Untitled
Abstract: No abstract text available
Text: NON-ISOLATED DC/DC CONVERTERS 12V Input / Programmable Output / 30A VRM VRNB-30A07A PRELIMINARY • High efficiency means less power dissipation • Remote on/off • 2-Wire Remote sense • 5 bit voltage programming scheme • Adaptive voltage positioning Load Line
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VRNB-30A07A
V7NB-30A07A
170uA,
132uA
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Untitled
Abstract: No abstract text available
Text: 526Kx8/128Kx16, 150 - 250ns, SLCC/PGA 30A071-13 D 2 Megabit FLASH EEPROM DPZ128X16IY/IIY/IJY/IHY/IA3 DESCRIPTION: The DPZ128X16IY/IIY/IJY/IHY/IA3 devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers
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526Kx8/128Kx16,
250ns,
30A071-13
DPZ128X16IY/IIY/IJY/IHY/IA3
DPZ128X16IY/IIY/IJY/IHY/IA3
50-pin
commercia1-13
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30021
Abstract: L48C L41C IC L44C DATASHEET L30C l31c L43C ORSO42G5 ORSO82G5 ORT42G5
Text: ORCA ORSO42G5 and ORSO82G5 0.6 - 2.7 Gbps SONET Backplane Interface FPSCs August 2005 Data Sheet Introduction Lattice has extended its family of high-speed serial backplane devices with the ORSO42G5 and ORSO82G5 devices. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSO42G5 and
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ORSO42G5
ORSO82G5
ORSO82G5
ORSO42G5-1BMN484I
ORSO82G5-2FN680I
30021
L48C
L41C
IC L44C DATASHEET
L30C
l31c
L43C
ORT42G5
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30A-075
Abstract: No abstract text available
Text: Yuan Dean Scientific CO.,LTD 30A SERIES 8 PIN SINGLE-IN-LINE TTL ACTIVE DELAY LINE FEATURES • 8-PIN SIP PACKAGE. • 5EQUALLY-SPACED TAPS. • TTL SCHOTTKY INTERFACED. • TOTAL DELAYS FROM 25-1000nS. ELECTRICAL CHARACTERISTICS IIH Logic”1” Input Current
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25-1000nS.
25Vdc
0A-025
0A-050
0A-075
0A-100
0A-150
0A-200
0A-250
0A-300
30A-075
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Untitled
Abstract: No abstract text available
Text: 4 Megabit FLASH EEPROM DPZ256X16In3 DESCRIPTION: The DPZ256X16In3 ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, ‘’J’’ leaded or gullwing leaded packages, or mounted on a
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DPZ256X16In3
50-pin
DPZ256X16IY3
DPZ256X16In3
DPZ256X16II3
30A071-12
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310CB
Abstract: transistor 30945 30945 30A27 k3264 TN1073 30A07 30A45
Text: ORSPI4 Provisioning September 2004 Technical Note TN1073 Introduction The ORSPI4 is a next generation FPSC targeted at high speed data transmission, built on the Series 4 reconfigurable embedded System-on-Chip SoC architecture. The ORSPI4 device has been designed to support a broad
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TN1073
310CB
transistor 30945
30945
30A27
k3264
TN1073
30A07
30A45
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AL437
Abstract: L97c L235C L103T L41C L140C L94C l165c L239C L43C
Text: ORCA ORSPI4 Dual SPI4 Interface and High-Speed SERDES FPSC November 2003 Preliminary Data Sheet Lattice Semiconductor has developed a next-generation FPSC targeted at high-speed data transmission. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSPI4 FPSC contains two
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8b/10b
OIF-SPI4-02
ORSPI4-1FE1036IES
ORSPI4-F1156IES
ORSPI4-2FE1036CES
ORSPI4-1FE1036CES
ORSPI4-2F1156CES
ORSPI4-1F1156CES
AL437
L97c
L235C
L103T
L41C
L140C
L94C
l165c
L239C
L43C
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Untitled
Abstract: No abstract text available
Text: 4 Megabit FLASH EEPROM DPZ256X16In3 DESCRIPTION: The DPZ256X16In3 ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, ‘’J’’ leaded or gullwing leaded packages, or mounted on a
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DPZ256X16In3
50-pin
DPZ256X16IY3
DPZ256X16In3
BZ256X16In3
DPZ256X16II3
30A071-12
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L130C
Abstract: L74c l31c l97c l65c A311TC l146c l48c L202C L235C
Text: ORCA ORSPI4 Dual SPI4 Interface and High-Speed SERDES FPSC May 2009 Data Sheet Lattice Semiconductor has developed a next-generation FPSC targeted at high-speed data transmission. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSPI4 FPSC contains two
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8b/10b
OIF-SPI4-02
1156-fpBGA
1036-ball
6A-07
1036fpSBGA
1036-ftSBGA)
06x-09
1036-pin
1036-pin
L130C
L74c
l31c
l97c
l65c
A311TC
l146c
l48c
L202C
L235C
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DPZ128X32IV3
Abstract: 40404040H
Text: 4 Megabit FLASH EEPROM DPZ128X32IV3 DESCRIPTION: The DPZ128X32IV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers
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DPZ128X32IV3
DPZ128X32IV3
30A072-10
40404040H
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L62C
Abstract: 30021 3080e equivalent L41C Transistor BC 177 Datasheet 3080e l48c verilog code BIP-8 L71C l31c
Text: ORCA ORSO42G5 and ORSO82G5 0.6 to 2.7 Gbps SONET Backplane Interface FPSCs July 2008 Data Sheet DS1028 Introduction Lattice has extended its family of high-speed serial backplane devices with the ORSO42G5 and ORSO82G5 devices. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSO42G5 and
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ORSO42G5
ORSO82G5
DS1028
ORSO82G5
L62C
30021
3080e equivalent
L41C
Transistor BC 177 Datasheet
3080e
l48c
verilog code BIP-8
L71C
l31c
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3080e equivalent
Abstract: No abstract text available
Text: ORCA ORSO82G5 0.6 - 2.7 Gbps SONET Backplane Interface FPSC April 2003 Data Sheet Introduction Lattice has extended its family of high-speed serial backplane devices with the ORSO82G5 device. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSO82G5 is a high-speed transceiver with an aggregate bandwidth of over 20 Gbits/s that is targeted toward users needing high-speed backplane
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ORSO82G5
ORSO82G5
ORSO82G5-3BM680C
ORSO82G5-2BM680C
ORSO82G5-1BM680C
ORSO82G5-2BM680I
ORSO82G5-1BM680I
3080e equivalent
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Untitled
Abstract: No abstract text available
Text: ORCA ORSO82G5 0.6 - 2.7 Gbps SONET Backplane Interface FPSCs January 2004 Data Sheet Introduction Lattice has extended its family of high-speed serial backplane devices with the ORSO82G5 device. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSO82G5 is a high-speed transceiver with an aggregate bandwidth of over 20 Gbits/s. This device is targeted toward users needing high-speed
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ORSO82G5
ORSO82G5
ORSO82G5-3BM680C
ORSO82G5-2BM680C
ORSO82G5-1BM680C
ORSO82G5-2BM680I
ORSO82G5-1BM680I
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40404040H
Abstract: 6115 l500m DPZ256
Text: RPR 1 3 1993 DPZ256X32V3 256K X 32 FLASH ELPROM VERSA-STACK M ODULE PRELIM IN ARY DESCRIPTION: The D P Z 2 5 6 X 3 2 V 3 "V E R S A -S T A C K " m odule is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers
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DPZ256X32V3
56X32V3
12fiK
IhroughZ256X32
125-c
120ns
150ns
170ns
200ns
40404040H
6115
l500m
DPZ256
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Untitled
Abstract: No abstract text available
Text: D E N S E -P A C 8 Megabit FLASH EEPROM M IC R f S YS TE M S DPZ256X32IV3 D E S C R IP T IO N : The DPZ256X32IV3 "VERSA-STACK" module ¡s a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC) mounted on a co-fired ceramic substrate. It offers
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DPZ256X32IV3
DPZ256X32IV3
120ns
150ns
170ns
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bma 023
Abstract: DPZ128X32IV3
Text: DENSE-PAC MICROSYSTEMS 4 M E G A B IT FLASH E EP R O M DPZ128X32IV3 D E S C R IP T IO N : The D PZ 1 2 8X 3 2 IV 3 "V E R S A - S T A C K " module ¡s a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers
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DPZ128X32IV3
DPZ128X32IV3
120ns
150ns
170ns
200ns
250ns
30a072-10
275T415
bma 023
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050I
Abstract: No abstract text available
Text: DENSE-PAC 4 MEGABIT FLASH EEPROM DPZ256X16ln3 M I C R O S Y S T E M S D E S C R IP T IO N : The DPZ256X16ln3 "STA C K" modules are a revolutionary new memory subsystem using D ense-Pac M icrosystem s' ceram ic Stackable Leadless Chip Carriers SLCC . Available in straight
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DPZ256X16ln3
50-pin
DPZ256X16ln3
120ns
150ns
170ns
200ns
250ns
30A071-12
050I
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30AQ
Abstract: No abstract text available
Text: 16 Megabit FLASH EEPROM D E N S E -P A C M ICRO SYSTEM S DPZ512X32IV3 D E S C R IP T IO N : The DPZ512X32IV3 "VERSA-STACK" module ¡s a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers
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DPZ512X32IV3
DPZ512X32IV3
120ns
150ns
170ns
200ns
250ns
30A072-12
30AQ
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC T K W MICROSYSTEMS 4 M EGABIT FLASH EEPROM \l DPZ128X32IV3 D E S C R IP T IO N : The D PZ 1 2 8 X 3 2 IV 3 "V E R S A - S T A C K " module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers
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DPZ128X32IV3
DPZ128X32IV3
120ns
150ns
170ns
200ns
250ns
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10A07
Abstract: 30h1
Text: C B p D P Z 5 1 2 X 3 2 V 3 j ^ 512K X 32 FLASH EEPROM VERSA-STACK M ODULE O PRELIM IN A RY DESCRIPTION: The D P Z 5 1 2 X 3 2 V 3 “ V ER S A -S T A C K " module is a revolulionary new memory subsyslem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers
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DPZ512X32V3
Z512X32V3
30A072-02
DPZ512X32V3
Z512X32
-40-C
125-C
120ns
150ns
10A07
30h1
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Untitled
Abstract: No abstract text available
Text: f n n i M ' • DPZ256X8A3 - * V * Dense-Pac Microsystems, Inc. ^ _ 256K X 8 FLASH EEPROM DENSE-STACK MODULE PRELIMINARY DESCRIPTION: The DPZ256X8A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic
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DPZ256X8A3
DPZ256X8A3
Z256X8
S52EE
120ns
150ns
170ns
200ns
250ns
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ah7al
Abstract: NC-641 TIT lot trace code
Text: nD M ^ DPZ1MX16V3 I l / l D ens^ P a c M icrosystem s, Inc^ _1 M EC X 16 FLASH EEPROM VERSA-STACK M ODULE ADVANCED INFORMATION DESCRIPTION: The D P Z 1 M X 1 6V 3 "V E R S A -S T A C K " m odule is a revolutionary new memory subsystem using Dense-Pac
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DPZ1MX16V3
II1111111IIBII
30A070-30
ah7al
NC-641
TIT lot trace code
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Untitled
Abstract: No abstract text available
Text: 4 Megabit FLASH EEPROM B E M E - F A C M IC'RÙ& YST E-MsS D P Z 2 5 6 X 1 6 ln 3 D E S C R IP T IO N : The DPZ256X16ln3 '"STACK'7 modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCQ. Available in straight
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DPZ256X16ln3
50-pin
DPZ256X16ln3
120ns
173ns
200ns
250ns
-t-85
30A071-12
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Untitled
Abstract: No abstract text available
Text: P A C 16 M EGABIT f l a s h e e p ro m MICROS YSTEMS DPZ512X32IV3 D E S C R IP T IO N : The DPZ512X32IV3 "VERSA-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers
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DPZ512X32IV3
DPZ512X32IV3
120ns
150ns
170ns
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