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    BGA21 Price and Stock

    Qualcomm DK-CSRA68105-TFBGA213-A-0

    DEV KIT CSRA68105
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    DigiKey DK-CSRA68105-TFBGA213-A-0 Box 9 1
    • 1 $851.2
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    Qualcomm DB-CSRA68105-TFBGA213-A-0

    DEV KIT, DB-CSRA68105-TFBGA213-A
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    DigiKey DB-CSRA68105-TFBGA213-A-0 Bulk 1
    • 1 $212.8
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    Fischer Connectors ICKBGA21X21

    Heatsink, BGA,24.3 to 8K/W,21x21x6mm, Conductive Adhesive, Conductive Foil Mount | Fischer ICKBGA21X21
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS ICKBGA21X21 Bulk 1
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    Fritz Kuebler Gmbh 8.5873.542B.GA21.0020

    Absolute; Stator Coupling; 12mm bore; SSI/10-30V; 2m Cable; 10-bit | Kuebler 8.5873.542B.GA21.0020
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS 8.5873.542B.GA21.0020 Bulk 12 Weeks 1
    • 1 $848.37
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    Fritz Kuebler Gmbh 8.5863.121B.GA21.0030

    Absolute, Clamp Flange, 10mm shaft, SSI/5V, 3m Cable, 10-bit x 12-bit | Kuebler 8.5863.121B.GA21.0030
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS 8.5863.121B.GA21.0030 Bulk 12 Weeks 1
    • 1 $1091.22
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    Find more BGA21 price and stock on Findchips.com

    BGA21 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    SF-BGA216A-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA216A C 30.48mm [1.200"] See BGA pattern code to the right for actual pattern layout Y 1.27mm [0.050"] 1.27mm [0.050"] X 30.48mm [1.200"] Top View reference only 1.27mm typ. [0.050"] 2 0.36mm [0.014"] dia. 1.27mm [0.050"] 5.33mm 3.74mm [0.147"]


    Original     		PDF BGA216A FR4/G10 25X25 SF-BGA216A-B-11

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA217: plastic ball grid array package; 217 balls; body 23 x 23 x 1.75 mm SOT710-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C U T e R P N M L K e2 J H G F E D C B A shape optional 4x 1 2 3 4 5


    Original     		PDF BGA217: OT710-1 MS-034

    h7673

    Abstract: 360-Pin MPSU 60 transistor tray dimensions BGA21
    Text: TRAY CONTAINER UNIT : mm 5 x 12=60 20.15 135° C MAX. 23.90 BGA21 × 21A A' 21.20 23.90 26.05 21.20 NEC 95.6 135.9 MPSU A 262.9 315.0 322.6 SECTION A-A' (4.62) 6.35 7.62 21.20 Applied Package Quantity (pcs) 360-pin Plastic BGA (21×21) (FLIP CHIP TYPE)


    Original     		PDF BGA21 360-pin BGA21 SSD-A-H7673 h7673 MPSU 60 transistor tray dimensions

    BGA217

    Abstract: MS 034 SOT710-1 MS-034 sot710
    Text: PDF: 2001 Nov 01 Philips Semiconductors Package outline BGA217: plastic ball grid array package; 217 balls; body 23 x 23 x 1.75 mm SOT710-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C U T e R P N M L K e2 J H G F


    Original     		PDF BGA217: OT710-1 MS-034 BGA217 MS 034 SOT710-1 MS-034 sot710

    337 BGA

    Abstract: tray bga 256-pin BGA Transistor 337 tray datasheet bga BGA PACKAGE 2015
    Text: TRAY CONTAINER UNIT : mm 5x12=60 A' 135°C MAX. 20.15 21.35 7 BGA21×21ESP 23.90 NEC 95.6 135.9 PPE A 21.35 23.90 262.9 26.05 315.0 322.6 SECTION A – A' 21.35 (5.95) 7.62 (6.35) 21.00 Applied Package Quantity (pcs) BGA21×21 ESP Tray 256-pin • Plastic BGA (21×21)


    Original     		PDF BGA21 21ESP 256-pin 272-pin 292-pin 320-pin 337-pin SSD-A-H7071-3 337 BGA tray bga 256-pin BGA Transistor 337 tray datasheet bga BGA PACKAGE 2015

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA217 package SOT710-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF BGA217 OT710-1 OT710-1

    BGA217

    Abstract: SF-BGA217A-B-11
    Text: D Package Code: BGA217A C 20.32mm [0.800"] 1.27mm [0.050"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] X 20.32mm [0.800"] Top View reference only 2 1.27mm [0.050"] 0.64mm [0.025"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]


    Original     		PDF BGA217A FR4/G10 SF-BGA217A-B-11 BGA217

    SF-BGA213A-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA213A C 22.86mm [0.900"] 0.71mm [0.028"] See BGA pattern code to the right for actual pattern layout Y 0.58mm [0.023"] X 22.86mm [0.900"] Top View reference only 2 1.27mm [0.050"] 0.36mm [0.014"] dia. 0.71mm [0.028"] 5.33mm 3.74mm [0.147"]


    Original     		PDF BGA213A FR4/G10 SF-BGA213A-B-11

    SAMSUNG MCP

    Abstract: ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor
    Text: Preliminary MCP MEMORY KBB0xB400M Document Title Multi-Chip Package MEMORY 64M Bit 8M x8/4M x16 Dual Bank NOR Flash *2 / 256M Bit (16Mx16) NAND Flash / 64M Bit (4Mx16) UtRAM Revision History Revision No. History 0.0 Initial Draft (64M NOR Flash M-die_rev1.1)


    Original     		PDF KBB0xB400M 16Mx16) 4Mx16) 80-Ball 80x12 SAMSUNG MCP ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor

    Untitled

    Abstract: No abstract text available
    Text: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised


    Original     		PDF K8D6x16UTM K8D6x16UBM 48TSOP1 16M/16M 08MAX

    Untitled

    Abstract: No abstract text available
    Text: AT91SAM ARM-based Embedded MPU SAM9X35 SUMMARY DATASHEET Description The SAM9X35 is a highly-integrated 400 MHz ARM926EJ-S embedded MPU, featuring an extensive peripheral set and high bandwidth architecture for industrial applications that require refined user interfaces and high-speed communication.


    Original     		PDF AT91SAM SAM9X35 SAM9X35 ARM926EJ-Sâ 10-bit 10/100Mbps

    Untitled

    Abstract: No abstract text available
    Text: ARM-based Embedded MPU SAM9G35 DATASHEET Description The SAM9G35 is a member of the Atmel series of 400 MHz ARM926EJ-S embedded MPUs that support high bandwidth communication and advanced user interfaces and are optimized for industrial applications such as building automation,


    Original     		PDF SAM9G35 SAM9G35 ARM926EJ-Sâ 10-bit

    Untitled

    Abstract: No abstract text available
    Text: ARM-based Embedded MPU SAM9N12 SAM9CN11 SAM9CN12 SUMMARY DATASHEET Description Based on the ARM926EJ-S processor, the Atmel SAM9N12/CN11/CN12 devices offer the frequently-requested combination of user interface functionality and high data rate connectivity, with LCD Controller, resistive touch-screen, multiple UARTs, SPI,


    Original     		PDF SAM9N12 SAM9CN11 SAM9CN12 ARM926EJ-Sâ SAM9N12/CN11/CN12 32-Kbyte

    AT91SAM9260B-CU

    Abstract: AT91SAM9260B-QU application note SAM9260
    Text: Features • 180 MHz ARM926EJ-S ARM Thumb® Processor – 8 KBytes Data Cache, 8 KBytes Instruction Cache, MMU • Memories • • • • – 32-bit External Bus Interface supporting 4-bank SDRAM/LPSDR, Static Memories, CompactFlash, SLC NAND Flash with ECC


    Original     		PDF ARM926EJ-STM 32-bit 32-kbyte 10-bit 6221KS 17-May-11 AT91SAM9260B-CU AT91SAM9260B-QU application note SAM9260

    SAMSUNG MCP

    Abstract: samsung K5 MCP BA35 BA4110 ba4410 BA651 Flash Memory SAMSUNG k5
    Text: Preliminary MCP MEMORY K5A3x40YT B B Document Title Multi-Chip Package MEMORY 32M Bit (4Mx8/2Mx16) Dual Bank NOR Flash Memory / 4M(512Kx8/256Kx16) Full CMOS SRAM Revision History Revision No. History 0.0 Initial Draft Draft Date Remark February 22, 2002 Preliminary


    Original     		PDF K5A3x40YT 4Mx8/2Mx16) 512Kx8/256Kx16) 512tRDR 69-Ball 08MAX SAMSUNG MCP samsung K5 MCP BA35 BA4110 ba4410 BA651 Flash Memory SAMSUNG k5

    Untitled

    Abstract: No abstract text available
    Text: Features • Core • • • • • • – ARM926EJ-S ARM Thumb® Processor running at up to 400 MHz @ 1.0V +/- 10% – 16 Kbytes Data Cache, 16 Kbytes Instruction Cache, Memory Management Unit Memories – One 64-Kbyte internal ROM embedding bootstrap routine: Boot on NAND Flash,


    Original     		PDF ARM926EJ-Sâ 64-Kbyte 32-Kbyte 32-bit 24-bit 1032Aâ 27-Jul-11

    Untitled

    Abstract: No abstract text available
    Text: Features • Core • • • • • • • – ARM926EJ-S ARM Thumb® Processor running at up to 400 MHz @ 1.0V +/- 10% – 16 Kbytes Data Cache, 16 Kbytes Instruction Cache, Memory Management Unit Memories – One 64-Kbyte internal ROM embedding bootstrap routine: Boot on NAND Flash,


    Original     		PDF ARM926EJ-Sâ 64-Kbyte 32-Kbyte 32-bit 24-bit 11052Câ 21-Nov-11

    6242E

    Abstract: 4583 dual schmitt trigger 6242b la 4508 ic pin diagram R1100D121C AT91Bootstrap CS 5609 ARM926EJ-S ISO7816 5609 dec
    Text: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions – ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer


    Original     		PDF ARM926EJ-STM 16-bits 6242E 11-Sep09 4583 dual schmitt trigger 6242b la 4508 ic pin diagram R1100D121C AT91Bootstrap CS 5609 ARM926EJ-S ISO7816 5609 dec

    BATM Advanced Communications

    Abstract: ARM926EJ-S ISO7816 0x0792603F
    Text: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • • – DSP Instruction Extensions – ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer


    Original     		PDF ARM926EJ-STM 16-bits 6242BS 14-Sep-07 BATM Advanced Communications ARM926EJ-S ISO7816 0x0792603F

    at91sam9g10

    Abstract: AT91SAM9G10-CU 16-KB ARM926EJ-S ISO7816
    Text: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions – ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer


    Original     		PDF ARM926EJ-STM 16-bits 6462AS 03-Jun-09 at91sam9g10 AT91SAM9G10-CU 16-KB ARM926EJ-S ISO7816

    Untitled

    Abstract: No abstract text available
    Text: Features • Core • • • • • • – ARM926EJ-S ARM Thumb® Processor running at up to 400 MHz @ 1.0V +/- 10% – 16 Kbytes Data Cache, 16 Kbytes Instruction Cache, Memory Management Unit Memories – One 64-Kbyte internal ROM embedding bootstrap routine: Boot on NAND Flash,


    Original     		PDF ARM926EJ-Sâ 64-Kbyte 32-Kbyte 32-bit 24-bit 11053Bâ 22-Sep-11

    AT91SAM9260B-CU

    Abstract: AT91SAM9260 Electrical Characteristics AT91SAM9260B AT91SAM9260 pwm AT91SAM9260-CU AT91SAM9260B-QU 217-LFBGA d1159 AT91SAM9260 AT91SAM9260-QU ethernet controller
    Text: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • • • – DSP Instruction Extensions, ARM Jazelle® Technology for Java® Acceleration – 8-KByte Data Cache, 8-KByte Instruction Cache, Write Buffer


    Original     		PDF ARM926EJ-STM 432-byte 6221IS 12-Aug-08 AT91SAM9260B-CU AT91SAM9260 Electrical Characteristics AT91SAM9260B AT91SAM9260 pwm AT91SAM9260-CU AT91SAM9260B-QU 217-LFBGA d1159 AT91SAM9260 AT91SAM9260-QU ethernet controller

    37 PIN TFT MOBILE DISPLAY 8K

    Abstract: ARM926 ISO7816 ARM926EJ-S 0X004 Universal Transceivers VIA ARM926 LCDD0-LCDD23
    Text: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions – ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer


    Original     		PDF ARM926EJ-STM 16-bits 6242DS 06-Jan-09 37 PIN TFT MOBILE DISPLAY 8K ARM926 ISO7816 ARM926EJ-S 0X004 Universal Transceivers VIA ARM926 LCDD0-LCDD23

    Untitled

    Abstract: No abstract text available
    Text: P-BGA216-2323-1.00A3K Uniti nn Jul.2003


    OCR Scan     		PDF P-BGA216-2323-1 00A3K