Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    GE100LFCS Search Results

    GE100LFCS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CCL-HL832NX-A

    Abstract: Nitto GE100LFCS Sumitomo G750 GE100LFCS GE-100-LFC CCL-HL832NX GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832
    Text: LAMINATE data sheet TEPBGA Features: Thermally Enhanced Plastic Ball Grid Array TEPBGA : Amkor's TEPBGA's feature a drop-in heat spreader (TEPBGA-2) and are designed for low inductance. This advanced IC package technology allows application and design engineers to optimize


    Original     		PDF CO-029) CCL-HL832NX-A Nitto GE100LFCS Sumitomo G750 GE100LFCS GE-100-LFC CCL-HL832NX GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832

    ge100lfcsv

    Abstract: GE100LFCS SPIL mold compound aus308 GE-100LFCS-V HL832NX Ablestik 89HPES12N3AZGBCGI AUS-308 89HPES10T4G2ZBBCG
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-03 Product Affected: DATE: September 10, 2010 MEANS OF DISTINGUISHING CHANGED DEVICES: 19mm x 19mm CABGA-324 (Standard & Green)


    Original     		PDF A1008-03 CABGA-324 89HPES12N3A2ZCBCI8 89HPES12N3AZCBC 89HPES12N3AZCBCG 89HPES12N3AZCBCI 89HPES12N3AZGBC 89HPES12N3AZGBCG 89HPES12N3AZGBCGI 89HPES12N3AZGBCI ge100lfcsv GE100LFCS SPIL mold compound aus308 GE-100LFCS-V HL832NX Ablestik 89HPES12N3AZGBCGI AUS-308 89HPES10T4G2ZBBCG

    HL832nxa

    Abstract: VPP1552BFG HL832NX-A HL-832NXA HL832NXA-EX GE100LFCS HL832-NX-A HL832 KE1250LKDS HL832NX
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-04 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: 26-Jul-2010 15.0mm x 15.0mm x 1.7mm FPBGA-324


    Original     		PDF A1004-04 26-Jul-2010 FPBGA-324 VPP1552BFG VPP1552BFG8 26-Oct-2010 JESD22-A113 LBGA-167 JESD22-A118 JESD22-A104 HL832nxa VPP1552BFG HL832NX-A HL-832NXA HL832NXA-EX GE100LFCS HL832-NX-A HL832 KE1250LKDS HL832NX

    KE-G1250

    Abstract: AUS308 KE-G1250 mold compound GE100LFCS EME-G770 SSTE32882 2025D GE-100-LFC HL832NX SSTE32882HLBAKG
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0911-02 DATE: 20-Nov-2009 Product Affected: 13.5mm x 8.0mm FPBGA-176 (Green) Refer to Attachment II for the affected part numbers


    Original     		PDF A0911-02 20-Nov-2009 FPBGA-176 20-Feb-2010 JESD22-A110-B JESD22-A104-B JESD22-A103-B JESD22-A113 SSTE32882HLBAKG KE-G1250 AUS308 KE-G1250 mold compound GE100LFCS EME-G770 SSTE32882 2025D GE-100-LFC HL832NX SSTE32882HLBAKG

    EME-G770

    Abstract: KE-G1250 AUS308 KE-G1250 mold compound HL832NX GE-100-LFC Ablestik AUS-308 GE100LFCS bt resin HL832NX
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0911-02R1 DATE: 18-Dec-2009 Product Affected: 13.5mm x 8.0mm FPBGA-176 (Green) Refer to Attachment II for the affected part numbers


    Original     		PDF A0911-02R1 18-Dec-2009 FPBGA-176 20-Feb-2010 JESD22-A110-B JESD22-A104-B JESD22-A103-B JESD22-A113 SSTE32882HLBAKG EME-G770 KE-G1250 AUS308 KE-G1250 mold compound HL832NX GE-100-LFC Ablestik AUS-308 GE100LFCS bt resin HL832NX

    CV-8710

    Abstract: EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy
    Text:  Chapter 3 Package Materials CHAPTER 3 PACKAGE MATERIALS Introduction JIG-101 Ed 3.0 Declarable Substance List Reporting of 38 Substances of Very High Concern EU REACH Material Declaration Sheets Packages and Packing Methodologies Handbook 6 Jul 2010


    Original     		PDF JIG-101 CV-8710 EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy

    KEG1250LKDS

    Abstract: KE-G1250LKDS KE-G1250TC Ablestik 2025D KE-G1250 SSTE32882 Ablestik 2025D EME-G770 eme-g770lc
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-02 DATE: 3-Jun-2010 Product Affected: 13.5mm x 8.0mm x 1.1mm FPBGA-176 (Green) Refer to Attachment II for the affected part numbers


    Original     		PDF A1004-02 3-Jun-2010 FPBGA-176 3-Sep-2010 JESD22-A118 JESD22-A104 JESD22-A103 JESD22-A113 SSTE32882HLBAKG KEG1250LKDS KE-G1250LKDS KE-G1250TC Ablestik 2025D KE-G1250 SSTE32882 Ablestik 2025D EME-G770 eme-g770lc

    KEG1250LKDS

    Abstract: aus303 KE-G1250LKDS G1250LKDS GE100LFCS KE-G1250 GE-100-LFC HL832NX a1008 JESD22-A103
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-06 Product Affected: DATE: August 27, 2010 82P20516DBFG & 82P20516DBFG8 built in 19mm x 19mm FPBGA-484 Date Effective: November 27, 2010


    Original     		PDF A1008-06 82P20516DBFG 82P20516DBFG8 FPBGA-484 JESD22-A110 JESD22-A104 JESD22-A103 JESD22-A113 82P20416DBFG KEG1250LKDS aus303 KE-G1250LKDS G1250LKDS GE100LFCS KE-G1250 GE-100-LFC HL832NX a1008 JESD22-A103

    PCN0712

    Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
    Text: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array BGA , Ultra FineLine Ball-Grid Array (UBGA), Micro FineLine Ball-Grid Array


    Original     		PDF PCN0712 CEL-9750ZHF10AKL GE-100LFCS GE-100LFCS PCN0712 GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100

    PCN0903

    Abstract: Hitachi Datecode SUMITOMO G700 Nitto GE100LFCS GE100LFCS Hitachi FH920 Ablestik 2025D ablestik 2288a EPC16UI88AA sumitomo g700 type
    Text: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0903 ALTERNATIVE ASSEMBLY SITE FOR THE EPC CONFIGURATION FAMILY Change Description Altera is introducing Amkor, Philippines ATP and Amkor, Korea (ATK) as additional assembly sources for the EPC configuration devices. The EPC devices are currently assembled out of


    Original     		PDF PCN0903 PCN0903 Hitachi Datecode SUMITOMO G700 Nitto GE100LFCS GE100LFCS Hitachi FH920 Ablestik 2025D ablestik 2288a EPC16UI88AA sumitomo g700 type

    GE100LFCS

    Abstract: HL832nxa HL-832NXA HL832NX-A BFG81 Ablestik 2000 aus308 HL832 nx-a AUS-308 JESD22-A110
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-05 DATE: September 24, 2010 MEANS OF DISTINGUISHING CHANGED DEVICES: 82V2082BFG & 82V2082BFG8 built in 8 mm x 8mm CABGA-81


    Original     		PDF A1008-05 82V2082BFG 82V2082BFG8 CABGA-81 FPBGA-289 JESD22-A110 JESD22-A104 JESD22-A103 JESD22-A113 GE100LFCS HL832nxa HL-832NXA HL832NX-A BFG81 Ablestik 2000 aus308 HL832 nx-a AUS-308 JESD22-A110