ASE BGA Search Results

ASE BGA Result Highlights (5)

Part	Manufacturer	Description
MPC860PZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860PVR80D4	Rochester Electronics LLC	32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC855TCZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860TCZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860ENZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357

ASE BGA Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
99043 Abstract: bga 388 140C JESD22 ASE BGA Text: Cypress Semiconductor Qualification Report QTP# 99043 VERSION 1.0 May, 1999 388 Ld BGA Package ASE, Taiwan Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Cypress Semiconductor Quality and Reliability Department Cypress Semiconductor Assembly: ASE, Taiwan	Original	388Ld 30C/60 CY37512P352-BG 99043 bga 388 140C JESD22 ASE BGA	PDF
130C Abstract: JESD22 Ablebond 8355 Text: Cypress Semiconductor Qualification Report QTP# 98193 VERSION 1.0 December, 1998 292-Pin BGA Package ASE, Taiwan Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Cypress Semiconductor Quality and Reliability Department Cypress Semiconductor Assembly: ASE, Taiwan	Original	292-Pin 30C/60 CY37256P256-BGC 7C37652AF-GBGC 130C JESD22 Ablebond 8355	PDF
PCN0113 Abstract: BGA and QFP Package EP20K1500E EP20K400E EPC16 Text: PROCESS CHANGE NOTICE PCN0113 ADDITIONAL ASSEMBLY LOCATION Change Description: Altera is adding FineLine BGAä and QFP package capability at ASE’s assembly location in Kaohsiung, Taiwan. Reason For Change: ASE Malaysia is already a strategic manufacturing partner for Altera’s existing products.	Original	PCN0113 EP20K1500E EP20K400E EPC16, EP20K400E, PCN0113 BGA and QFP Package EPC16	PDF
Untitled Abstract: No abstract text available Text: QUALIFICATION REPORT 10/12/09 QUALITY ENG : PART NUMBER MICREL QA/REL KSZ8692PB/KSZ9692PB PACKAGE TYPE : LOT # ASSEMBLY LOC FAB LOC PROCESS KSZ8692PB 400 pin BGA P62030-0AMEF ASE TSMC 0.13 um KSZ9692PB 400 pin BGA P62030-0AMEE ASE TSMC 0.13 um QUAL VEHCIELS:	Original	KSZ8692PB/KSZ9692PB KSZ8692PB P62030-0AMEF KSZ9692PB P62030-0AMEE KSZ8692PB. KSZ9692PB JESD22-A108	PDF
PCN0415 Abstract: HC100-XJ Nitto Denko HC100-XJ Denko trace code altera HC100 HC100XJAA altera top marking nitto hc100 altera marking Text: PROCESS CHANGE NOTIFICATION PCN0415 ADDITIONAL MOLD COMPOUND FOR FBGA PACKAGES FROM ASE MALAYSIA Change Description: The Nitto Denko HC100-XJ series mold compound is being added as an additional mold compound choice for Altera FineLine BGA® packages assembled at ASE Malaysia. This change does not affect form, fit or function.	Original	PCN0415 HC100-XJ HC100-XJAA PCN0415 Nitto Denko HC100-XJ Denko trace code altera HC100 HC100XJAA altera top marking nitto hc100 altera marking	PDF
ADV9912 Abstract: MO-151 Assembly Locations Text: CUSTOMER ADVISORY FineLine BGA Packages Altera is adding ASAT and ASE as additional sources of supply for the FineLine BGA packages currently assembled by ANAM in the Philippines and Korea. This change will affect the FineLine BGA package outline thickness*, which will result in a	Original	MO-151. ADV9912 ADV9912 MO-151 Assembly Locations	PDF
SY68730ZC Abstract: MIC29302BT SY68730 sy10s897 0343a KS8721BL Unisem tsmc cmos tsmc cmos 0.35 KSZ8695PX Text: Autoclave Pressure Pot Test + 121C / 15 PSIG (With Pre-con 3X Reflow ) MSL Pkg Lds Device D/C Process Qty Hours Rej Assembler L3 L3 L3 L3 BGA BGA BGA BGA 289 289 289 289 KS8695PX KS8695PX KS8695PX KSZ8695PX 0407 0421A 0417A 0452A TSMC .18 TSMC .18 TSMC .18	Original	KS8695PX KSZ8695PX KS8721BL KS8995M KS8995X KS8995E SY68730ZC MIC29302BT SY68730 sy10s897 0343a KS8721BL Unisem tsmc cmos tsmc cmos 0.35 KSZ8695PX	PDF
PCN0712 Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100 Text: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array BGA , Ultra FineLine Ball-Grid Array (UBGA), Micro FineLine Ball-Grid Array	Original	PCN0712 CEL-9750ZHF10AKL GE-100LFCS GE-100LFCS PCN0712 GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100	PDF
sy10s897jc Abstract: cmos tsmc 0.18 A103267 0.18 tsmc BCD sy10s897 MIC29300BU BGA289 Unisem MIC2287 SPN860003 Text: EXTENDED TEMPERATURE CYCLE Ta Delta = -65C to +150C MSL Pkg Lds Device D/C Process Qty Cyc. L3 BGA 289 KS8695PX 0421A L3 BGA 289 KS8695PX 0407 L1 L1 P.DIP P.DIP 24 40 MIC59P50 MIC10937P L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2	Original	KS8695PX MIC59P50 MIC10937P MIC2214PM MIC2198 SY88953L MIC2550 sy10s897jc cmos tsmc 0.18 A103267 0.18 tsmc BCD sy10s897 MIC29300BU BGA289 Unisem MIC2287 SPN860003	PDF
KE-G1250 Abstract: KE-G1250 mold compound KEG1250LKDS PI7C8150BNDIE-33 JESD22-A-113-E JESD22-A113E PI7C8150BND reflow profile PBGA 256 reflow profile PI7C8150BNDE QA-1800 Text: Pericom Semiconductor Corp. • 3545 North First St. • San Jose, CA 95134 • USA PRODUCT/PROCESS CHANGE NOTICE PCN PCN Number: 10-04 Means of Distinguishing Changed Devices: Date Issued: September 10, 2010 Product Mark Product(s) Affected: PI7C8150x (see affected part number list)	Original	PI7C8150x KE-G1250 PD-2016 MS-034B/AAF-1 256-Pin, KE-G1250 mold compound KEG1250LKDS PI7C8150BNDIE-33 JESD22-A-113-E JESD22-A113E PI7C8150BND reflow profile PBGA 256 reflow profile PI7C8150BNDE QA-1800	PDF
PCN0214 Abstract: Altera bga BGA PACKAGE OUTLINE 672-BALL EP1M120 EP20K1000E EPXA10 amkor flip alsic Text: PROCESS CHANGE NOTICE PCN0214 Copper Lid for Selected Altera BGA and FineLine BGA® Packages Change Description: Altera will be transitioning to an industry-standard copper lid, for its flip-chip BGA and flip-chip FineLine BGA package offerings. Reason for Change:	Original	PCN0214 packagesK1500E 1020-Ball EP20K600E 672-Ball EP20K400 EP20K400E PCN0214 Altera bga BGA PACKAGE OUTLINE EP1M120 EP20K1000E EPXA10 amkor flip alsic	PDF
On semiconductor date Code Abstract: AND8002 AA MARKING CODE SO8 on alpha year and work week date code for semiconductor MOTOROLA LOT MARKINGS On semiconductor LQFP-52 motorola MARKING CODE SO-8 ON Semiconductor marking code Text: AND8002/D ECLinPS , ECLinPS Lite™, ECLinPS Plus™, ECLinPS MAX™, and GigaComm™ Marking and Ordering Information Guide http://onsemi.com APPLICATION NOTE Prepared by: Paul Shockman ON Semiconductor HFPD Applications Engineer Introduction This application note describes the device markings and	Original	AND8002/D On semiconductor date Code AND8002 AA MARKING CODE SO8 on alpha year and work week date code for semiconductor MOTOROLA LOT MARKINGS On semiconductor LQFP-52 motorola MARKING CODE SO-8 ON Semiconductor marking code	PDF
On semiconductor date Code Abstract: motorola MARKING CODE SO-8 MOTOROLA LOT MARKINGS BRD8011/D marking code motorola ic Date Code Formats motorola traceability code 2012 Identification Traceability marking code onsemi Diode date sheet of ba for the year 2011 Text: AND8002/D ECLinPS , ECLinPS Lite™, ECLinPS Plus™, ECLinPS MAX™, and GigaComm™ Marking and Ordering Information Guide http://onsemi.com APPLICATION NOTE Prepared by: Paul Shockman ON Semiconductor HFPD Applications Engineer Introduction This application note describes the device markings and	Original	AND8002/D On semiconductor date Code motorola MARKING CODE SO-8 MOTOROLA LOT MARKINGS BRD8011/D marking code motorola ic Date Code Formats motorola traceability code 2012 Identification Traceability marking code onsemi Diode date sheet of ba for the year 2011	PDF
ASE BGA Abstract: tsmc mos 45 7C37655B CY37256 Text: Cypress Semiconductor Product Qualification Report QTP# 99457 Revision 1.3 September 2000 High-Performance CPLDs Family CY37192P CY37192VP UltraLogic 192 Macrocell ISR™ CPLDs CY37256P CY37256VP UltraLogic™ 256 Macrocell ISR™ CPLDs CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:	Original	CY37192P CY37192VP CY37256P CY37256VP CY37192 /CY37256* CY37256P160-AC ASE BGA tsmc mos 45 7C37655B CY37256	PDF

HEL16 Abstract: DEVICE MARKING CODE table onsemi marking marking code onsemi marking code onsemi Diode kel33 on semiconductor traceability marking soic HEL32 HEL12 HEL31 HEL05 Text: AND8002/D ECLinPS, ECLinPS Lite, ECLinPS Plus, ECLinPS MAX, and GigaComm Marking and Ordering Information Guide http://onsemi.com APPLICATION NOTE Prepared by: Paul Shockman ON Semiconductor HFPD Applications Engineer Introduction This application note describes the device markings and	Original	AND8002/D HEL16 DEVICE MARKING CODE table onsemi marking marking code onsemi marking code onsemi Diode kel33 on semiconductor traceability marking soic HEL32 HEL12 HEL31 HEL05	PDF
lucent LXE Abstract: edi pb10 intel 4040 DSP16000 DSP-16000 DS98-032WTEC DSP16210 T178 S 1100 EDB AB14 t197 Text: Data Addendum July 2000 Dual Power Supply Version of the DSP16210 Digital Signal Processor Introduction A dual-supply version of the DSP16210 has been implemented in 0.25 µm process technology with the following features: „ Dual power supplies of 3.3 V and 2.5 V:	Original	DSP16210 DSP16210 144-pin 169-ball DSP16000 lucent LXE edi pb10 intel 4040 DSP-16000 DS98-032WTEC T178 S 1100 EDB AB14 t197	PDF
CY37512VP208-UMB Abstract: diagram PRESSURE cooker tsmc mos 45 CY37512 CY37384 Text: Cypress Semiconductor Product Qualification Report QTP# 000605 VERSION 1.0 September, 2000 High-Performance CPLDs Family CY37384P208/ CY37384VP208 UltraLogic 384-Macrocell ISR™ CPLDs CY37512P208/ CY37512VP208 UltraLogic™ 512-Macrocell ISR™ CPLDs CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:	Original	CY37384P208/ CY37384VP208 384-Macrocell CY37512P208/ CY37512VP208 512-Macrocell CY37384 /CY37512* CY37256P160-AC CY37512VP208-UMB diagram PRESSURE cooker tsmc mos 45 CY37512	PDF
l9938 Abstract: K9950 h9940 l9923 L9939 l9940 z9936 z9939 l9934 PQFP208 drawing Text: INTEGRATED DEVICE TECHNOLOGY, INC. QUALITY & RELIABILITY MONITORS October 2000 2975 Stender Way, Santa Clara, CA 95054 TEL: 800 345-7015 FAX: (408) 492-8674 QUALITY & RELIABILITY MONITOR REPORT October 2000 TABLE OF CONTENTS Section I: Introduction Section II:	Original	H73235 H73622 H73101 T13716 H74016G 79RV364Y 71V432VF 70V9289Y 723631Z 70914Y l9938 K9950 h9940 l9923 L9939 l9940 z9936 z9939 l9934 PQFP208 drawing	PDF
L9939 Abstract: h9940 z9939 l9940 k9920 z9936 l9938 P9924 K9932 L9923 Text: INTEGRATED DEVICE TECHNOLOGY, INC. QUALITY & RELIABILITY MONITORS July 2000 2975 Stender Way, Santa Clara, CA 95054 TEL: 800 345-7015 FAX: (408) 492-8674 QUALITY & RELIABILITY MONITOR REPORT July 2000 TABLE OF CONTENTS Section I: Introduction Section II:	Original	70V9269Z 70261Z 2841W 2211W T13506 H69725 H69754 T13531 71V016K 71256TT L9939 h9940 z9939 l9940 k9920 z9936 l9938 P9924 K9932 L9923	PDF
Untitled Abstract: No abstract text available Text: ATL60 Features • • • • • • • • 0.6\|.im D raw n G ate Length 0.5\|im Left S e a -o f-G a te s A rch ite c tu re W ith T rip le Level M etal 5.0 V o lt, 3.3 V o lt, and 2.0 V o lt O p e ra tio n In c lu d in g M ixed V o lta g e s On C h ip P h ase Locked Loop A v a ila b le to S y n th e s ize F req u en cies up to	OCR Scan	ATL60 ATL60	PDF
WQB3000 Abstract: No abstract text available Text: 1 BGAI QFP-Rework System WQB 3000 Betriebsanleitung Operating Instruction Version 1.1 2 T a b la of Contents 1 Description T&çhnfcal u'ata 2 Start-up 2.1 Eei-up 2.2 Preliminaries 2.3 Attachment and al.gnmentof the circuit boarri and soldering nozzle 3 Operation with the Programming unit	OCR Scan	O20090 WQB3000	PDF
M1110 Abstract: No abstract text available Text: M r K M 10X 0.80 11 10 9 8 7 5 4 3 2 ETALIZED MARK FOR PIN A1 IDENTIFICATION IN THIS AREA 1 y 10X 0.80 it T A 121X 00.45 0.35 00.15 00.08 Z X Y z -$ - -$ - -$ - -$ - <)- -$ - -$ - -$ - -$ - -$ - <)- -$ - -$ - -$ - -$ - -$ - <)- -$ - -$ - -$ - -$ - -$ - VIEW M - M	OCR Scan	A121X 98ASH98066A 239A-02 5M-1994. M1110	PDF
FDZ5047N Abstract: No abstract text available Text: S E M IC O N D U C T O R tm FDZ5047N 30V N-Channel Logic Level PowerTrench BGA MOSFET General Description Features Com bining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ5047N m inim izes both PCB space and R DS on . This BGA	OCR Scan	FDZ5047N FDZ5047N 300ns,	PDF
FDZ5045N Abstract: No abstract text available Text: S E M IC O N D U C T O R tm FDZ5045N 30V N-Channel Logic Level PowerTrench BGA MOSFET General Description Features Com bining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ5045N m inim izes both PCB space and R DS on . This BGA	OCR Scan	FDZ5045N FDZ5045N	PDF

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ASE BGA Search Results

ASE BGA Result Highlights (5)

ASE BGA Datasheets Context Search

99043

130C

PCN0113

Untitled

PCN0415

ADV9912

SY68730ZC

PCN0712

sy10s897jc

KE-G1250

PCN0214

On semiconductor date Code

On semiconductor date Code

ASE BGA

HEL16

lucent LXE

CY37512VP208-UMB

l9938

L9939

Untitled

WQB3000

M1110

FDZ5047N

FDZ5045N