON cross reference FeNi42 solderability PDF

    SIL24-1A72-71Q

    Abstract: No abstract text available
    Text: Europe: +49 / 7731 8399 0 | Email: info@meder.com Item No.: USA: +1 / 508 295 0771 | Email: salesusa@meder.com Asia: +852 / 2955 1682 | Email: salesasia@meder.com 3324172371 Item: SIL24-1A72-71Q Conditions Coil Data at 20 °C Coil resistance Coil voltage Rated power


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    SIL24-1A72-71Q SIL24-1A72-71Q PDF