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    SZZA002

    Abstract: 2162 20-pin qfp QFP Shipping Trays ic shelf life 20-PIN EIA-638 B825-92 B810-91
    Text: Shelf-Life Evaluation of Nickel/Palladium Lead Finish for Integrated Circuits SZZA002 April 1998 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest


    Original     		SZZA002 B827-92, B825-92, B810-91, ANSI/EIA-638, SZZA002 2162 20-pin qfp QFP Shipping Trays ic shelf life 20-PIN EIA-638 B825-92 B810-91 PDF

    ic shelf life

    Abstract: J-STD-002 J-STD-002B B827 SZZA002 IPC EIA J-STD-001 J-STD-001 SZZA046 um43a
    Text: Application Report SZZA046 - June 2004 Shelf-Life Evaluation of Lead-Free Component Finishes Douglas W. Romm, Donald C. Abbott, and Bernhard Lange ABSTRACT The integrated circuit IC industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time


    Original     		SZZA046 ic shelf life J-STD-002 J-STD-002B B827 SZZA002 IPC EIA J-STD-001 J-STD-001 um43a PDF