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    PCN0113

    Abstract: BGA and QFP Package EP20K1500E EP20K400E EPC16
    Text: PROCESS CHANGE NOTICE PCN0113 ADDITIONAL ASSEMBLY LOCATION Change Description: Altera is adding FineLine BGAä and QFP package capability at ASE’s assembly location in Kaohsiung, Taiwan. Reason For Change: ASE Malaysia is already a strategic manufacturing partner for Altera’s existing products.


    Original     		PDF PCN0113 EP20K1500E EP20K400E EPC16, EP20K400E, PCN0113 BGA and QFP Package EPC16

    PCN0114

    Abstract: MICRON TECHNOLOGY marked altera memory flash
    Text: PROCESS CHANGE NOTICE PCN0114 ADDITIONAL WAFER FABRICATION SOURCE OF SUPPLY Change Description: Altera is adding Micron Technology’s wafer fabrication facility located in Boise Idaho for its Configuration Device Flash Memory support. Reason For Change: Micron Technology has been selected as a second source because of their excellent wafer


    Original     		PDF PCN0114 PCN0113) PCN0114 MICRON TECHNOLOGY marked altera memory flash