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    HPND0001 Search Results

    HPND0001 Datasheets (3)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    HPND-0001 Agilent Technologies Chip PIN diodes for hybrid assemblies Original PDF
    HPND-0001 Avago Technologies Chip PIN diodes for hybrid assemblies Original PDF
    HPND0001 Unknown Historical semiconductor price guide (US$ - 1998). From our catalog scanning project. Historical PDF

    HPND0001 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: PIN Diode Selection Guides Hewlett-Packard PIN diodes are available in chip form and several types of packages, which make each more suitable for a particular application. For switching, attenuating, and other general purpose applications particularly in the VHF/UHF range,


    Original     		PDF OT-23 HPND-4005 HPND-4028 HPND-4038

    IAM-81008

    Abstract: 5082-2830 HSMP-3895 5082-3043 ina-02170 INA-01170 30533 5082-0012 5082-2970 HSMP 2800
    Text: Alphanumeric Index 1N5711 . 3-52 1N5712 . 3-52 1N5719 . 2-101 1N5767 . 2-101


    Original     		PDF 1N5711 1N5712 1N5719 1N5767 MSA-1023 MSA-1100 MSA-1104 MSA-1105 MSA-1110 VTO-9068 IAM-81008 5082-2830 HSMP-3895 5082-3043 ina-02170 INA-01170 30533 5082-0012 5082-2970 HSMP 2800

    5082-3077

    Abstract: 1N5767 2101 5082-3081 glass 1N5719 HPND-0001 HPND-0002 5082-3039 5082-3188
    Text: RF Non-Surface Mount PIN Diodes Glass Axial Lead, Beam Lead, Chip, Stripline Part Number CT Max. pF 5082-3001 5082-3039 1N5719 5082-3077 5082-3188 5082-3080 1N5767 5082-3379 5082-3081 HPND-0001 HPND-0002 0.25 0.25 0.3 0.3 1 0.4 0.4 0.4 0.4 0.2 0.2 RS Max.


    Original     		PDF 1N5719 1N5767 HPND-0001 HPND-0002 5082-3077 1N5767 2101 5082-3081 glass 1N5719 HPND-0001 HPND-0002 5082-3039 5082-3188

    5082-2830

    Abstract: IAM-81008 HSMP-3895 hsms-2850 5082-0012 8205 datasheet hsms-285b HSMS-285C HSMS-2862 MSA-0870
    Text: Alphanumeric Index 1N5711 . 3-52 1N5712 . 3-52 1N5719 . 2-101 1N5767 . 2-101


    Original     		PDF 1N5711 1N5712 1N5719 1N5767 MSA-1023 MSA-1100 MSA-1104 MSA-1105 MSA-1110 VTO-9068 5082-2830 IAM-81008 HSMP-3895 hsms-2850 5082-0012 8205 datasheet hsms-285b HSMS-285C HSMS-2862 MSA-0870

    cp4071

    Abstract: data sheet IC 7408 2N4891 IC 7408 MDA970A2 MDA2500 1854-0071 MDA2502 2N4342 IC TTL 7400
    Text: Transistor - Diode Cross Reference - H.P. Part Numbers to JEDEC Numbers Part Num. 1820-0225 1820-0240 1820-0352 1820-1804 1821-0001 1821-0002 1821-0006 1850-0062 1850-0064 1850-0075 1850-0076 1850-0093 1850-0099 1850-0126 1850-0137 1850-0150 1850-0151 1850-0154


    Original     		PDF 68B09 SN74ALS04BN SN74ALS08N SN74ALS00AN CA3046 uA733 LM311P LM318 CA3094 78H05 cp4071 data sheet IC 7408 2N4891 IC 7408 MDA970A2 MDA2500 1854-0071 MDA2502 2N4342 IC TTL 7400

    hydrofluoric acid

    Abstract: HPND0001 HPND-0001 HPND-0002 thermocompression
    Text: Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ Thermosonically Bondable These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression


    Original     		PDF HPND-0001 HPND-0002 HPND-000X hydrofluoric acid HPND0001 HPND-0001 HPND-0002 thermocompression

    5082-3043

    Abstract: diode 5082-3080 HPND-4038 5082-0012 diode 5082-3042 HPND-4018 1N5719 1N5767 HPND-0001 HPND-0002
    Text: PIN Diode Selection Guides Hewlett-Packard PIN diodes are available in chip form and several types of packages, which make each more suitable for a particular application. For switching, attenuating, and other general purpose applications particularly in the VHF/UHF range,


    Original     		PDF OT-23 5082-3043 diode 5082-3080 HPND-4038 5082-0012 diode 5082-3042 HPND-4018 1N5719 1N5767 HPND-0001 HPND-0002

    hydrofluoric acid

    Abstract: thermocompression HPND0001 HPND-0001 HPND-0002
    Text: Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ Thermosonically Bondable These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression


    Original     		PDF HPND-0001 HPND-0002 HPND-000X 5965-9143E hydrofluoric acid thermocompression HPND0001 HPND-0001 HPND-0002

    HSCH-5337

    Abstract: HSMS-2850 5082-3188 HSMP-3804 ifd 0512 5082-2970 5082-2800 SERIES DATASHEET 5082-2830 AT-41470 HSCH-9301
    Text: Alphanumeric Index 1N5711 . 3-52 1N5712 . 3-52 1N5719 . 2-101 1N5767 . 2-101


    Original     		PDF 1N5711 1N5712 1N5719 1N5767 MSA-1023 MSA-1100 MSA-1104 MSA-1105 MSA-1110 VTO-9068 HSCH-5337 HSMS-2850 5082-3188 HSMP-3804 ifd 0512 5082-2970 5082-2800 SERIES DATASHEET 5082-2830 AT-41470 HSCH-9301

    c5088 transistor

    Abstract: transistor C3207 TLO84CN sec c5088 IN5355B D2817A C3207 transistor toshiba f630 TLO81CP MC74HC533N
    Text: Transistor - Diode Cross Reference - H.P. Part Numbers to JEDEC Numbers Part Num. 1820-0225 1820-0240 1820-0352 1820-1804 1821-0001 1821-0002 1821-0006 1850-0062 1850-0064 1850-0075 1850-0076 1850-0093 1850-0099 1850-0126 1850-0137 1850-0150 1850-0151 1850-0154


    Original     		PDF 1853IMPATT c5088 transistor transistor C3207 TLO84CN sec c5088 IN5355B D2817A C3207 transistor toshiba f630 TLO81CP MC74HC533N

    hp 3080 diode

    Abstract: No abstract text available
    Text: Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ Thermosonically Bondable These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression


    Original     		PDF HPND-0001 HPND-0002 HPND-000X 5965-9143E hp 3080 diode

    AT-41486

    Abstract: 8060 IAM MSA-1105 VTO-8000 HSMP-3895 HSCH-5337 ATF-46171 HSMS-2804 HSCH-5313 HSMS-2862
    Text: Alphanumeric Index 1N5711 . 3-52 1N5712 . 3-52 1N5719 . 2-101 1N5767 . 2-101


    Original     		PDF 1N5711 1N5712 1N5719 1N5767 MSA-1023 MSA-1100 MSA-1104 MSA-1105 MSA-1110 VTO-9068 AT-41486 8060 IAM MSA-1105 VTO-8000 HSMP-3895 HSCH-5337 ATF-46171 HSMS-2804 HSCH-5313 HSMS-2862

    Untitled

    Abstract: No abstract text available
    Text: • 4 M M 7 5 Ô 4 G D O T b ñ ? OTO ■ H P A HEWLETT-PACKARD/ CMPNTS blE D m HEW LETT PACKARD Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 HPND-0003 Features • Thermocompression/ Thermosonically Bondable


    OCR Scan     		PDF HPND-0001 HPND-0002 HPND-0003 HPND000X

    Untitled

    Abstract: No abstract text available
    Text: Wljm SMALL SIGNAL RF PIN DIODE CHIPS FOR HYBRID INTEGRATED CIRCUITS HEW LETT PACKARD wLEM HPND-0001 HPND-0002 HPND-0003 T E C H N IC A L DATA M ARCH 1988 Features THERMOCOMPRESSION/THERMOSONICALLY BON DAB LE IDEAL FOR HYBRID INTEGRATED CIRCUITS GOLD METALLIZATION


    OCR Scan     		PDF HPND-0001 HPND-0002 HPND-0003

    HPND0003

    Abstract: HPND-0003
    Text: W fipi H E W LE T T mL'HM P A C K A R D Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 HPND-0003 F eatures • Thermocompression/ Thermosonically Bondable • Ideal for Hybrid Integrated Circuits • Gold Metallization


    OCR Scan     		PDF HPND-0001 HPND-0002 HPND-0003 HPND000X HPND0003 HPND-0003

    HRMA-0470B

    Abstract: Semicon volume 1 HPMA-2085 HP 33002A AVANTEK ATF26884 SJ 2036 HPMA-0470TXV HPMA-0485 HPMA-0370 DIODE GOC 61
    Text: Whal HEWLETT \HrJk PACKARD Communications Components Designer’s Catalog, GaAs and Silicon Products A Brief Sketch Hewlett-Packard is one of the world’s leading designers and manufacturers of RF and microwave semiconductors, optoelectronic, and fiber optic


    OCR Scan     		PDF E-28230 S-164 CH-8902 HRMA-0470B Semicon volume 1 HPMA-2085 HP 33002A AVANTEK ATF26884 SJ 2036 HPMA-0470TXV HPMA-0485 HPMA-0370 DIODE GOC 61

    HSMP3811

    Abstract: sot-23 MARKING CODE G1 HSMP3821 HSMP-3801 HSMP3831 HSMP3881 HSMP-3811 hsmp-3831 hsmp3801 HSMP-3881
    Text: Surface Mount PIN Diodes Available Configurations SOT-23 DIE APPLICATION GUSS SINGLE SINGLE SERIES COMMON ANODE b R B / o HPNWXJ01 HPND-0002 HPND-0003 5082-0012 tr 'a S' X - ll XX ht-ir là ' COMMON CATHODE LOW LOW INDUCTANCE INDUCTANCE B a Il XX '- á -Ir 1


    OCR Scan     		PDF OT-23 HPNWXJ01 HSMP-3802 HSMP-3812 HSMP-3800 HSMP-3801 HSMP-3810 HSMP-3811 HSMP-3820 HSMP-3821 HSMP3811 sot-23 MARKING CODE G1 HSMP3821 HSMP3831 HSMP3881 hsmp-3831 hsmp3801 HSMP-3881

    Untitled

    Abstract: No abstract text available
    Text: What H E W L E T T * mLliM PACKARD Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features D escription • Thermocompression/ Thermosonically Bondable • Ideal for Hybrid Integrated Circuits • Gold Metallization


    OCR Scan     		PDF HPND-0001 HPND-0002 HPND-000X

    hsmp-3800

    Abstract: HPND-0003
    Text: Whp% mL'EM HEWLETT PACKARD Surface Mount PIN Diodes R eliability D ata The following cumulative test results have been obtained from testing performed at HewlettPackard Communications Com­ ponents Division in accordance with the latest revision of MIL- HPND-OOOX Series


    OCR Scan     		PDF HSMP-3800 HSMP-3810 HSMP-3820 HSMP-3830 STD-750. MIL-STD-750 MIL-STD-202, DOD-HDBK-1686A HPND-0003, HPND-0003

    1N5767

    Abstract: No abstract text available
    Text: Wha% HEW LETT mitíM P A C K A R D PIN Diode Selection Guides Hewlett-Packard PIN diodes are available in chip form and several types of packages, w hich make each more suitable for a particular application. For switching, attenuating, and other general purpose applications


    OCR Scan     		PDF OT-23 400P1 1N5767