Untitled
Abstract: No abstract text available
Text: • 4 M M 7 5 Ô 4 G D O T b ñ ? OTO ■ H P A HEWLETT-PACKARD/ CMPNTS blE D m HEW LETT PACKARD Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 HPND-0003 Features • Thermocompression/ Thermosonically Bondable
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HPND-0001
HPND-0002
HPND-0003
HPND000X
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Untitled
Abstract: No abstract text available
Text: Wljm SMALL SIGNAL RF PIN DIODE CHIPS FOR HYBRID INTEGRATED CIRCUITS HEW LETT PACKARD wLEM HPND-0001 HPND-0002 HPND-0003 T E C H N IC A L DATA M ARCH 1988 Features THERMOCOMPRESSION/THERMOSONICALLY BON DAB LE IDEAL FOR HYBRID INTEGRATED CIRCUITS GOLD METALLIZATION
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HPND-0001
HPND-0002
HPND-0003
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marking 722
Abstract: No abstract text available
Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks Low profile 0.20 Custom FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermocompression bonding (no internal solder)
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03-May-01
marking 722
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HUGHES mcw 550
Abstract: hughes welder mcw-550 hughes capacitor discharge welder VTA90 discharge capacitor welding welder hughes mcw 550 HUGHES tungsten electrodes MAXY90
Text: Beam Lead Device Bonding to Soft Substrates Application Note 993 Introduction The hard gold surface on standard PC boards combined with soft substrate materials makes it almost impossible to successfully bond beam lead devices onto the boards with normally recommended thermocompression
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VTA90
MAXY90
MCW552
MA09-11
MA-02-25
WE-2231
5954-2227E
HUGHES mcw 550
hughes welder
mcw-550
hughes capacitor discharge welder
VTA90
discharge capacitor welding
welder hughes mcw 550
HUGHES
tungsten electrodes
MAXY90
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integrated circuits equivalents list
Abstract: digital phase shifters HPND-0002 hydrofluoric acid HPND0002 HSMP3810 5965-9143E eutectic
Text: HPND-0002 Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Data Sheet Description Features These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression bonding techniques. The top metallization
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HPND-0002
5965-9143E
AV01-0640EN
integrated circuits equivalents list
digital phase shifters
HPND-0002
hydrofluoric acid
HPND0002
HSMP3810
5965-9143E
eutectic
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Untitled
Abstract: No abstract text available
Text: What HEW LETT* miltm PACKARD Schottky Barrier Chips for Hybrid Integrated Circuits Technical Data HSMS-0005/06 HSMS-8002/12 Features Description/Applications • Thermocompression/ Thermosonically Bondable • Gold Metallization • Silicon Nitride Passivation
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HSMS-0005/06
HSMS-8002/12
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sol 4011 be
Abstract: No abstract text available
Text: A fa Preliminary Specification High Reliability Semiconductor Attenuator PIN Diode Chip_ MA47406 M aann A M P co m pany V1.00 Features • • • • • Package Outline Glass Passivation Thermocompression bondable Thermosonically bondable
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MA47406
MA47406-132
PSS-01-608
sol 4011 be
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Untitled
Abstract: No abstract text available
Text: W ß%H EW L E T T 1“KM PA CK A R D Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ ThermosonicaUy Bondable These PIN/NIP diode chips are specifically designed for hybrid
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HPND-0001
HPND-0002
HPND-000X
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HPND0003
Abstract: HPND-0003
Text: W fipi H E W LE T T mL'HM P A C K A R D Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 HPND-0003 F eatures • Thermocompression/ Thermosonically Bondable • Ideal for Hybrid Integrated Circuits • Gold Metallization
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HPND-0001
HPND-0002
HPND-0003
HPND000X
HPND0003
HPND-0003
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Circuit integrated 8002
Abstract: HSMS0005 HSMS2850 HSMS8002 Hewlett-Packard microwave pin diode sn 8002
Text: Schottky Barrier Chips for Hybrid Integrated Circuits Technical Data HSMS-0005/06 HSMS-8002/12 Features Description/Applications • Thermocompression/ Thermosonically Bondable • Gold Metallization • Silicon Nitride Passivation • Uniform Electrical Characteristics
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HSMS-0005/06
HSMS-8002/12
Circuit integrated 8002
HSMS0005
HSMS2850
HSMS8002
Hewlett-Packard microwave pin diode
sn 8002
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tantalum nitride
Abstract: No abstract text available
Text: Vishay Thin Film Sandwich, 50 Mil Pitch, Dual-In-Line Resistor Networks FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermocompression bonding no internal solder . • Tighter tolerances than molded standards.
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27-Apr-01
tantalum nitride
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HSMS0001
Abstract: HSMS-0002 HSMS0003 5082-0009 HSMS-0003 HSMS0002 HSMS-0012 5082-0097 HSMS-0001 5082 schottky
Text: Whpì LETT wLUMHEW PACKARD Schottky Barrier Chips for Hybrid Integrated Circuits Technical Data 5082-0009, 5082-0013, 5082-0023, 5082-0097, HSMS-0001, HSMS-0011, HSMS-0002, HSMS-0012, HSMS-0003, HSMS-0013 Features • Thermocompression/ Thermosonically Bondable
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HSMS-0001,
HSMS-0011,
HSMS-0002,
HSMS-0012,
HSMS-0003,
HSMS-0013
HSCH-3206*
HSMS0001
HSMS-0002
HSMS0003
5082-0009
HSMS-0003
HSMS0002
HSMS-0012
5082-0097
HSMS-0001
5082 schottky
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Untitled
Abstract: No abstract text available
Text: CSD Vishay Thin Film Ceramic Sandwich, Dual-In-Line, Resistor Network Custom FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermocompression bonding (no internal solder). • Monolithic construction
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27-Apr-01
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Untitled
Abstract: No abstract text available
Text: Who mLftM 1 HEW LETT PACKARD Zero Bias Schottky Diode Chip for Hybrid Integrated Circuits Technical Data HSMS-0005 Features • Thermocompression/ Thermosonically Bondable • Gold Metallization • Silicon Nitride Passivation • High Detection Sensitivity
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HSMS-0005
10ver
5963-0918E
5965-1236E
GD14362
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hydrofluoric acid
Abstract: HPND0001 HPND-0001 HPND-0002 thermocompression
Text: Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ Thermosonically Bondable These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression
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HPND-0001
HPND-0002
HPND-000X
hydrofluoric acid
HPND0001
HPND-0001
HPND-0002
thermocompression
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Untitled
Abstract: No abstract text available
Text: Schottky Barrier Chips for Hybrid Integrated Circuits Technical Data HSMS-0005/06 HSMS-8002/12 Features Description/Applications • Thermocompression/ Thermosonically Bondable • Gold Metallization • Silicon Nitride Passivation • Uniform Electrical Characteristics
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HSMS-0005/06
HSMS-8002/12
5965-8855E
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hydrofluoric acid
Abstract: thermocompression HPND0001 HPND-0001 HPND-0002
Text: Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ Thermosonically Bondable These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression
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HPND-0001
HPND-0002
HPND-000X
5965-9143E
hydrofluoric acid
thermocompression
HPND0001
HPND-0001
HPND-0002
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CH4730
Abstract: 1N4728 1N4764 CH4728 CH4729 CH4731 CH4732 CH4733 CH4734 CH4735
Text: VOLTAGE REGULATOR PLANAR DIODE CHIPS HIGH POWER 3.3-100 VOLTS Electrically sim ilar to the J E D E C 1N 4 7 2 8 - 1N 4 764 Com patible with ultrasonic and thermocompression lead bonding, scrub and eutectic preform die bonding. Junction surfaces are protected from ambient
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1N4728
1N4764
Note47
CH4760
CH4761
CH4762
CH4763
CH4764
CH4730
1N4764
CH4728
CH4729
CH4731
CH4732
CH4733
CH4734
CH4735
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PIN Diode chip
Abstract: No abstract text available
Text: Attenuator PIN Diode Chip ML47406-S-132 ML47406-S-132 Preliminary Specifications High Reliability Semiconductor Attenuator PIN Diode Chip Features • • • • • Package Outline Glass Passivation Thermocompression bondable Thermosonically bondable Gold metallisation
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ML47406-S-132
ML47406-132
PSS-01-608
ML47406
MA47406
6091A
100mA
PIN Diode chip
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hp 3080 diode
Abstract: No abstract text available
Text: Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ Thermosonically Bondable These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression
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HPND-0001
HPND-0002
HPND-000X
5965-9143E
hp 3080 diode
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Untitled
Abstract: No abstract text available
Text: Board Design Considerations Bonding of capacitors to substrates can be categorized into two methods, those involving solder, which are prevalent, and those using other materials, such as epoxies and thermocompression or ultrasonic bonding with wire. The amount of solder applied to the chip capacitor will
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330mm)
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L1201
Abstract: AVANTEK utl 1001 L1802 Avantek S Avantek limiter UTL-1002 Avanpak Avantek voltage controlled limiter AVANTEK, avanpak
Text: Q Limiters Selection Guide avantek PRODUCT DESCRIPTION superb reliability and repeatability. All hybrid components are eutectically die attached and thermocompression bonded. The AH Series of thin-film limiters covers the full 2 to 18 GHz frequency range. They are offered in the subminiature limiter
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UTL-1001
UTL-1002
GPL-1001
L1201
AVANTEK utl 1001
L1802
Avantek S
Avantek limiter
Avanpak
Avantek voltage controlled limiter
AVANTEK, avanpak
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Untitled
Abstract: No abstract text available
Text: Texas Instruments TGA8300 Monolithic 2- to 18-GHz Amplifier Features • ■ ■ ■ ■ 18-dBm typical output power at 1-dB gain compression 6.5-dB gain Input and output SWR less than 2:1 Size: 0.093 x 0.064 x 0.006 inch Recessed V ^ m gate structure Description
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TGA8300
18-GHz
18-dBm
TGA8300
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PDF
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TGF1350
Abstract: No abstract text available
Text: Texas Instruments TGF1350 Low-Noise Microwave GaAs FET Features • 1.5-dB noise figure with 11 -dB associated gain at 10 GHz ■ 2.2-dB noise figure with 7-dB associated gain at 18 GHz ■ All-gold metallization ■ Recessed 1/2-^m gate structure ■ Si3N4 channel passivation
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TGF1350
TGF1350
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PDF
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