delta dps 298 cp 2A
Abstract: infineon b 58 468 la intel 80 IR 448H CRC-32 RFC1662 A 3101 8 pin Motorola Bipolar Power Transistor Data
Text: P rel imi na ry Dat a Sh eet , DS 1, Ap r. 20 01 TE3-SPICCE Six Port Integrated Communication Controller with 4 D S 3 Fr a m e rs a n d 2 F a s t E t h e r n e t MACs PEB 3454 E Version 1.1 Datacom N e v e r s t o p t h i n k i n g . Edition 2001-04-30 Published by Infineon Technologies AG,
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D-81541
delta dps 298 cp 2A
infineon b 58 468 la intel 80
IR 448H
CRC-32
RFC1662
A 3101 8 pin
Motorola Bipolar Power Transistor Data
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NM6403
Abstract: 87FFFFF AR210
Text: NM6403 Software Development Kit NeuroMatrix NM6403 Assembly Language Overview Preliminary Version 30002-01 35 02 A Module and NeuroMatrix® are registered trademarks of JSC Research Center MODULE. All other trademarks are the exclusive property of their respective owners.
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NM6403
NM6403
87FFFFF
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NM6403
Abstract: TMS320C40 88888888h 276 SB2
Text: Базовое программное обеспечение процессора NM6403 NeuroMatrix NM6403 Описание языка ассемблера Предварительная версия Описание языка ассемблера
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NM6403
NM6403
TMS320C40
88888888h
276 SB2
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d-star
Abstract: delta dps 298 cp 2A Delta dps 240 fp delta dps 298 cp HBM 00-01H TCG1135 IR 448H CRC-16 CRC-32 RFC1662
Text: P rel imi na ry Dat a Sh eet , DS 1, Ap r. 20 01 SPOCC Six Port Optimized Communication Controller PEB 20544 E Version 1.1 Datacom N e v e r s t o p t h i n k i n g . Edition 2001-04-30 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 München, Germany
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delta dps 298 cp 2A
Delta dps 240 fp
delta dps 298 cp
HBM 00-01H
TCG1135
IR 448H
CRC-16
CRC-32
RFC1662
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QorIQ Debug and Performance Monitoring
Abstract: mesa Toshiba MeP secure toshiba mep architecture
Text: P3041 QorIQ Integrated Multicore Communication Processor Family Reference Manual Document Number: P3041RM Rev 3, 6/2013 P3041 QorIQ Integrated Multicore Communication Processor Family Reference Manual, Rev. 3, 6/2013 2 Freescale Semiconductor, Inc. Contents
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P3041
P3041RM
QorIQ Debug and Performance Monitoring
mesa
Toshiba MeP secure
toshiba mep architecture
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DPZ128X32IV3
Abstract: 40404040H
Text: 4 Megabit FLASH EEPROM DPZ128X32IV3 DESCRIPTION: The DPZ128X32IV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers
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DPZ128X32IV3
DPZ128X32IV3
30A072-10
40404040H
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Untitled
Abstract: No abstract text available
Text: 4Mx8/2Mx16/1Mx32, 90 - 120ns, PGA 30A126-22 D 32 Megabit FLASH EEPROM DPZ1MH32NV3 DESCRIPTION: The DPZ1MH32NV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers
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4Mx8/2Mx16/1Mx32,
120ns,
30A126-22
DPZ1MH32NV3
DPZ1MH32NV3
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Untitled
Abstract: No abstract text available
Text: 16 MEGABIT FLASH EEPROM DPZ512X32IV3 DESCRIPTION: The DPZ512X32IV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers
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DPZ512X32IV3
DPZ512X32IV3
30A072-12
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MIP 411
Abstract: MIP 289 DVD BOARD LAYOUT 3011BH Power Factor Correction PAM Module intel 815 intel 82815 circuit diagram vga crtc svs 357 MIP 282
Text: R Intel 815 Chipset: Graphics Controller Programmer’s Reference Manual PRM July 2000 Order Number: 298237-001 Intel® 815 Chipset: Graphics Controller PRM, Rev 1.0 R Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
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Delta dps 240 fp
Abstract: delta dps 298 cp 2A delta dps 298 cp infineon SAB 82525
Text: P rel imi na ry Dat a Sh eet , DS 1, Ap r. 20 01 DSCC4 4 Channel Serial Communication Controller PEB 20535 E Version 3.1 Datacom N e v e r s t o p t h i n k i n g . Edition 2001-04-30 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 München, Germany
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Delta dps 240 fp
delta dps 298 cp 2A
delta dps 298 cp
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Untitled
Abstract: No abstract text available
Text: 8 Megabit FLASH EEPROM DPZ256S32IW DESCRIPTION: The DPZ256S32IW is a 256K x 32 high-speed CMOS FLASH EEPROM module comprised of eight 128K x 8 monolithic CMOS FLASH EEPROM’s, an advanced high-speed CMOS decoder, and decoupling capacitors surface mounted on an FR-4 SIMM substrate.
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DPZ256S32IW
DPZ256S32IW
250ns
30A115-00
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Untitled
Abstract: No abstract text available
Text: 4Mx8/2Mx16/1Mx8, 90 - 120ns, PGA 30A126-02 F 32 Megabit FLASH EEPROM DPZ1MX32NV3 DESCRIPTION: The DPZ1MX32NV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 32
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4Mx8/2Mx16/1Mx8,
120ns,
30A126-02
DPZ1MX32NV3
DPZ1MX32NV3
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MIP 411
Abstract: smd BR19 SLB 9635 UV 471 30158h-3015Bh smd BR08 intel organisational structure transistor SMD BR21 3011BH cga to vga converter
Text: R Intel 810 Chipset Family Programmer’s Reference Manual November 1999 Revision 1.0 Order Number: 298026-001 Intel 810 Chipset Family PRM THIS DOCUMENT IS PROVIDED "AS IS," WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE,
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100-MHz
0x2220f000,
25-MHz
133-MHz
MIP 411
smd BR19
SLB 9635
UV 471
30158h-3015Bh
smd BR08
intel organisational structure
transistor SMD BR21
3011BH
cga to vga converter
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40404040H
Abstract: 6115 l500m DPZ256
Text: RPR 1 3 1993 DPZ256X32V3 256K X 32 FLASH ELPROM VERSA-STACK M ODULE PRELIM IN ARY DESCRIPTION: The D P Z 2 5 6 X 3 2 V 3 "V E R S A -S T A C K " m odule is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers
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DPZ256X32V3
56X32V3
12fiK
IhroughZ256X32
125-c
120ns
150ns
170ns
200ns
40404040H
6115
l500m
DPZ256
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bma 023
Abstract: DPZ128X32IV3
Text: DENSE-PAC MICROSYSTEMS 4 M E G A B IT FLASH E EP R O M DPZ128X32IV3 D E S C R IP T IO N : The D PZ 1 2 8X 3 2 IV 3 "V E R S A - S T A C K " module ¡s a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers
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DPZ128X32IV3
DPZ128X32IV3
120ns
150ns
170ns
200ns
250ns
30a072-10
275T415
bma 023
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30AQ
Abstract: No abstract text available
Text: 16 Megabit FLASH EEPROM D E N S E -P A C M ICRO SYSTEM S DPZ512X32IV3 D E S C R IP T IO N : The DPZ512X32IV3 "VERSA-STACK" module ¡s a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers
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DPZ512X32IV3
DPZ512X32IV3
120ns
150ns
170ns
200ns
250ns
30A072-12
30AQ
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC T K W MICROSYSTEMS 4 M EGABIT FLASH EEPROM \l DPZ128X32IV3 D E S C R IP T IO N : The D PZ 1 2 8 X 3 2 IV 3 "V E R S A - S T A C K " module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers
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DPZ128X32IV3
DPZ128X32IV3
120ns
150ns
170ns
200ns
250ns
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Untitled
Abstract: No abstract text available
Text: 32 Megabit FLASH EEPROM D E N S E - P A C MICROSYSTEMS DPZ1MX32NV3 DESCRIPTION: The D P Z 1 M X 3 2 N V 3 " V E R S A -S T A C K " module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 32
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DPZ1MX32NV3
DPZ1MX32NV3
100ns
120ns
150ns
30A126-02
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10A07
Abstract: 30h1
Text: C B p D P Z 5 1 2 X 3 2 V 3 j ^ 512K X 32 FLASH EEPROM VERSA-STACK M ODULE O PRELIM IN A RY DESCRIPTION: The D P Z 5 1 2 X 3 2 V 3 “ V ER S A -S T A C K " module is a revolulionary new memory subsyslem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers
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DPZ512X32V3
Z512X32V3
30A072-02
DPZ512X32V3
Z512X32
-40-C
125-C
120ns
150ns
10A07
30h1
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Untitled
Abstract: No abstract text available
Text: P A C 16 M EGABIT f l a s h e e p ro m MICROS YSTEMS DPZ512X32IV3 D E S C R IP T IO N : The DPZ512X32IV3 "VERSA-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers
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DPZ512X32IV3
DPZ512X32IV3
120ns
150ns
170ns
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125C66
Abstract: No abstract text available
Text: DENSE-PAC 32 Megabit FLASH EEPROM MICROSYSTEMS DPZ1MH32NV3 PRELIMINARY DESCRIPTION: T h e D P Z 1 M H 3 2 N V 3 " V E R S A - S T A C K " m o d u le is a re v o lu tio n a ry n e w m e m o ry su b syste m u sin g D en se-P ac M ic ro sy ste m s' c e ra m ic S tackab le Le ad le ss C h ip C a rrie rs
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DPZ1MH32NV3
DE51C
100ns
120ns
150ns
30A126-22
125C66
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eeprom 5ed
Abstract: No abstract text available
Text: DENSE-PAC 32 Megabit FLASH EEPROM DPZ1MH32NV3 MTCRQS ? S T E M ' S DESCRIPTION: The D P Z 1 M H 3 2 N V 3 " V E R 5 A - 5 T A C K " m odule is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers
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DPZ1MH32NV3
30A126-22
H32NV3
100ns
120ns
150ns
T-125
eeprom 5ed
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 8 Megabit FLASH EEPROM DPZ256S32IW MI CROS YSTEMS DESCRIPTION: The DPZ256S32IW is a 256K x 32 high-speed CM OS FLASH EEPROM module comprised of eight 128K x 8 monolithic CMOS FLASH EEPROM 's, an advanced high-speed CM OS decoder, and decoupling capacitors surface mounted on an FR-4 SIM M substrate.
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DPZ256S32IW
DPZ256S32IW
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Untitled
Abstract: No abstract text available
Text: 8 Megabit PLASH EEPROM D EN SE-PA C M í C R O S Y S r ii M S D P Z 2 5 6 S 3 2 IW DESCRIPTION: The DPZ256S32IW is a 256K x 32 high-speed CMOS FLASH EEPROM module comprised of eight 128K x 8 monolithic CMOS FLASH EE PROM's, an advanced high-speed CMOS decoder, and
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DPZ256S32IW
120ns
170ns
200ns
250ns
30A113-00
30A115-00
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