PBGA225
Abstract: BGA225
Text: P-BGA225-2727-1.5 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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P-BGA225-2727-1
PBGA225
BGA225
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tray bga
Abstract: BGA22 JEDEC TRAY DIMENSIONS FBGA 60 JEDEC FBGA tray datasheet bga nec 2222 FBGA 320
Text: TRAY CONTAINER UNIT : mm NEC 7 135°C MAX. 22.35 26.30 105.2 BGA22x22ESP A' 15.35 22.35 25.80 283.8 15.60 315.0 322.6 Section A – A' 22.35 (5.52) (6.35) 22.00 7.62 135.9 5×12=60 PPE A Applied Package Quantity (pcs) Tray BGA 22×22 ESP 320-pin Plastic BGA (22×22)
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BGA22
22ESP
320-pin
345-pin
385-pin
389-pin
429-pin
SSD-A-H6973-4
tray bga
JEDEC TRAY DIMENSIONS FBGA 60
JEDEC FBGA
tray datasheet bga
nec 2222
FBGA 320
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SF-BGA225C-B-11
Abstract: No abstract text available
Text: D Package Code: BGA225C C 25.4mm [1.000"] 1.27mm [0.050"] See BGA pattern code to the right for actual pattern layout Y X 25.4mm [1.000"] Top View reference only 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] B 1 1.27mm [0.050"]
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BGA225C
FR4/G10
SF-BGA225C-B-11
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PDF
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PBGA225
Abstract: PRBG0225CB-A
Text: JEITA Package Code P-BGA225-27x27-1.50 RENESAS Code PRBG0225CB-A D Previous Code 225F7X-B MASS[Typ.] 2.0g A D1 b S AB B A ZD e e A1 R P N M L K H G F E D C ZE E E1 J B A y S Index mark S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Reference Symbol D E A A1 e b x y
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P-BGA225-27x27-1
PRBG0225CB-A
225F7X-B
PBGA225
PRBG0225CB-A
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PDF
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SF-BGA224A-B-01
Abstract: No abstract text available
Text: D Ø 0.40mm [0.0156"] Tooling Hole SF-BGA224A-B-01 C 21.59mm [0.850"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] 21.57mm [0.849"] X Top View (reference only) 1.27 mm [0.050"] 0.36mm dia. [0.014"] 0.64mm
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SF-BGA224A-B-01
FR4/G10
P-T200A
P-T105A
SF-BGA224A-B-01
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PDF
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BGA225
Abstract: MS-034
Text: PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA225: plastic ball grid array package; 225 balls; body 27 x 27 x 1.55 mm SOT648-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C R P e N M L K J H G F E D C
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BGA225:
OT648-1
MS-034
ED-7311-9A
BGA225
MS-034
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PDF
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SF-BGA228B-B-11
Abstract: BGA228B 1.4mm pitch BGA
Text: D Package Code: BGA228B C 22.86mm [0.900"] 0.71mm [0.028"] See BGA pattern code to the right for actual pattern layout Y 0.58mm [0.023"] X 22.86mm [0.900"] Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.71mm [0.028"] 5.33mm 3.74mm [0.147"]
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BGA228B
FR4/G10
SF-BGA228B-B-11
BGA228B
1.4mm pitch BGA
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PDF
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PRBG0225CA-A
Abstract: PBGA225
Text: JEITA Package Code P-BGA225-27x27-1.50 RENESAS Code PRBG0225CA-A B D Previous Code 225F7X-A MASS[Typ.] 2.0g A b A D1 S ZD AB e e A1 R P N M L H G F E D C ZE E E1 K J B A y S 1pin corner S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Reference Symbol D E A A1 e b x
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P-BGA225-27x27-1
PRBG0225CA-A
225F7X-A
PRBG0225CA-A
PBGA225
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PDF
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SF-BGA225B-B-11
Abstract: No abstract text available
Text: D Package Code: BGA225B C 20.98mm [0.826"] See BGA pattern code to the right for actual pattern layout Y 1.5mm [0.059"] X Top View reference only 21.01mm [0.827"] 1.27 mm [0.059"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] Ø 0.64mm pad [Ø 0.025"]
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BGA225B
SF-BGA225B-B-11
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PDF
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BGA228
Abstract: SF-BGA228A-B-11
Text: D Package Code: BGA228A C 22.86mm [0.900"] 0.71mm [0.028"] See BGA pattern code to the right for actual pattern layout Y 0.58mm [0.023"] X 22.86mm [0.900"] Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.71mm [0.028"] 5.33mm 3.74mm [0.147"]
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BGA228A
FR4/G10
SF-BGA228A-B-11
BGA228
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SF-BGA225A-B-11
Abstract: BGA225A
Text: D Package Code: BGA225A C 17.78mm [0.700"] See BGA pattern code to the right for actual pattern layout Y 1.27mm [0.050"] X 17.78mm [0.700"] Top View reference only 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] Ø 0.64mm pad [Ø 0.025"]
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BGA225A
SF-BGA225A-B-11
BGA225A
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PDF
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BGA225
Abstract: MO-151 sot648
Text: PDF: 2000 Sep 21 Philips Semiconductors Package outline BGA225: plastic ball grid array package; 225 balls; body 27 x 27 x 1.55 mm SOT648-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e y y1 C ∅w M v M A R P N e M L K J e1 H G F E
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BGA225:
OT648-1
MO-151
BGA225
MO-151
sot648
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Lead Free reflow soldering profile BGA
Abstract: BGA-3591 Metcal BGA-3591 Metcal CSP 3502 CSP-3500 BGA-3590 BGA-3592 CSP-085-102 ceramic rework bga rework
Text: Worldwide and U.S. Headquarters 1530 O’Brien Drive Menlo Park, CA 94025 USA Phone: + 1-650-325-3291 1-800-776-1778 Fax: + 1-650-325-5932 Europe Headquarters Eagle Close, Chandler’s Ford Eastleigh Hampshire SO53 4NF U.K. Phone: + 44 23 8048 9100 Fax: + 44 23 8048 9109
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8833he
485mm)
241mm)
Lead Free reflow soldering profile BGA
BGA-3591
Metcal BGA-3591
Metcal CSP 3502
CSP-3500
BGA-3590
BGA-3592
CSP-085-102
ceramic rework
bga rework
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PDF
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SAMSUNG MCP
Abstract: ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor
Text: Preliminary MCP MEMORY KBB0xB400M Document Title Multi-Chip Package MEMORY 64M Bit 8M x8/4M x16 Dual Bank NOR Flash *2 / 256M Bit (16Mx16) NAND Flash / 64M Bit (4Mx16) UtRAM Revision History Revision No. History 0.0 Initial Draft (64M NOR Flash M-die_rev1.1)
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KBB0xB400M
16Mx16)
4Mx16)
80-Ball
80x12
SAMSUNG MCP
ECH information
KBB0xB400M
BA102
ba4901
UtRAM Density
BA5101
samsung NAND memory
BGA180
ba30 transistor
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Untitled
Abstract: No abstract text available
Text: Spansion Analog and Microcontroller Products The following document contains information on Spansion analog and microcontroller products. Although the document is marked with the name “Fujitsu”, the company that originally developed the specification, Spansion
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Untitled
Abstract: No abstract text available
Text: Spansion Analog and Microcontroller Products The following document contains information on Spansion analog and microcontroller products. Although the document is marked with the name “Fujitsu”, the company that originally developed the specification, Spansion
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Untitled
Abstract: No abstract text available
Text: Spansion Analog and Microcontroller Products The following document contains information on Spansion analog and microcontroller products. Although the document is marked with the name “Fujitsu”, the company that originally developed the specification, Spansion
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Untitled
Abstract: No abstract text available
Text: FUJITSU SEMICONDUCTOR CONTROLLER MANUAL CM26-10113-1E F2MC-8FX 8-BIT MICROCONTROLLER MB95130/M Series HARDWARE MANUAL F2MC-8FX 8-BIT MICROCONTROLLER MB95130/M Series HARDWARE MANUAL Be sure to refer to the “Check Sheet” for the latest cautions on development.
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CM26-10113-1E
MB95130/M
8/16-bit
16-bit
8/10-bit
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PDF
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Untitled
Abstract: No abstract text available
Text: Spansion Analog and Microcontroller Products The following document contains information on Spansion analog and microcontroller products. Although the document is marked with the name “Fujitsu”, the company that originally developed the specification, Spansion
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PDF
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Untitled
Abstract: No abstract text available
Text: Spansion Analog and Microcontroller Products The following document contains information on Spansion analog and microcontroller products. Although the document is marked with the name “Fujitsu”, the company that originally developed the specification, Spansion
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Untitled
Abstract: No abstract text available
Text: FUJITSU SEMICONDUCTOR CONTROLLER MANUAL CM26-10107-1E F2MC-8FX 8-BIT MICROCONTROLLER MB95100A/H Series HARDWARE MANUAL 2 F MC-8FX 8-BIT MICROCONTROLLER MB95100A/H Series HARDWARE MANUAL Be sure to refer to the “Check Sheet” for the latest cautions on development.
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CM26-10107-1E
MB95100A/H
8/16-bit
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PDF
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Untitled
Abstract: No abstract text available
Text: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised
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K8D6x16UTM
K8D6x16UBM
48TSOP1
16M/16M
08MAX
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PDF
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Untitled
Abstract: No abstract text available
Text: FUJITSU MICROELECTRONICS CONTROLLER MANUAL CM26-10109-3E F2MC-8FX 8-BIT MICROCONTROLLER MB95110B/M Series HARDWARE MANUAL F2MC-8FX 8-BIT MICROCONTROLLER MB95110B/M Series HARDWARE MANUAL The information for microcontroller supports is shown in the following homepage.
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CM26-10109-3E
MB95110B/M
8/16-bit
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PDF
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Untitled
Abstract: No abstract text available
Text: FUJITSU MICROELECTRONICS CONTROLLER MANUAL CM26-10112-3E F2MC-8FX 8-BIT MICROCONTROLLER MB95100B/AM Series HARDWARE MANUAL F2MC-8FX 8-BIT MICROCONTROLLER MB95100B/AM Series HARDWARE MANUAL The information for microcontroller supports is shown in the following homepage.
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CM26-10112-3E
MB95100B/AM
8/16-bit
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PDF
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