Untitled
Abstract: No abstract text available
Text: STE08PSP 08-channel high-power integrated PSE line manager Preliminary Data Features • Full programmable power sourcing equipment PSE power control device ■ Supports up to 8 independent high-power (up to 50 W) channels, no need for external FET ■ Low cost small size TQFP80 14 x14 exposed
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STE08PSP
08-channel
TQFP80
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MS-026
Abstract: TQFP80
Text: PDF: 2003 Mar 28 Philips Semiconductors Package outline TQFP80: plastic thin quad flat package; 80 leads; body 12 x 12 x 1 mm SOT375-1 c y X A 60 41 61 40 ZE e E HE A 3 A A2 A1 w M θ bp Lp pin 1 index L 80 21 detail X 20 1 ZD e bp v M A w M D B HD v M B
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TQFP80:
OT375-1
MS-026
MS-026
TQFP80
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Untitled
Abstract: No abstract text available
Text: ST7MDT20-T80/DVP TQFP80 14x14 connection kit for ST7MDT20-DVP3 Data brief Features Figure 2. • TQFP80/64/44 adapter (DB530): Allows the connection of your ST7MDT20-DVP3 emulator to your application board in place of your ST7. ■ TQFP80 (14x14) device adapter (DB531):
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ST7MDT20-T80/DVP
TQFP80
14x14)
ST7MDT20-DVP3
TQFP80/64/44
DB530)
ST7MDT20-DVP3
DB531)
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Untitled
Abstract: No abstract text available
Text: TQFP80-P-1212-0.50-K Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 0.40 TYP. 4 版/96.10.28
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TQFP80-P-1212-0
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TQFP80V
Abstract: No abstract text available
Text: TQFP80V LSI Assembly • TQFP80V 14.0 ± 0.3 12.0 ± 0.2 41 61 40 80 21 1.2Max. 1.0 ± 0.1 0.1 ± 0.1 1 0.2 ± 0.1 0.5 12.0 ± 0.2 14.0 ± 0.3 60 20 0.5 The contents described herein are subject to change without notice. 0.125 ± 0.1 0.08 Units : mm Appendix
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TQFP80V
TQFP80V
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TQFP80 package
Abstract: MS-026 TQFP80
Text: PDF: 2000 Jan 05 Philips Semiconductors Package outline TQFP80: plastic thin quad flat package; 80 leads; body 12 x 12 x 1.0 mm SOT375-1 c y X A 60 41 61 40 ZE e E HE A 3 A A2 A1 w M θ bp Lp pin 1 index L 80 21 detail X 20 1 ZD e bp v M A w M D B HD v M B
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TQFP80:
OT375-1
MS-026
TQFP80 package
MS-026
TQFP80
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Untitled
Abstract: No abstract text available
Text: TQFP80-P-1212-0.50-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.40 TYP. 4/Oct. 28, 1996
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TQFP80-P-1212-0
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Untitled
Abstract: No abstract text available
Text: 80P6C-A Plastic 80pin 12✕12mm body TQFP EIAJ Package Code TQFP80-P-1212-0.50 Weight g Lead Material Alloy 42 MD e JEDEC Code – HD D ME 61 b2 80 60 1 I2 20 HE E Recommended Mount Pad Symbol 41 21 40 A L1 F A1 c A2 e b L y Detail F A A1 A2 b c D E e HD
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80P6C-A
80pin
TQFP80-P-1212-0
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GDM1602A
Abstract: GDM1602 16x2 lcd xiamen BERG 14 pin connector KobiConn lcd gdm1602a 2 pin connector sip2 Xiamen Ocular LCD 16X2 ALPHANUMERIC ST7FLITE39
Text: STEVAL-CCH002V1 Bill of material Bill of material Designator Qty Reference Value/ generic part number Package Manufacturer U11 1 HDMI/DVI 2:1 switch STHDMI002A TQFP48 STMicroelectronics U35 1 HDMI/DVI 3:1 switch and equalizer STDVE003A TQFP80 STMicroelectronics
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STEVAL-CCH002V1
STHDMI002A
TQFP48
STDVE003A
TQFP80
STMAV335
TSSOP16
STMAV340
ST4300
GDM1602A
GDM1602
16x2 lcd xiamen
BERG 14 pin connector
KobiConn
lcd gdm1602a
2 pin connector sip2
Xiamen Ocular
LCD 16X2 ALPHANUMERIC
ST7FLITE39
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TQFP80V
Abstract: No abstract text available
Text: TQFP80V LSI Assembly Units : mm • TQFP80V 14.0±0.3 12.0±0.2 41 61 40 80 21 1.2Max. 1.0±0.1 0.1±0.1 1 0.5 12.0±0.2 14.0±0.3 60 20 0.125±0.1 0.2±0.1 0.5 ∗ The contents described herein are subject to change without notice. 0.08
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TQFP80V
TQFP80V
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TQFP80U
Abstract: No abstract text available
Text: TQFP80U LSI Assembly Units : mm • TQFP80U 12.0±0.3 10.0±0.2 41 61 40 80 21 1.2Max. 1.0±0.1 0.1±0.1 1 20 0.4 0.5 10.0±0.2 12.0±0.3 60 0.125±0.1 0.08 0.15±0.1 ∗ The contents described herein are subject to change without notice.
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TQFP80U
TQFP80U
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sot375
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline TQFP80: plastic thin quad flat package; 80 leads; body 12 x 12 x 1.0 mm SOT375-1 c y X A 60 41 61 40 ZE e E HE A 3 A A2 A1 wM θ bp Lp pin 1 index L 80 21 detail X 20 1 ZD e bp v M A wM D B HD v M B
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TQFP80:
OT375-1
OT375-1
96Philips
sot375
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Untitled
Abstract: No abstract text available
Text: Package outline TQFP80: plastic thin quad flat package; 80 leads; body 12 x 12 x 1 mm SOT375-1 c y X A 60 41 61 40 ZE e E HE A 3 A A2 A1 w M θ bp Lp pin 1 index L 80 21 1 detail X 20 e ZD w M bp v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)
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TQFP80:
OT375-1
MS-026
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XFORMER
Abstract: exact difference between smps dc-dc converter E-STE08PSP p33 thermal senser BAT49 IEE802 RFC3621 TQFP80 mps 1580 RESISTOR 820 OHM
Text: STE08PSP 08-channel high-power integrated PSE line manager Preliminary Data Features • Full programmable power sourcing equipment PSE power control device ■ Supports up to 8 independent high-power (up to 50 W) channels, no need for external FET ■ Low cost small size TQFP80 14 x14 exposed
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STE08PSP
08-channel
TQFP80
XFORMER
exact difference between smps dc-dc converter
E-STE08PSP
p33 thermal senser
BAT49
IEE802
RFC3621
mps 1580
RESISTOR 820 OHM
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TQFP80 package
Abstract: No abstract text available
Text: TQFP80-P-1212-0.50-K Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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TQFP80-P-1212-0
TQFP80 package
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RFC3621
Abstract: TQFP80 "power sourcing equipment"
Text: STE08PSP 08-channel high-power integrated PSE line manager Data Brief Features • Full programmable Power Sourcing Equipment PSE power control device ■ Supports up to 8 independent high-power (up to 50 W) channels, no need for external FET ■ Low-cost small size TQFP80 14 mm x 14 mm
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STE08PSP
08-channel
TQFP80
RFC3621
"power sourcing equipment"
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SSD1502G32
Abstract: SSD1502 cyberdisplay VGA kopin KCD-A900-QA-TP KCD-A900-QA cyberdisplay kopin vga SSD1502QT4 color space look-up table mapping
Text: SSD1502 Display Driver for The CyberDisplay VGA Color Display Part Numbers: KCD-A900-QA TQFP80 package KCD-A900-QA-TP (BGA80 package) Ver. 0.1 August 14, 2006 KOPIN TABLE OF CONTENTS 1 GENERAL DESCRIPTION. 5
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SSD1502
KCD-A900-QA
TQFP80
KCD-A900-QA-TP
BGA80
SSD1502
KCD-A900-QA
SSD1502G32
cyberdisplay VGA
kopin
KCD-A900-QA-TP
cyberdisplay
kopin vga
SSD1502QT4
color space look-up table mapping
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12X12
Abstract: No abstract text available
Text: SANYO Semiconductor Thin Quad Flat Package 80Pin Plastic TQFP80J 12X12 Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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80Pin
TQFP80J
12X12)
ED-7303A)
TQFP80J
12X12
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Untitled
Abstract: No abstract text available
Text: Package outline TQFP80: plastic thin quad flat package; 80 leads; 14 x 14 x 1.1 mm SOT1093-1 c y X 60 A 41 40 61 ZE e E HE A A2 A3 A1 w θ bp detail X pin 1 index L 21 80 1 20 bp D e w ZD A v B 2.5 5 mm scale Dimensions Unit max nom min v B HD mm Lp A 1.2
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TQFP80:
OT1093-1
136E19
MS-026
sot1093-1
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PTQP0080KC-A
Abstract: P-TQFP80-12x12-0 P-TQFP-80
Text: JEITA Package Code P-TQFP80-12x12-0.50 RENESAS Code PTQP0080KC-A Previous Code TFP-80C/TFP-80CV MASS[Typ.] 0.4g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 60 41 61 40 bp c c1 HE Reference
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P-TQFP80-12x12-0
PTQP0080KC-A
TFP-80C/TFP-80CV
5P-TQFP80-12x12-0
PTQP0080KC-A
P-TQFP-80
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Untitled
Abstract: No abstract text available
Text: TQFP80V LSI Assembly Units : mm • TQFP80V 14.0 12.0 60 41 40 80 21 14.0 12.0 61 1 20 H=1.2Max. The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any
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TQFP80V
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DB531
Abstract: TQFP80 14x14 tqfp 64 socket
Text: ST7MDT20-T80/DVP TQFP80 14x14 Connection Kit for ST7MDT20-DVP3 DATA BRIEF The TQFP80 (14x14) Connection Kit (ST7 MDT20-T80/DVP) provides the hardware you need to connect your ST7MDT20-DVP3 emulator to your application when debugging applications for ST7 microcontrollers in the TQFP80 (14x14)
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ST7MDT20-T80/DVP
TQFP80
14x14)
ST7MDT20-DVP3
MDT20-T80/DVP)
ST7MDT20-DVP3
DB531
TQFP80
14x14
tqfp 64 socket
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Untitled
Abstract: No abstract text available
Text: QFP-Socket and Emulation-Adapter HHSÌ3 QFP/TQFP80 20 x 20 0.65 mm pitch IC - Dimensions Adapter PCB-Layout (View from Soldering Side) Socket PCB-Layout (Top View) 2-20. 50min .4-14. 70max .65 x 19.= ß. 6 5 * 1 9 = 1 2 . 3 5 ± 0 . 12.35 ±0. 4 - 1 3. 0 Ori I r
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QFP/TQFP80
50min
70max
IC149-080-017-S5
IC149-080-117-S5
I49-080-017-B5
IC149-080-021-S5
IC149-080-121-S5
IC149-080-021-B5
IC149-080-121-B5
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TQFP80-P-1212-0
Abstract: No abstract text available
Text: TQFP80-P-1212-0.50B Uniti rin 14, 0±0, 2 12, 0 ± 0 , 1 >ln O J 41 60 CL 61 40 CU 80 21 Ur CD +1 O CD +1 O CÙ ' 1 ^ t~ 20 1, 25TYP 0, 5 Pi q +0, 05 u. c -o . 04 eia i<k> o o+1 c cu o cu LO X O LO P IO . 081 +1 CD Apr ,2000
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TQFP80-P-1212-0
25TYP
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