MS-026
Abstract: TQFP80
Text: PDF: 2003 Mar 28 Philips Semiconductors Package outline TQFP80: plastic thin quad flat package; 80 leads; body 12 x 12 x 1 mm SOT375-1 c y X A 60 41 61 40 ZE e E HE A 3 A A2 A1 w M θ bp Lp pin 1 index L 80 21 detail X 20 1 ZD e bp v M A w M D B HD v M B
|
Original
|
TQFP80:
OT375-1
MS-026
MS-026
TQFP80
|
PDF
|
TQFP80 package
Abstract: MS-026 TQFP80
Text: PDF: 2000 Jan 05 Philips Semiconductors Package outline TQFP80: plastic thin quad flat package; 80 leads; body 12 x 12 x 1.0 mm SOT375-1 c y X A 60 41 61 40 ZE e E HE A 3 A A2 A1 w M θ bp Lp pin 1 index L 80 21 detail X 20 1 ZD e bp v M A w M D B HD v M B
|
Original
|
TQFP80:
OT375-1
MS-026
TQFP80 package
MS-026
TQFP80
|
PDF
|
sot375
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline TQFP80: plastic thin quad flat package; 80 leads; body 12 x 12 x 1.0 mm SOT375-1 c y X A 60 41 61 40 ZE e E HE A 3 A A2 A1 wM θ bp Lp pin 1 index L 80 21 detail X 20 1 ZD e bp v M A wM D B HD v M B
|
Original
|
TQFP80:
OT375-1
OT375-1
96Philips
sot375
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Package outline TQFP80: plastic thin quad flat package; 80 leads; body 12 x 12 x 1 mm SOT375-1 c y X A 60 41 61 40 ZE e E HE A 3 A A2 A1 w M θ bp Lp pin 1 index L 80 21 1 detail X 20 e ZD w M bp v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)
|
Original
|
TQFP80:
OT375-1
MS-026
|
PDF
|
LQFP64. footprint
Abstract: dual infrared transistor TQFP80 footprint QFP package weight diode databook package outline SMD Packages TQFP100 footprint LQFP32 LQFP48 LQFP64
Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is
|
Original
|
QFP52
OT379-1)
QFP100
OT317-1,
OT317-2,
OT382-1)
QFP160
OT322-1)
LQFP64. footprint
dual infrared transistor
TQFP80 footprint
QFP package weight
diode databook package outline
SMD Packages
TQFP100 footprint
LQFP32
LQFP48
LQFP64
|
PDF
|
TQFP100 footprint
Abstract: SMD codes databook LQFP32 LQFP48 LQFP64 LQFP80 QFP100 QFP160 QFP52 SSOP16
Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when though-hole and surface mounted components are mixed on one printed-circuit board. However, wave
|
Original
|
SSOP16
OT369-1)
SSOP20
OT266-1)
QFP52
OT379-1)
QFP100
OT317-1,
OT317-2
OT382-1)
TQFP100 footprint
SMD codes databook
LQFP32
LQFP48
LQFP64
LQFP80
QFP100
QFP160
QFP52
SSOP16
|
PDF
|
2SB5950
Abstract: B0540C to-53 2SB595-0 B0242c 2N3186 2N3198
Text: POWER SILICON PNP Item Number Part Number I C} 5 -10 20 2SB1270 2SB9200 2SA1293 2N5005 2N5153 2N5153S 2N5609 2N5617 See Index NthAmerSemi Semelab SGS-Ates NthAmerSemi NEC Corp JA See Index Matsushita Matsushita Matsushita ~emel~ ToshibaCorp Sanyo Elect Sanyo Elect
|
Original
|
2N5410
9FT36
9UX78
BUX78
2SA1069AL
2N6191
2SB869
2SB933
2SB945
2SB5950
B0540C
to-53
2SB595-0
B0242c
2N3186
2N3198
|
PDF
|
TQFP80 footprint dimensions
Abstract: QFP44 footprint STK403-040
Text: This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
|
Original
|
QFP64
TQFP80 footprint dimensions
QFP44 footprint
STK403-040
|
PDF
|
2SB616 NEC
Abstract: B0952 SOT3323 6u60 2N3185 B0952F
Text: POWER SILICON PNP Item Number Part Number I C 5 10 20 25 30 35 40 50 60 70 80 200 200 140 140 200 200 400 400 200 200 2SA1469S 2SA1259 B0223 SML3705 SML3728 SML3777 SML3323 SML3327 2N3177 2N3181 2N3185 2N3189 2N3193 2N3197 SOT3723 SOT3723 SOT3723 SOT3731
|
Original
|
Sol18
O-220AB
O-220
OT-186
OT3303
OT3323
2SB616 NEC
B0952
SOT3323
6u60
2N3185
B0952F
|
PDF
|
TQFP80 footprint
Abstract: TQFP100 footprint QFP160 diode databook package outline SMD CODE databook SMD Packages TQFP80 package LQFP32 LQFP48 LQFP64
Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is
|
Original
|
SSOP16
OT369-1)
SSOP20
OT266-1)
QFP52
OT379-1)
QFP100
OT317-1,
OT317-2,
OT382-1)
TQFP80 footprint
TQFP100 footprint
QFP160
diode databook package outline
SMD CODE databook
SMD Packages
TQFP80 package
LQFP32
LQFP48
LQFP64
|
PDF
|
TQFP100 footprint
Abstract: TQFP80 footprint SMD CODE databook HDIP TQFP 44 PACKAGE footprint diode databook package outline SMD Packages TQFP80 package LQFP32 LQFP48
Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is
|
Original
|
QFP52
OT379-1)
QFP100
OT317-1,
OT317-2,
OT382-1)
QFP160
OT322-1)
TQFP100 footprint
TQFP80 footprint
SMD CODE databook
HDIP
TQFP 44 PACKAGE footprint
diode databook package outline
SMD Packages
TQFP80 package
LQFP32
LQFP48
|
PDF
|
LQFP32
Abstract: LQFP48 LQFP64 LQFP80 QFP100 QFP160 QFP52 SSOP16 SSOP20 TQFP64
Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when though-hole and surface mounted components are mixed on one printed-circuit board. However, wave
|
Original
|
SSOP16
OT369-1)
SSOP20
OT266-1)
QFP52
OT379-1)
QFP100
OT317-1,
OT317-2
OT382-1)
LQFP32
LQFP48
LQFP64
LQFP80
QFP100
QFP160
QFP52
SSOP16
SSOP20
TQFP64
|
PDF
|
LQFP32
Abstract: LQFP48 LQFP64 LQFP80 QFP100 QFP160 QFP52 SSOP16 SSOP20 TQFP64
Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when though-hole and surface mounted components are mixed on one printed-circuit board. However, wave
|
Original
|
SSOP16
OT369-1)
SSOP20
OT266-1)
QFP52
OT379-1)
QFP100
OT317-1,
OT317-2
OT382-1)
LQFP32
LQFP48
LQFP64
LQFP80
QFP100
QFP160
QFP52
SSOP16
SSOP20
TQFP64
|
PDF
|
SOT411
Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which
|
Original
|
|
PDF
|
|
|
2sc3052ef
Abstract: 2n2222a SOT23 TRANSISTOR SMD MARKING CODE s2a 1N4148 SMD LL-34 TRANSISTOR SMD CODE PACKAGE SOT23 2n2222 sot23 TRANSISTOR S1A 64 smd 1N4148 SOD323 semiconductor cross reference toshiba smd marking code transistor
Text: Small Signal Discretes Selection Guide [ www.infineon.com/smallsignaldiscretes ] 2 Contents Selection Guide 4 RF Bipolar Transistors & Active Bias Controller 4 RF Switches 6 RF MMICs 7 RF Diodes 8 RF MOSFET 16 Schottky Diodes 18 ESD and EMI Protection Devices and Filters
|
Original
|
24GHz
BF517
B132-H8248-G5-X-7600
2sc3052ef
2n2222a SOT23
TRANSISTOR SMD MARKING CODE s2a
1N4148 SMD LL-34
TRANSISTOR SMD CODE PACKAGE SOT23
2n2222 sot23
TRANSISTOR S1A 64 smd
1N4148 SOD323
semiconductor cross reference
toshiba smd marking code transistor
|
PDF
|
TQFP100 footprint
Abstract: TQFP80 footprint diode databook package outline SMD codes databook LQFP32 LQFP48 LQFP64 LQFP80 QFP100 QFP160
Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is
|
Original
|
QFP52
OT379-1)
QFP100
OT317-1,
OT317-2,
OT382-1)
QFP160
OT322-1)
TQFP100 footprint
TQFP80 footprint
diode databook package outline
SMD codes databook
LQFP32
LQFP48
LQFP64
LQFP80
QFP100
QFP160
|
PDF
|
JEDEC TRAY DIMENSIONS
Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors
|
Original
|
manuf86
TQFP80
OT357
TQFP64
OT543
TFBGA64
JEDEC TRAY DIMENSIONS
HSSOP20
ic packages
TRAY TSSOP20 14 X 35
SO16 package trays
BGA304
HLQFP100
MSD504
LQFP64 reel size
PLCC84 package
|
PDF
|
philips sq8
Abstract: QPP80
Text: Philips Semiconductors Package information Soldering SURFACE MOUNTED PACKAGES INTRODUCTION There is no soldering method that is ideal for all 1C packages. Wave soldering is often preferred when though-hole and surface mounted components are mixed on one printed-circuit board. However, wave
|
OCR Scan
|
MO-15QAH
OT341-1
philips sq8
QPP80
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all 1C packages. Wave soldering is often preferred when though-hole and surface mounted components are mixed on one printed-circuit board. However, wave
|
OCR Scan
|
|
PDF
|
sx3704
Abstract: AP239 Transistor 80139 8C547 6C131C IN2222A 2N50B 2N2064 radio AC176 AC126 sft353
Text: INTERNATIONAL TRANSISTOR EQUIVALENTS GUIDE A LSO BY THE S A M E AUTHOR BP108 International Diode Equivalents Guide BP140 Digital IC Equivalents and Pin Connections BP141 Linear IC Equivalents and Pin Connections ALSO OF INTEREST BP234 Transistor Selector Guide
|
OCR Scan
|
|
PDF
|
PHILIPS OQ 0501
Abstract: philips OQ 051 oq 0066 oq 0051 PHILIPS 036 M/HD 780 footprint jedec MS-026 TQFP mo-001 packages philips
Text: Philips Semiconductors Package information Package outlines INDEX DESCRIPTION NAME VERSION PAGE DIP dual in-line package plastic dual in-line package; 8 leads (300 mil) plastic dual in-line package; 14 leads (300 mil) SOT97-1 1327 SOT27-1 1328 DIP16 plastic dual in-line package; 16 leads (300 mil); long body
|
OCR Scan
|
DIP14
DIP16
DIP18
DIP20
DIP24
DIP28
DIP40
LQFP32
PHILIPS OQ 0501
philips OQ 051
oq 0066
oq 0051
PHILIPS 036
M/HD 780
footprint jedec MS-026 TQFP
mo-001 packages philips
|
PDF
|
LQFP64. footprint
Abstract: T317 HDIP
Text: Philips Semiconductors Soldering Package information INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all 1C packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is
|
OCR Scan
|
|
PDF
|
TQFP100 footprint
Abstract: LQFP32 footprint
Text: Philips Semiconductors Package information Table 3 Soldering Suitability of surface mounted packages for various soldering methods: rating from ‘a’ to ‘d’: ‘a’ indicates most suitable soldering is not difficult ; ‘d’ indicates least suitable (soldering is achievable with difficulty).
|
OCR Scan
|
|
PDF
|
HDIP
Abstract: No abstract text available
Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all 1C packages. Wave soldering is often preferred when though-hole and surface mounted components are mixed on one printed-circuit board. However, wave
|
OCR Scan
|
|
PDF
|
