J-STD-005
Abstract: J-STD-006 electronic grade solder alloys J-STD-006 IPC-4101 J-STD-004 solder wire 30 1N4148-1 210F JC22 s4c diode
Text: ENGINEERING PRACTICES STUDY TITLE: Soldering Heat Testing For Semiconductors October 27, 2004 STUDY PROJECT 5961-2911 FINAL REPORT Study Conducted by Alan Barone Prepared by Alan Barone I. OBJECTIVE: The objective of this project was to create guidance on how to
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MIL-STD-202
J-STD-005
J-STD-006 electronic grade solder alloys
J-STD-006
IPC-4101
J-STD-004 solder wire 30
1N4148-1
210F
JC22
s4c diode
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murata mlcc
Abstract: Au Sn eutectic murata, whisker SEM 2004 AN-450 surface mounting methods
Text: Whiskering Evaluation of Capacitors Mounted with Lead Free Solders Abhijit Gurav and Bruce Stacy KEMET Electronics Corporation Greenville, SC Abstract Capacitors with matte tin termination finishes were tested for tin whisker growth. The study incorporated two types of
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Coffin-Manson Equation
Abstract: Theory of Modern Electronic Semiconductor Device CRACK thermoelectric peltier cohesive micromechanical
Text: Fatigue Crack Growth and Life Descriptions of Sn3.8Ag0.7Cu Solder Joints: A Computational and Experimental Study 1 D. Bhate1, D. Chan1, G. Subbarayan1, L. Nguyen2 School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907-2088 2 National Semiconductor Corporation, Santa Clara, CA 95051
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031MF
Abstract: 03-1MF STRIP GAGE PATTERNS EP-08-045PG-120 EA-XX-031PJ-120 031PJ SA-XX-031MH-120 045PG TN-516 EA-XX-020PF-120
Text: Strip Gage Patterns Vishay Micro-Measurements Special Purpose Sensors - Strip Gage Patterns A strip gage consists of ten strain-sensitive grids mounted on a common backing. This type of gage offers a number of advantages in the study of local strain distributions and
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EA-XX-062MW-120
EP-08-062MW-120
125MW
EA-XX-125MW-120
10-Jan-03
031MF
03-1MF
STRIP GAGE PATTERNS
EP-08-045PG-120
EA-XX-031PJ-120
031PJ
SA-XX-031MH-120
045PG
TN-516
EA-XX-020PF-120
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12v DC geared motor
Abstract: Internal MLCC cracking result serious failure mode 12v DC geared motor 154 rpm MLCC rework keytek Leach Relay Reliability tds 540 Tektronix schematic LEACH RELAY VA100014D300 VA100026D580
Text: TransGuard APPLICATION NOTES • AVX Multilayer Varistors – Assembly Guidelines • IEC 61000-4 Requirements • Turn On Time Characteristics of AVX Multilayer Varistors • The Impact of ESD on Insulated Portable Equipment • AVX TransGuard Motor and Relay Application Study
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Untitled
Abstract: No abstract text available
Text: Sn-plating in respect to proposed Nemi test conditions E4 status & outlook October 29, 2004 STATUS Sn-technology Sn-plating as a lead free solder- coating is qualified by E4. It is the Preferred technology choice by most of semiconductor companies see Amkor’s october ’04 study
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4000h)
2500h
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leadframe Cu C194
Abstract: ALLOY leadframe C7025 ALLOY leadframe C7025 material property SEM 2004 SEM 2006 leadframe C7025 SO044 electronics nasa study of alloy C194
Text: Matte Tin Sn Plating Of Semiconductor Devices – Whisker Growth Study Anocha Sriyarunya Spansion (Thailand) Limited Pakkerd, Nonthaburi, Thailand Dhiraj Bansal Spansion LLC (US) Sunnyvale, CA, USA Abstract In the industry’s drive towards becoming lead free (Pb-free) by July 1, 2006, as dictated by the WEEE Directive, several Pbfree terminal finishes have been proposed and evaluated. Some of them were rejected as soon as evaluations began. Others
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IEC60169-29
Abstract: IEC60169
Text: COMPONENTS PRODUCT INFORMATION NEW IEC60169-29 Type 0.1/2.3 Standard Compatible Coaxial Connector CB1 Series CONNECTOR MB-0132-3 November 2006 RoHS Compliant Board side receptacle Cable side plug (mass production under study) The CB1 series are compact coaxial connectors compatible to IEC60169-29(type 1.0/2.3)
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IEC60169-29
MB-0132-3
2006Japan
IEC60169
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Problems in the Standardization on RGA For Small Volume Packages
Abstract: project on water level control 100C finding dsasw0015811
Text: DEFENSE LOGISTICS AGENCY DEFENSE SUPPLY CENTER, COLUMBUS POST OFFICE BOX 3990 COLUMBUS, OH 43216-5000 IN REPLY REFER TO DSCC-VAC Mr. Barone/DSN 850-0510 / (614 692-0510) MEMORANDUM FOR VSS (Mr. Art Hudson) SUBJECT: Dated Engineering Practices (EP) Study on Test Method 1018, RGA for small volume
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SZZA031
Abstract: Cu OSP and Cu SOP gold embrittlement palladium DIAMOND TECHNOLOGIES IPC-A-610C gold embrittlement sn-pb-ag solder paste
Text: Application Report SZZA031 - December 2001 A Nickel-Palladium-Gold Integrated Circuit Lead Finish and Its Potential for Solder-Joint Embrittlement Donald Abbott, Douglas Romm, Bernhard Lange Standard Linear & Logic ABSTRACT This gold Au embrittlement study evaluates TI’s original four-layer nickel-palladium (NiPd)
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SZZA031
Cu OSP and Cu SOP
gold embrittlement palladium
DIAMOND TECHNOLOGIES
IPC-A-610C
gold embrittlement
sn-pb-ag solder paste
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Cu6Sn5
Abstract: 22A121 AN2035 Cu3Sn an2035 st Cu6Sn5 surface energy 176L FeNi42 SO36L
Text: AN2035 Application note Control of whisker growth in Tin alloy coatings 1 Nature of whiskers and whisker mitigation techniques Some metals show an unusual metallurgical phenomenon: a single, microscopic crystal filament of the metal grows “spontaneously” from its surface. The metals concerned include
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AN2035
Cu6Sn5
22A121
AN2035
Cu3Sn
an2035 st
Cu6Sn5 surface energy
176L
FeNi42
SO36L
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SZZA024
Abstract: ic ZN 415 ic ZN 415 datasheet CU-106A IPC-A-610C 91Sn Cu6Sn5
Text: Application Report SZZA024 - January 2001 Evaluation of Nickel/Palladium-Finished ICs With Lead-Free Solder Alloys Douglas Romm, Bernhard Lange, and Donald Abbott Standard Linear & Logic ABSTRACT A nickel/palladium Ni/Pd lead finish for integrated circuits (IC) was introduced in 1989. In
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SZZA024
ic ZN 415
ic ZN 415 datasheet
CU-106A
IPC-A-610C
91Sn
Cu6Sn5
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PQFN footprint
Abstract: IRFH7911PbF PQFN AN-1154 JESD-30 JESD30E
Text: Application Note AN-1154 Power QFN Technology Footprint / Stencil Recommendation Application Note By Behnia Barzegarian Table of Contents Page Inspection Techniques . 3 Examples of Proper Mounting . 3
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AN-1154
127mm
102mm
PQFN footprint
IRFH7911PbF
PQFN
AN-1154
JESD-30
JESD30E
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JESD22A121
Abstract: IC SEM 2005 SZZA051B chopin JEDEC no 21 environmental acceptance requirements for tin whiskers susceptibility of tin and tin al JESD22a121 measuring whisker growth on tin and tin alloy surfaces finishes SZZA031
Text: Application Report SZZA051B – August 2005 – Revised August 2005 Whisker Evaluation of Pb-Free Component Leads Donald C. Abbott, Stu Grenney, Larry Nye, Douglas W. Romm . SLL Logic ABSTRACT Integrated circuits ICs with both tin-lead (SnPb) and Pb-free finished leads were
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SZZA051B
JESD22A121
IC SEM 2005
SZZA051B
chopin
JEDEC no 21 environmental acceptance requirements for tin whiskers susceptibility of tin and tin al
JESD22a121 measuring whisker growth on tin and tin alloy surfaces finishes
SZZA031
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Copper Alloy C151
Abstract: C151 C194 BERG Electronics c151 c194 shear stress TO 92 leadframe abstract on mini ups system abstract on mini ups system circuit design et 455 PACKAGE THERMAL CHARACTERIZATION
Text: APPLICATIONS INFORMATION HIGH-PERFORMANCE POWER PACKAGE FOR POWER-INTEGRATED CIRCUIT DEVICES HIGH-PERFORMANCE POWER PACKAGE FOR POWER-INTEGRATED CIRCUIT DEVICES ABSTRACT A new, high-performance version of a Plastic Dual-In-Line package with improved reliability levels has been
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ic shelf life
Abstract: J-STD-002 J-STD-002B B827 SZZA002 IPC EIA J-STD-001 J-STD-001 SZZA046 um43a
Text: Application Report SZZA046 - June 2004 Shelf-Life Evaluation of Lead-Free Component Finishes Douglas W. Romm, Donald C. Abbott, and Bernhard Lange ABSTRACT The integrated circuit IC industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time
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SZZA046
ic shelf life
J-STD-002
J-STD-002B
B827
SZZA002
IPC EIA J-STD-001
J-STD-001
um43a
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Collector Contact Optimization in GaAs HBT Manufacturing
Abstract: No abstract text available
Text: Collector Contact Optimization in GaAs HBT Manufacturing Lam Luu-Henderson, Daniel Weaver, Heather Knoedler, Shiban Tiku lam.luu@skyworksinc.com Skyworks Solutions, Inc. Newbury Park, CA 91320 Keywords: Collector, Resistance, GaAs HBT, AuGe, Ni, Alloy Abstract
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Abstract: No abstract text available
Text: THERMAL PERFORMANCE OF AN ELLIPTICAL PIN FIN HEAT SINK Christopher L. Chapman, and Seri Lee Aavid Engineering, Inc. Laconia, New Hampshire 03247 Bill L. Schmidt Silicon Graphics Computer Systems Mountainview, California 94039 L m Abstract Comparative thermal tests have been carried out using
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smema
Abstract: STR22 smema wiring smema control technical of tamura solder paste Cu6Sn5 telcon Schloetter NASA Group TND311
Text: TND311 Tin Whisker Info “Brief” http://onsemi.com APPLICATION NOTE Tin whiskers are a potential concern with high-tin Sn content lead finishes (this includes alloys such as SnBi, and SnCu). SnPb alloys introduced in the 1950's have been the most successful in controlling whiskers. It is widely
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TND311
TND311/D
smema
STR22
smema wiring
smema control
technical of tamura solder paste
Cu6Sn5
telcon
Schloetter
NASA Group
TND311
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Assisted Living Facilities
Abstract: No abstract text available
Text: APPLICATION STABILOY Brand conductors and cables are UL Listed and can be used for services, feeders and branch circuits. STABILOY® BRAND FEEDER SOLUTIONS – Service and feeder conductors to the main distribution center in a variety of buildings including: independent living retirement communities, continuing care retirement communities,
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BW-0107-0514
Assisted Living Facilities
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xc68040
Abstract: xc68307 MC88110 mpc 1488 mc68185 Motorola M 9587 xc68lc040 XPC106 MC88100 XPC105
Text: BR1100/D REV 22 Microprocessor and Memory Technologies Group Reliability and Quality Report Third Quarter 1996 MICROPROCESSOR AND MEMORY TECHNOLOGIES GROUP RELIABILITY AND QUALITY REPORT QUARTER 3, 1996 MOTOROLA INC., 1996 To Our Valued Customers: Thank You! Thank you for selecting Motorola as your supplier of Microprocessor and Memory Products.
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BR1100/D
xc68040
xc68307
MC88110
mpc 1488
mc68185
Motorola M 9587
xc68lc040
XPC106
MC88100
XPC105
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kyocera bismuth titanate
Abstract: composite elastic modulus Fracture Behavior of Ceramics Used in Multilayer crc avx
Text: TECHNICAL INFORMATION FACTORS RESPONSIBLE FOR THERMAL SHOCK BEHAVIOR OF CHIP CAPACITORS By Bharat S. Rawal, Richard Ladew and Ricardo Garcia Abstract: Thermal shock behavior of multilayer ceramic chip capacitors was evaluated for different ceramic dielectrics with varying construction and design
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S-FRTSB00M0900-C
kyocera bismuth titanate
composite elastic modulus
Fracture Behavior of Ceramics Used in Multilayer
crc avx
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Fracture Behavior of Ceramics Used in Multilayer
Abstract: crc avx Film Microelectronics
Text: TECHNICAL INFORMATION FACTORS RESPONSIBLE FOR THERMAL SHOCK BEHAVIOR OF CHIP CAPACITORS By Bharat S. Rawal, Richard Ladew and Ricardo Garcia Abstract: Thermal shock behavior of multilayer ceramic chip capacitors was evaluated for different ceramic dielectrics with varying construction and design
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S-FRTSB00M0900-C
Fracture Behavior of Ceramics Used in Multilayer
crc avx
Film Microelectronics
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Untitled
Abstract: No abstract text available
Text: Date 03-31-10 RevNo Revision note ORIGINAL A Signature Checked T i4 .0 ± 0 .2 5.8±0.2 ^b.10lg-1 2.00 3.20 PROHIBITION AREA WITHOUT CIRCUIT ON PCB □ 0 # cn ll 2.40 ^ j | •■■ 'll— 7.00 DATE CODE □ e f RECOMMENDED PADS LAYOUT <TOP VIEW> NOTE: TOLERANCE FOR PCB LAYOUT IS ± 0 .0 5
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OCR Scan
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10lg-1
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