050I
Abstract: No abstract text available
Text: DENSE-PAC 4 MEGABIT FLASH EEPROM DPZ256X16ln3 M I C R O S Y S T E M S D E S C R IP T IO N : The DPZ256X16ln3 "STA C K" modules are a revolutionary new memory subsystem using D ense-Pac M icrosystem s' ceram ic Stackable Leadless Chip Carriers SLCC . Available in straight
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OCR Scan
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PDF
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DPZ256X16ln3
50-pin
DPZ256X16ln3
120ns
150ns
170ns
200ns
250ns
30A071-12
050I
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Untitled
Abstract: No abstract text available
Text: 4 Megabit FLASH EEPROM B E M E - F A C M IC'RÙ& YST E-MsS D P Z 2 5 6 X 1 6 ln 3 D E S C R IP T IO N : The DPZ256X16ln3 '"STACK'7 modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCQ. Available in straight
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OCR Scan
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PDF
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DPZ256X16ln3
50-pin
DPZ256X16ln3
120ns
173ns
200ns
250ns
-t-85
30A071-12
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC ,A s .v MICROSYSTEMS 4 MEGABIT FLASH EEPROM J DPZ256X16ln3 D E S C R IP T IO N : The D P Z 256X 16ln3 "STACK" modules are a revolutionary new m em ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight
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OCR Scan
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PDF
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16ln3
50-pin
-t-70
120ns
150ns
170ns
200ns
250ns
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Untitled
Abstract: No abstract text available
Text: 4 Megabit FLASH EEPROM D E N S E -P A C MICROSYSTEMS DPZ256X16ln3 DESCRIPTION: The DPZ256X16ln3 "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, "J" leaded or gullwing leaded packages, or mounted on a
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OCR Scan
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PDF
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DPZ256X16ln3
50-pin
DPZ256X16ln3
120ns
150ns
170ns
200ns
30A071-12
|
DP5Z
Abstract: No abstract text available
Text: n INDEX GENERAL PRODUCT INFORMATION Dense-Pac Memory Module and Monolithic E merging T echnology / Products. Quality and R e lia b ilit y . Warranty . . 6 . 7 . 8 14 SRAM PRODUCTS
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PDF
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128Kx8,
64Kx16,
256Kx8,
384Kx8,
DP5Z
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