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    philips sq8

    Abstract: QPP80
    Text: Philips Semiconductors Package information Soldering SURFACE MOUNTED PACKAGES INTRODUCTION There is no soldering method that is ideal for all 1C packages. Wave soldering is often preferred when though-hole and surface mounted components are mixed on one printed-circuit board. However, wave


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    PDF MO-15QAH OT341-1 philips sq8 QPP80