Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    JEDEC BGA TRAY Search Results

    JEDEC BGA TRAY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    JEDEC BGA TRAY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    tray datasheet bga

    Abstract: BGA35
    Text: Mounting Pad Packing Name JEDEC Tray T-657 352 pin BGA 35 x 35 A S B C D P J H R K L φM F E I G M NOTE Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition. ITEM A MILLIMETERS 35.00±0.15


    Original     		PDF T-657 P352S1-F6 tray datasheet bga BGA35

    tray datasheet bga

    Abstract: S 657 A S352S1-F6-1
    Text: Packing Name Mounting Pad JEDEC Tray T-657 352 pin BGA 35 x 35 A B S C D P Index mark J R I H F K L φM E G M NOTE Each lead centerline is located within φ 0.3 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition. NEC CODE S352S1-F6-1


    Original     		PDF T-657 S352S1-F6-1 tray datasheet bga S 657 A S352S1-F6-1

    tray datasheet bga

    Abstract: F5 MARK S313S1-F5-1
    Text: Packing Name Mounting Pad JEDEC Tray T-657 313 pin BGA 35 x 35 A B S C D P Index mark J R I H T K L φM M NOTE E G F Each lead centerline is located within φ 0.3 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition. NEC CODE S313S1-F5-1


    Original     		PDF T-657 S313S1-F5-1 tray datasheet bga F5 MARK S313S1-F5-1

    tray datasheet bga

    Abstract: F5 MARK
    Text: Mounting Pad Packing Name JEDEC Tray T-657 313 pin BGA 35 x 35 A S B B A C D P Index mark J I R A H S T E G F L φM φN M S A B M S *1 *2 detail of A part ITEM MILLIMETERS INCHES A 35.00±0.20 1.378±0.008 B 30.0 1.181 C 30.0 1.181 D E 35.00±0.20 2.26


    Original     		PDF T-657 Y313S1-F5 tray datasheet bga F5 MARK

    tray datasheet bga

    Abstract: No abstract text available
    Text: Packing Name Mounting Pad JEDEC Tray TBGA 40x40 500 pin T-BGA H/Sp (40 × 40) A A B Q A1 R ST D BW A2 X C Y Index mark J A S H B G F L M P M M E S A B *1 S *2 ITEM A MILLIMETERS 40.00±0.20 INCHES 1.575±0.008 A1 23.00 MAX. 0.906 MAX. A2 23.00 MAX. 0.906 MAX.


    Original     		PDF S500N7-H6 tray datasheet bga

    hsp35

    Abstract: C0016
    Text: Packing Name Mounting Pad JEDEC Tray TBGA 35x35 352 pin T-BGA H/Sp (35 × 35) A A B Q A1 R S T BW A2 D X C Index mark Y J H S A G B K φM φP L S M M F E S A B S ∗2 detail of A part ∗1 detail of B part (Z) N ITEM MILLIMETERS INCHES A 35.00±0.20 1.378±0.008


    Original     		PDF S352N7-F6-1 hsp35 C0016

    h 033

    Abstract: P119S1-R4 bga 84
    Text: Packing Name Mounting Pad JEDEC Tray NX BG1422 2.0 119 pin BGA 14 x 22 A S B T C 7 6 5 4 3 2 1 D U T R P NM L K J HG F E DC B A P J I R H K F E G L ITEM MILLIMETERS INCHES A B 22.0±0.2 19.5 0.866±0.008 0.768 C 12.0 0.472 D E 14.0±0.2 0.84 0.551±0.008


    Original     		PDF BG1422 P119S1-R4 h 033 P119S1-R4 bga 84

    hsp35

    Abstract: 1362 597G
    Text: Mounting Pad Packing Name JEDEC Tray TBGA 35x35 420 pin T-BGA H/Sp (35 × 35) A A B Q A1 R S T B W A2 D X C Y Index mark J A S H B G F L M P M M E S A B *1 S *2 ITEM A MILLIMETERS 35.00±0.20 INCHES 1.378±0.008 A1 20.50 MAX. 0.807 MAX. A2 20.50 MAX. 0.807 MAX.


    Original     		PDF S420N7-F6 hsp35 1362 597G

    BGA 8 x 8 tray

    Abstract: tray datasheet bga S576N7
    Text: Mounting Pad Packing Name JEDEC Tray TBGA 40x40 576 pin T-BGA H/Sp (40 × 40) A A B Q A1 R S T BW A2 D X C Y Index mark J S A H B G F L M P M M E S A B *1 S *2 detail of A part (Z) detail of B part K S N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of


    Original     		PDF S576N7-H6 BGA 8 x 8 tray tray datasheet bga S576N7

    256-pin

    Abstract: No abstract text available
    Text: Mounting Pad Packing Name JEDEC Tray TBGA 27x27 256 pin T-BGA H/Sp (45 × 45) B A A Q A1 R S T B W A2 D X C Y Index mark A S J H B G F L M P M M E S A B *1 S *2 detail of A part detail of B part (Z) K S N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of


    Original     		PDF 25MIN. S256N7-B6 256-pin

    transistor h9

    Abstract: No abstract text available
    Text: Mounting Pad Packing Name JEDEC Tray TBGA 40x40 696 pin T-BGA H/Sp (40 × 40) A U B A1 A Q R S T BW V D A2 X C Index mark J H S A G B K φM φP L S M M detail of A part F S A B S ∗2 ∗1 E detail of B part Z N NOTE ∗1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of


    Original     		PDF S696N7-H9 transistor h9

    WY transistor

    Abstract: tray datasheet bga 256-pin BGA S256S1-B6-1
    Text: Mounting Pad Packing Name JEDEC Tray T-651 256 pin BGA 27 x 27 A S B C D Y WV U T R P N M L K J H G F E D C B A P Index mark R H K L 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 φM F E I J G M NOTE Each lead centerline is located within φ 0.3 mm (φ 0.012 inch) of


    Original     		PDF T-651 S256S1-B6-1 WY transistor tray datasheet bga 256-pin BGA S256S1-B6-1

    tray datasheet bga

    Abstract: 0n 33 25
    Text: Packing Name Mounting Pad JEDEC Tray T-657 352 pin BGA 35 x 35 A B A B S 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 C D AE AC AA W U R N L J G E C A AF AD AB Y V T P M K H F D B P Index mark J I R H S K L φM φN S F M S A B M


    Original     		PDF T-657 Y352S1-F6-1 tray datasheet bga 0n 33 25

    tray datasheet bga

    Abstract: 256-pin BGA BGA L WY transistor
    Text: Packing Name Mounting Pad JEDEC Tray T-651 256 pin BGA 27 x 27 A S B B A C 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D YWV U T R P N M L K J H G F E D C B A P Index mark J R I A H S F L φM φN M S A B M S E G *1 *2 detail of A part K S NOTES * 1 Each lead centerline is located within φ 0.30 mm (φ 0.012 inch) of


    Original     		PDF T-651 Y256S1-B6 tray datasheet bga 256-pin BGA BGA L WY transistor

    676 BGA package tray

    Abstract: BGA package tray NEC 2415 tray bga 676-Pin 596-PIN 27ES jedec tray BGA tray datasheet bga BGA JEDEC tray
    Text: TRAY CONTAINER UNIT : mm 4x10=40 NEC 7 135°C MAX. 27.50 29.20 262.8 315.0 322.6 26.10 Section A – A' 27.50 27.00 (5.95) (6.35) 7.62 27.50 29.20 87.6 BGA27×27ESP A' 24.15 135.9 PPE A Applied Package Quantity (pcs) Tray BGA27×27ESP 225-pin Plastic BGA (27×27)


    Original     		PDF BGA27 27ESP 225-pin 256-pin 272-pin 316-pin 320-pin 352-pin 676 BGA package tray BGA package tray NEC 2415 tray bga 676-Pin 596-PIN 27ES jedec tray BGA tray datasheet bga BGA JEDEC tray

    676 BGA package tray

    Abstract: tray bga BGA package tray jedec bga tray NEC 2415 tray bga 27
    Text: TRAY CONTAINER UNIT : mm 4x10=40 NEC 27.50 7 135°C MAX. 29.20 87.6 BGA27×27ESP A' 24.15 27.50 29.20 262.8 26.10 315.0 322.6 SECTION A – A' 27.50 (5.95) (6.35) 27.00 7.62 135.9 PPE A Applied Package 225-pin Plastic BGA (27×27) 256-pin Plastic BGA (27×27)


    Original     		PDF BGA27 27ESP 225-pin 256-pin 272-pin 316-pin 320-pin 352-pin 385-pin 400-pin 676 BGA package tray tray bga BGA package tray jedec bga tray NEC 2415 tray bga 27

    tray datasheet bga

    Abstract: 4545
    Text: TRAY CONTAINER 45.3 27.95 2 x 6 = 12 A' A 48.00 37.50 150°C MAX 135.9 80.0 BGA 45 × 45 PPE 7 HEAT PROOF Unit : mm 45.3 240.0 315.0 322.6 SECTION A – A' Applied Package 4.72 7.62 (6.35) 45.30 44.0 Quantity (pcs) BGA 45 × 45 Tray 480-pin • Plastic BGA (45×45)


    Original     		PDF 480-pin 580-pin 672-pin 756-pin 888-pin SSD-A-H5933-3 tray datasheet bga 4545

    337 BGA

    Abstract: tray bga 256-pin BGA Transistor 337 tray datasheet bga BGA PACKAGE 2015
    Text: TRAY CONTAINER UNIT : mm 5x12=60 A' 135°C MAX. 20.15 21.35 7 BGA21×21ESP 23.90 NEC 95.6 135.9 PPE A 21.35 23.90 262.9 26.05 315.0 322.6 SECTION A – A' 21.35 (5.95) 7.62 (6.35) 21.00 Applied Package Quantity (pcs) BGA21×21 ESP Tray 256-pin • Plastic BGA (21×21)


    Original     		PDF BGA21 21ESP 256-pin 272-pin 292-pin 320-pin 337-pin SSD-A-H7071-3 337 BGA tray bga 256-pin BGA Transistor 337 tray datasheet bga BGA PACKAGE 2015

    tray datasheet bga

    Abstract: tray bga
    Text: 150°C MAX 135.9 80 BGA 45 x 45 2 × 6 = 12 PPE 7 HEAT PROOF Unit : mm 45.3 A 48 37.5 45.3 240 315 322.6 SECTION A – A' 45.3 44 4.72 7.62 6.35 27.95 A' BGA 45 × 45 Tray Material Carbon PPE Heat Proof Temp. Surface resistance 135°C 12 less than 1 × 10 Ω /


    Original     		PDF 480-pin 580-pin 672-pin tray datasheet bga tray bga

    nec 2565

    Abstract: SSD-A-H6921 tray datasheet bga BGA package tray 2565 nec tray bga 576
    Text: TRAY CONTAINER HEAT PROOF PPE 150°C MAX 40.25 42.3 30.6 40.25 A' 25.65 A PBGA 40x40 42.3 7 84.6 3×7=21 253.8 315 322.6 SECTION A – A' 40.25 4.74 7.62 6.35 135.9 Unit : mm Applied Package Quantity (pcs) 416-pin Plastic BGA (40×40) 500-pin Plastic BGA (40×40)


    Original     		PDF 500-pin 576-pin 644-pin 416-pin SSD-A-H6921 nec 2565 SSD-A-H6921 tray datasheet bga BGA package tray 2565 nec tray bga 576

    tray bga

    Abstract: BGA22 JEDEC TRAY DIMENSIONS FBGA 60 JEDEC FBGA tray datasheet bga nec 2222 FBGA 320
    Text: TRAY CONTAINER UNIT : mm NEC 7 135°C MAX. 22.35 26.30 105.2 BGA22x22ESP A' 15.35 22.35 25.80 283.8 15.60 315.0 322.6 Section A – A' 22.35 (5.52) (6.35) 22.00 7.62 135.9 5×12=60 PPE A Applied Package Quantity (pcs) Tray BGA 22×22 ESP 320-pin Plastic BGA (22×22)


    Original     		PDF BGA22 22ESP 320-pin 345-pin 385-pin 389-pin 429-pin SSD-A-H6973-4 tray bga JEDEC TRAY DIMENSIONS FBGA 60 JEDEC FBGA tray datasheet bga nec 2222 FBGA 320

    27B1

    Abstract: BGA27 BGA package tray 625-Pin
    Text: TRAY CONTAINER UNIT : mm 4 x 10=40 87.6 135° C MAX. 27.25 24.15 NEC BGA27 × 27B-1 29.20 135.9 PPE A' A 27.25 29.20 26.10 262.8 315.0 322.6 SECTION A-A' 4.17 (6.35) 7.62 27.25 Applied Package Quantity (pcs) Tray BGA27×27B-1 624-pin Plastic BGA (27×27)


    Original     		PDF BGA27 27B-1 BGA27 624-pin 625-pin 720-pin 960-pin SSD-A-H7549-2 27B1 BGA package tray

    nec 575

    Abstract: 484-pin BGA NEC C 324 C jedec tray BGA 324-PIN tray datasheet bga JEDEC tray standard tray bga TRAY DIMENSIONS TRAY CONTAINER
    Text: TRAY CONTAINER UNIT : mm 5x12=60 PPE 135°C MAX. 16.95 25.50 23.25 BGA23×23ESP NEC 102.0 A' 25.50 135.9 A 23.25 17.25 280.5 315.0 322.6 Section A – A' 23.25 (6.07) (6.35) 7.62 23.00 Applied Package Quantity (pcs) 324-pin Plastic BGA (23×23) 352-pin Plastic BGA (23×23)


    Original     		PDF BGA23 23ESP 324-pin 352-pin 484-pin 575-pin SSD-A-H7317-4 nec 575 484-pin BGA NEC C 324 C jedec tray BGA tray datasheet bga JEDEC tray standard tray bga TRAY DIMENSIONS TRAY CONTAINER

    313-PIN

    Abstract: No abstract text available
    Text: UNIT : mm 322.6 315 24.5 266 29.95 A 35.15 38 76 135.9 38 A' 35.15 SECTION A – A' 36.8 5.16 7.62 6.35 35.15 Applied Package 313-pin Plastic BGA 352-pin Plastic BGA 396-pin Plastic BGA Quantity pcs Tray Material MAX. 24 Heat Proof Temp. T-657 Carbon PES


    Original     		PDF 313-pin 352-pin 396-pin T-657