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    HC100 Search Results

    HC100 Result Highlights (1)

    Part ECAD Model Manufacturer Description Download Buy
    TPS1HC100BQPWPRQ1 Texas Instruments Automotive, 100-mΩ, 2.5-A, one-channel smart high-side switch 14-HTSSOP -40 to 125 Visit Texas Instruments
    SF Impression Pixel

    HC100 Price and Stock

    Essentra Components WHC-1000-01

    CBL CLIP P-TYPE NATURAL FASTENER
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey WHC-1000-01 Bulk 121,206 1
    • 1 $0.48
    • 10 $0.422
    • 100 $0.3477
    • 1000 $0.24945
    • 10000 $0.22677
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    Mouser Electronics WHC-1000-01 2,453
    • 1 $0.44
    • 10 $0.409
    • 100 $0.348
    • 1000 $0.249
    • 10000 $0.226
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    Bisco Industries WHC-1000-01 13,824
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    Bristol Electronics WHC-1000-01 1,000 8
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    • 10 $0.675
    • 100 $0.4388
    • 1000 $0.189
    • 10000 $0.189
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    TME WHC-1000-01 200 100
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    • 100 $0.201
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    Essentra Components WHC-1000-01BK

    CABLE CLAMP - SCREW MOUNT, WIRE
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey WHC-1000-01BK Bag 75,218 1
    • 1 $0.59
    • 10 $0.495
    • 100 $0.4445
    • 1000 $0.35575
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    Eaton Bussmann 1245HC100-RTR

    FUSE BRD MT 100A 125VAC 72VDC
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 1245HC100-RTR Reel 12,000 1,000
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    • 1000 $3.60048
    • 10000 $3.33378
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    1245HC100-RTR Cut Tape 1,321 1
    • 1 $7.47
    • 10 $6.934
    • 100 $4.5339
    • 1000 $3.73384
    • 10000 $3.73384
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    TME 1245HC100-RTR 9,000
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    • 10000 $8.31
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    INPAQ Technology Co Ltd MHC1005S121MBPDG

    FERRITE BEAD 1005 120OHM 1.5A 1L
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey MHC1005S121MBPDG Reel 10,000 10,000
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    MHC1005S121MBPDG Cut Tape 9,016 1
    • 1 $0.1
    • 10 $0.01
    • 100 $0.0054
    • 1000 $0.00343
    • 10000 $0.00303
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    Ohmite Mfg Co WHC100FET

    RES 100 OHM 1% 2W AXIAL
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey WHC100FET Reel 3,996 1
    • 1 $0.63
    • 10 $0.63
    • 100 $0.63
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    WHC100FET Cut Tape 855 1
    • 1 $1.34
    • 10 $1.128
    • 100 $0.8175
    • 1000 $0.61408
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    Mouser Electronics WHC100FET 1,695
    • 1 $1.34
    • 10 $1.13
    • 100 $0.818
    • 1000 $0.521
    • 10000 $0.499
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    Master Electronics WHC100FET 1,624
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    • 1000 $0.5872
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    Find more HC100 price and stock on Findchips.com

    HC100 Datasheets (4)

    Part ECAD Model Manufacturer Description Curated Type PDF
    HC100 Unknown Shortform Semicon, Diode, and SCR Datasheets Short Form PDF
    HC1000 E+E Elektronik FEUCHTESENSOR Original PDF
    HC1000 Unknown Shortform Semicon, Diode, and SCR Datasheets Short Form PDF
    HC1000-0.020-02-0404 Bergquist Thermal - Pads, Sheets, Fans, Thermal Management, THERMAL PAD 20MIL 4X4 GAPPAD Original PDF

    HC100 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad HC1000 “Gel-Like” Modulus Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD HC1000 PROPERTY Color • Thermal conductivity: 1.0 W/m-K • Highly conformable, low hardness • “Gel-like” modulus • Fiberglass reinforced for puncture,


    Original     		PDF HC1000 E1269

    ASTM d792

    Abstract: HC1000 D575 HC100 C351 D149 D150 D2240 D257 D374
    Text: Gap Pad HC1000 “Gel-Like” Modulus Gap Filling Material Features and Benefits Typical Properties of Gap Pad HC1000 Property • Thermal conductivity 1.0 W/m-K Imperial Value Metric Value Test Method Gray Gray Visual Color • Extremely conformable • “Gel-Like” modulus


    Original     		PDF HC1000 ASTM d792 HC1000 D575 HC100 C351 D149 D150 D2240 D257 D374

    PCN0415

    Abstract: HC100-XJ Nitto Denko HC100-XJ Denko trace code altera HC100 HC100XJAA altera top marking nitto hc100 altera marking
    Text: PROCESS CHANGE NOTIFICATION PCN0415 ADDITIONAL MOLD COMPOUND FOR FBGA PACKAGES FROM ASE MALAYSIA Change Description: The Nitto Denko HC100-XJ series mold compound is being added as an additional mold compound choice for Altera FineLine BGA® packages assembled at ASE Malaysia. This change does not affect form, fit or function.


    Original     		PDF PCN0415 HC100-XJ HC100-XJAA PCN0415 Nitto Denko HC100-XJ Denko trace code altera HC100 HC100XJAA altera top marking nitto hc100 altera marking

    taiyo PSR4000

    Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


    Original     		PDF

    S 0319

    Abstract: CRM1525D
    Text: 12/17/2003 RELIABILITY REPORT FOR DS3146, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF DS3146, 30C/60% S 0319 CRM1525D

    MCM-750

    Abstract: No abstract text available
    Text: Cast Copper Mechanical Connectors Types H2L, H3L & HC Copper Lugs For Use With Copper Cables Only Premium Dual Barrel & Three Barrel Lugs Types H2L & H3L Two-Hole and Four-Hole Straight Tongue Copper Conductor Size Range Bolt Hole Size Hex Key Size W G S


    Original     		PDF H2L13-2N-2 H2L21-2N-2 HC13-3 HC21-1 HC30-1 HC50-1 MCM-500 HC75-1 MCM-750 HC100-1

    fBGA package tray 12 x 19

    Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


    Original     		PDF

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    PCN0515

    Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
    Text: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera FineLine BGA® FBGA device packages. Devices in FBGA packages currently


    Original     		PDF PCN0515 HC-100 UL-94 1x1011 PCN0515 sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC

    CRT - TCL COLOUR TV SCHEMATIC DIAGRAM

    Abstract: MATSUA compressor catalogue Riyadh Cables Catalogue PD 18N50 equivalent MATSUSHITA compressor catalogue CRT TCL COLOUR TV SCHEMATIC DIAGRAM Anritsu ML524B operation manual ML2430 CRT - tcl 29" COLOUR TV SCHEMATIC DIAGRAM Anritsu MG442A
    Text: CONTENTS Outline of Anritsu Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 How to Use This Catalog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Sales, Shipping, and Service Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


    Original     		PDF

    nitto GE

    Abstract: GE-100L SXVX-50BHG nitto GE-100L SXVX-210BHG SXVX-50 HL832NX SXVX-210 Nitto GE 100 HL832HS
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-07 Product Affected: DATE: September 17, 2010 MEANS OF DISTINGUISHING CHANGED DEVICES: 17mm x 17mm TEBGA-580 (Green) Product Mark


    Original     		PDF A1008-07 TEBGA-580 facilitSD22-A110 JESD22-A104 JESD22-A103 JESD22-A113 SXVX-110BHG SXVX-200BHG SXVX-210BHG nitto GE GE-100L SXVX-50BHG nitto GE-100L SXVX-210BHG SXVX-50 HL832NX SXVX-210 Nitto GE 100 HL832HS

    Untitled

    Abstract: No abstract text available
    Text: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE


    Original     		PDF

    bcm 4330

    Abstract: telemecanique contactor catalogue A5 GNC mosfet philips ecg master replacement guide Elektronikon II keltron electrolytic capacitors PART NO SELEMA DRIVER MOTOR AC 12v dc EIM Basic MK3 lenze 8600 Atlas copco rc universal 60 min
    Text: NEED IT NOW? BUY REMAN! SEE PAGE lxx xx xvi SOLUTIONS, SOLUTIONS. Q A r e q u a l i t y, c o s t , a n d t i m e i m p o r t a n t to you? A ELECTRICAL SOUTH! Q Do you spend too much of your valuable time dealing with too m a n y d i ff e r e n t r e p a i r v e n d o r s ?


    Original     		PDF

    J-STD-020

    Abstract: HC100-XJ JSTD-020 NITTO HC-100-XJAA-M 94V-0 0303
    Text: 05/21/03 RELIABILITY REPORT FOR DS4000, Rev A2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF DS4000, JESD78, J-STD-020 HC100-XJ JSTD-020 NITTO HC-100-XJAA-M 94V-0 0303

    Ablebond 8390

    Abstract: sil154 kyro PowerVR B1G5 HC100 PowerVR imagination technologies bitblt kyro 2 Bt868
    Text: Integrated 2D/3D graphics accelerator – Product Overview PRELIMINARY DATA FEATURES • PowerVR Series 3 arcade performance 3D ● DirectX7 Flexible Vertex Format support ● 8 layer Multi-texturing ● Twin high performance texturing pipelines ● Full triangle setup hidden surface


    Original     		PDF 128-bit Ablebond 8390 sil154 kyro PowerVR B1G5 HC100 PowerVR imagination technologies bitblt kyro 2 Bt868

    Untitled

    Abstract: No abstract text available
    Text: CBT-40 Product Datasheet CBT-40 LEDs Features: Technology Overview. . . . . . 2 • Extremely high optical output: Over 310 Red Lumens Over 725 Green lumens Over 150 Blue Lumens Test Specifications . . . . . . . . . 2 • High thermal conductivity package - junction to heat sink thermal resistance of only


    Original     		PDF CBT-40 PDS-001229

    Sn95Sb5

    Abstract: QMI519 nitto hc100 QMI-519 epoxy qualification Qualification JESD22-C101-C CARSEM HC100 JESD22-A115
    Text: Product Qualification Report Skyworks Part Number: SKY12145-315 Product Type: HIP3 Variable Attenuator for UMTS Base Stations Report No: 300374 Approved by: Product/Package Reliability: Tom Wood Prepared by Skyworks Solutions, Inc. Product / Package Reliability Group


    Original     		PDF SKY12145-315 SKY12145-315 SKY12145-315. JESD22-A114-B, JESD22-C101-C, JESD22-A115-A. Sn95Sb5 QMI519 nitto hc100 QMI-519 epoxy qualification Qualification JESD22-C101-C CARSEM HC100 JESD22-A115

    KC301

    Abstract: GQ102 GT102 gf201
    Text: PRELIMINARY PhlatLight LED Binning and Labeling Introduction Table of Contents This document describes the binning and labeling nomenclature for PhlatLight LED products as well as the orderable bin kits for each part. Table of Products . 2


    Original     		PDF

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    240V -110 power supply

    Abstract: No abstract text available
    Text: Fully Isolated DC-DC Converters HC100 HC250 o , / '• » v '\ AVELS002 ♦FULLY ISOLATED ♦RU G G E D C O N S T R U C T I O N ♦MOISTURE R E S I S T A N T ♦GOOD R E G U L A T I O N ♦ E P O X Y F I L L E D ALUMINUM C A S E ♦V IBRATIO N TOLERANT ♦ P R O T E C T E D INPUT & OUTPUT


    OCR Scan     		PDF HC100 HC250 AVELS002 200mA 0V-70V 160mA 0V-140V 240V -110 power supply

    str 450 a

    Abstract: HC301 HC30-1 H2L50-2N-1
    Text: RWDUIT Cast Copper Mechanical Connectors Types h 2l, h3l & hc Copper Lugs For Use With Copper Cables Only Premium Dual Barrel & Three Barrel Lugs Types H2L & H3L Two-Hole and Four-Hole Straight Tongue Copper Conductor Size Range Bolt Hole Size Hex Key Size


    OCR Scan     		PDF H2L13-2N-2 H2L21-2N-2 H2L30-2N-1 H2L50-2N-1 H2L75-4N-1 H2L100-4N-1 H3L21-2N-5 H3L30-2N-5 H3L50-4N-2 H3L75-4N-2 str 450 a HC301 HC30-1

    H3L30-2N-5

    Abstract: MCM-750 HC1001
    Text: ftVDUlT Cast Copper Mechanical Connectors Types h2l, h3l & hc Copper Lugs For Use With Copper Cables Only Premium Dual Barrel & Three Barrel Lugs Types H2L & H3L Four-Hole Straight Tongue Copper Conductor Size Range Bolt Hole Size A H2L4-2N-X 8 Sol. - 4 Str.


    OCR Scan     		PDF H2L13-2N-2 HC13-3 HC21-1 HC30-1 HC50-1 MCM-500 HC75-1 MCM-750 HC100-1 MCM-1000 H3L30-2N-5 HC1001

    Untitled

    Abstract: No abstract text available
    Text: AURORA, IL. 6 05 0 5 CONNOR-WINFIELD PHONE 6 3 0 8 5 1 - 4 7 2 2 CORPORATION FAX (6 3 0 ) 8 5 1 - 5 0 4 0 INDEPENDENT DUAL OUTPUT OSCILLATOR S52DF SPECIFICATIONS S53DF F1 : 1.8MHz to 32MHz , F2: 8MHz to 48MHz Frequency Range ±50ppm Frequency S tability


    OCR Scan     		PDF S52DF 50ppm S53DF 32MHz 48MHz HC100

    hep 154 silicon diode

    Abstract: zy 406 transistor motorola HEP 801 hep 154 diode hep R1751 triac zd 607 2sb337 RS5743.3 F82Z hep 230 pnp
    Text: SEMICONDUCTOR This guide has been prepared by the Motorola HEP technical staff to provide a cross-reference for the Hobbyist, Experimenter, and Profes­ sional service technician. The information contained herein is based on an analysis of the published specifications of each device listed. This


    OCR Scan     		PDF MY110B Z0206 Z0208 Z0210 Z0211 Z0212 Z0214 Z0215 Z0217 Z0219 hep 154 silicon diode zy 406 transistor motorola HEP 801 hep 154 diode hep R1751 triac zd 607 2sb337 RS5743.3 F82Z hep 230 pnp