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    FF1152 Price and Stock

    AMD XC4VFX60-11FF1152C

    IC FPGA 576 I/O 1152FCBGA
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    DigiKey XC4VFX60-11FF1152C Bulk 2 1
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    Avnet Americas XC4VFX60-11FF1152C Tray 12 Weeks 1
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    Mouser Electronics XC4VFX60-11FF1152C 3
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    AMD XC2VP40-7FF1152C

    IC FPGA 692 I/O 1152FCBGA
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    AMD XC2VP20-5FF1152I

    IC FPGA 564 I/O 1152FCBGA
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    AMD XC2VP50-6FF1152C

    IC FPGA 692 I/O 1152FCBGA
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    AMD XC2VP40-6FF1152I

    IC FPGA 692 I/O 1152FCBGA
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    FF1152 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    BLVDS-25

    Abstract: LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000
    Text: Xilinx Virtex-II Series FPGAs and RocketPHY Physical Layer Transceivers Transceiver Blocks 992 88 120 200 264 432 528 624 720 912 1104 1108 Chip Scale Packages CS – wire-bond chip-scale BGA (0.8 mm ball spacing) 144 8 88 92 FF896 92 8 FF1152 BGA Packages (BG) – wire-bond standard BGA (1.27 mm ball spacing)


    Original     		PDF FF896 FF1152 FF11486 10Gbps BLVDS-25 LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000

    EP4SGX180KF40

    Abstract: f1517 EP4SGX180DF29 EP4SGX290KF40 228K EP4SGX230KF40 EP4SGX360KF40 EP4SGX290FF35 HC4GX25LF1152N EP4SGX180FF35
    Text: HardCopy IV GX ASIC Product Table v0.123 HardCopy Base Die HardCopy IV GX ASIC Package Body Size 2 LAF780 (29 mm) Generic Part Number HC4GX15LAF780N HC4GX15 LF780 (29 mm) LF780 (29 mm) LF1152 (35 mm) HC4GX15LF780N HC4GX25LF780N HC4GX25LF1152N HC4GX25 FF1152 (35 mm)


    Original     		PDF 18x18 M144Ks EP4SGX70DF29 LAF780 HC4GX15LAF780N EP4SGX110DF29 LF780 HC4GX15LF780N HC4GX25LF780N EP4SGX180KF40 f1517 EP4SGX180DF29 EP4SGX290KF40 228K EP4SGX230KF40 EP4SGX360KF40 EP4SGX290FF35 HC4GX25LF1152N EP4SGX180FF35

    QDR pcb layout

    Abstract: XAPP750 UG002 CLK180 FF1152 K7R323684M K7R323684M-FC20 XC2VP20 phase control trailing edge schematic D0DCM
    Text: Application Note: Virtex-II Series R XAPP750 v1.0 May 24, 2004 Summary QDR II SRAM Local Clocking Interface for Virtex-II Pro Devices Author: Olivier Despaux This application note describes a 200 MHz four-word burst QDR II SRAM interface implemented in a Virtex-II Pro XC2VP20 FF1152 –6 device. This implementation uses local


    Original     		PDF XAPP750 XC2VP20 FF1152 K7R323684M-FC20 40Interface QDR pcb layout XAPP750 UG002 CLK180 FF1152 K7R323684M phase control trailing edge schematic D0DCM

    FF1152

    Abstract: No abstract text available
    Text: R Flip Chip BGA FF1152 Package PK049 (v1.0) April 6, 2001 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.


    Original     		PDF FF1152) PK049 FF1152

    Xilinx usb cable Schematic

    Abstract: avnet XC2V6000-4FF1152C ADS-XLX-V2-DEV4000 x2v4000 XC2V6000-ff1152 Xilinx jtag cable Schematic X2V1500 ADS-002905 xilinx vhdl rs232 code
    Text: datasheet Xilinx Virtex -II Development Kit Features • • • • • • • • Description Large Xilinx Virtex-II FPGA XC2V1500-FF896- 1.5 Million System Gates XC2V4000-FF1152- 4 Million System Gates XC2V6000-FF1152- 6 Million System Gates Configuration


    Original     		PDF XC2V1500-FF896- XC2V4000-FF1152- XC2V6000-FF1152- XCCACEMxx-BG388I 32/64-bit RS232 140-pin XC2V4000 XC2V6000 ADS-002905 Xilinx usb cable Schematic avnet XC2V6000-4FF1152C ADS-XLX-V2-DEV4000 x2v4000 XC2V6000-ff1152 Xilinx jtag cable Schematic X2V1500 ADS-002905 xilinx vhdl rs232 code

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    XQR2V3000-4CG717V

    Abstract: XQR2V1000-4BG575R XQR2V6000-4CF1144H XQR2V3000-4CG717M XQR2V1000-4BG575N AH165 CG717 XQR2V3000-4BG728R XQR2V1000-4FG456R XQR2V6000
    Text: R < B L QPro Virtex-II 1.5V Radiation-Hardened QML Platform FPGAs DS124 v1.2 December 4, 2006 Product Specification Summary of Radiation Hardened QPro Virtex-II Features • • • • • • • • • • • • • Industry First Radiation Hardened Platform FPGA


    Original     		PDF DS124 MIL-PRF-38535 XQR2V3000-4CG717V XQR2V1000-4BG575R XQR2V6000-4CF1144H XQR2V3000-4CG717M XQR2V1000-4BG575N AH165 CG717 XQR2V3000-4BG728R XQR2V1000-4FG456R XQR2V6000

    XAPP662

    Abstract: PPC405 XAPP138 XAPP660 XAPP661 XC2VP20 FF1152 FF672 Virtex-II Platform FPGA Complete All Four Module verilog code of prbs pattern generator
    Text: Application Note: Virtex-II Pro Family R XAPP662 v1.1 July 3, 2003 Summary In-Circuit Partial Reconfiguration of RocketIO Attributes Author: Vince Eck, Punit Kalra, Rick LeBlanc, and Jim McManus This application note describes in-circuit partial reconfiguration of RocketIO transceiver


    Original     		PDF XAPP662 PPC405) XAPP661: pdf/ug024 pdf/ug012 XAPP662 PPC405 XAPP138 XAPP660 XAPP661 XC2VP20 FF1152 FF672 Virtex-II Platform FPGA Complete All Four Module verilog code of prbs pattern generator

    1F2e

    Abstract: DPS module
    Text: POS-PHY Level 4 Interface Core V3.0 Product Specification August 31, 2001 LogiCORE Facts Core Specifics Supported Family Performance Xilinx Inc. 2100 Logic Drive San Jose, CA 95124 Phone: +1 408-559-7778 Fax: +1 408-559-7114 URL: www.xilinx.com/support/techsup/appinfo


    Original     		PDF OIF-SPI4-02 OC-192 1F2e DPS module

    CLK180

    Abstract: MULT18X18 XAPP622 XC2V3000-FF1152 XC2V3000FF1152 sdr receiver
    Text: Application Note: Virtex-II Series R 644-MHz SDR LVDS Transmitter/Receiver Author: Ed McGettigan XAPP622 v1.2 July 2, 2002 Summary This application note describes single data rate (SDR) transmitter and receiver interfaces operating at up to 644 MHz, using 17 Low-Voltage Differential Signaling (LVDS) pairs (one


    Original     		PDF 644-MHz XAPP622 XC2V3000-FF1152 CLK180 MULT18X18 XAPP622 XC2V3000-FF1152 XC2V3000FF1152 sdr receiver

    Untitled

    Abstract: No abstract text available
    Text: ` Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.4.1 March 24, 2003 Advance Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty-four RocketIO™ embedded


    Original     		PDF DS083-1 18-bit FF1148) FF1517) FF1696) DS083-4

    EP3SL340F1517

    Abstract: altera cyclone 3 handbook texas instruments HC335FF1152 HC325Ff DDR3 jedec diode handbook fbga Substrate design guidelines hc335 texas instruments handbook
    Text: HardCopy III Device Handbook, Volume 1 101 Innovation Drive San Jose, CA 95134 www.altera.com HC3_H5V1-3.2 Copyright 2010 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other


    Original     		PDF

    EP3SE110F1152

    Abstract: f7807 EP3SE110-F1152 EP3SL110F780 107K hc335 WF484 EP3SE110F780 GEN-1002-00 EP3SL200-F1517
    Text: HardCopy III ASIC Product Table v0.995 HardCopy Base Die HardCopy III ASIC Package Body Size 2 WF484 (23 mm) FF484 (23 mm) HC325 WF780 (29 mm) FF780 (29 mm) Generic Part Number HC325WF484N HC325FF484N HC325WF780N HC325FF780N Stratix III FPGA Prototype 107K


    Original     		PDF 18x18 EP3SE110--F7807 EP3SL200--H7807 EP3SL340--H11527 GEN-1002-00 EP3SE110F1152 f7807 EP3SE110-F1152 EP3SL110F780 107K hc335 WF484 EP3SE110F780 GEN-1002-00 EP3SL200-F1517

    XC2V1000 Pin-out

    Abstract: Virtex-II MAKING A10 BGA matrix m21 IEEE1532 XC2V1000 XC2V1500 XC2V250 XC2V40 XC2V500
    Text: Virtex-II 1.5V Field-Programmable Gate Arrays R DS031-1 v1.7 October 2, 2001 Advance Product Specification Summary of Virtex -II Features • Industry First Platform FPGA Solution • IP-Immersion Architecture - Densities from 40K to 8M system gates


    Original     		PDF DS031-1 18-Kbit 18-bige. XC2V1500 FG676 FF1152, FF1517, BF957 DS031-3, DS031-1, XC2V1000 Pin-out Virtex-II MAKING A10 BGA matrix m21 IEEE1532 XC2V1000 XC2V250 XC2V40 XC2V500

    VIRTEX-4

    Abstract: Virtex-4 datasheet Virtex-4 SF363 FFG676 DS112 DSP48 sf363 PPC405 XC4VLX100 XC4VLX15
    Text: ` R Virtex-4 Family Overview DS112 v3.0 September 28, 2007 Product Specification General Description Combining Advanced Silicon Modular Block (ASMBL ) architecture with a wide variety of flexible features, the Virtex™-4 Family from Xilinx greatly enhances programmable logic design capabilities, making it a powerful alternative to ASIC


    Original     		PDF DS112 DS302) XC4VFX40 FF676 XC4VLX40, XC4VLX60, XC4VSX25, XC4VSX35, VIRTEX-4 Virtex-4 datasheet Virtex-4 SF363 FFG676 DS112 DSP48 sf363 PPC405 XC4VLX100 XC4VLX15

    AM3 pinout diagram

    Abstract: SX35 SX35 virtex XC4VLX25-SF363 AM1 marking FF1148 UG075 The Virtex-4 LC system board K155 AH512
    Text: Virtex-4 FPGA Packaging and Pinout Specification UG075 v3.3 September 19, 2008 R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG075 10CESnL 10CESnR AM3 pinout diagram SX35 SX35 virtex XC4VLX25-SF363 AM1 marking FF1148 UG075 The Virtex-4 LC system board K155 AH512

    datasheet transistor said horizontal tt 2222

    Abstract: interface of rs232 to UART in VHDL xc9500 80C31 instruction set apple ipad schematic drawing 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic apple ipad Apple iPad 2 panasonic inverter dv 700 manual TT 2222 Horizontal Output Transistor pins out
    Text: Virtex-II Platform FPGA User Guide UG002 v2.2 5 November 2007 R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG002 datasheet transistor said horizontal tt 2222 interface of rs232 to UART in VHDL xc9500 80C31 instruction set apple ipad schematic drawing 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic apple ipad Apple iPad 2 panasonic inverter dv 700 manual TT 2222 Horizontal Output Transistor pins out

    XAPP759

    Abstract: verilog code for fibre channel 1000BASE-X PPC405 Virtex-II Pro and Virtex-II Pro X Platform FPGAs Xuint32 CPCS BOARD POWER SUPPLY ML323 1000base-x xilinx DS264
    Text: Application Note: Virtex-II Pro Family R Configurable Physical Coding Sublayer Author: Dai Huang, Jack Lo, and Shalin Sheth XAPP759 v1.1 March 4, 2005 Summary This application note describes a Configurable Physical Coding Sublayer (CPCS) reference design that extends the functionality of the Xilinx RocketIO multi-gigabit transceiver (MGT)


    Original     		PDF XAPP759 XAPP662: com/bvdocs/appnotes/xapp662 XAPP672: com/bvdocs/appnotes/xapp672 DS083: com/bvdocs/publications/ds083 ML321 XAPP759 verilog code for fibre channel 1000BASE-X PPC405 Virtex-II Pro and Virtex-II Pro X Platform FPGAs Xuint32 CPCS BOARD POWER SUPPLY ML323 1000base-x xilinx DS264

    free verilog code of prbs pattern generator

    Abstract: verilog code 16 bit LFSR in PRBS pattern generator lfsr galois prbs using lfsr lfsr fibonacci XAPP661 verilog code for 10 gb ethernet verilog code 8 bit LFSR verilog HDL program to generate PWM
    Text: Application Note: Virtex-II Pro Family R RocketIO Transceiver Bit-Error Rate Tester Author: Dai Huang and Michael Matera XAPP661 v2.0.2 May 24, 2004 Summary This application note describes the implementation of a RocketIO transceiver bit-error rate tester (BERT) reference design demonstrating a serial link (1.0 Gb/s to 3.125 Gb/s) between


    Original     		PDF XAPP661 PPC405) XAPP661 free verilog code of prbs pattern generator verilog code 16 bit LFSR in PRBS pattern generator lfsr galois prbs using lfsr lfsr fibonacci verilog code for 10 gb ethernet verilog code 8 bit LFSR verilog HDL program to generate PWM

    32K10K-400

    Abstract: CP1005 12ah4 CFD06 IOG20 32k10k400 IOG11 12ah3 12AH-4 32K10K
    Text: 4 3 2 1 4 3 2 1 STANDARD CLOCKS D D SOCKET OSC ON BOARD FPGA SUPPLIES 5V Jack OR C 5V Brick OR 5V Brick SMA OSC SMA DIFF MGT MGT MGT MGT 2X2 2X2 2X2 2X2 SMA SMA SMA SMA MGT MGT VCC3 C MGT CLOCKS System Ace MGT POWER MODULE 3.3V 2X2 2X2 2X1 VCORE 2X1 SMA SMA


    Original     		PDF 330UF 32K10K-400 CP1005 12ah4 CFD06 IOG20 32k10k400 IOG11 12ah3 12AH-4 32K10K

    Untitled

    Abstract: No abstract text available
    Text: Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.3 November 20, 2002 Advance Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty-four RocketIO™ embedded


    Original     		PDF DS083-1 18-bit DS083-4

    hc335

    Abstract: 1517P WF484
    Text: 1. HardCopy III Device Family Overview HIII51001-3.1 Introduction This chapter provides an overview of features available in the HardCopy III device family. More details about these features can be found in their respective chapters. HardCopy III devices are Altera’s low-cost, high-performance, low-power ASICs with


    Original     		PDF HIII51001-3 hc335 1517P WF484

    12x12 bga thermal resistance

    Abstract: XC2V6000-ff1152 xc2v3000fg XC2V3000-FG676 smd transistor J6 pin XC2V3000-BG728 XC2V80 IO-L93N UG002 Printed Circuit Boards PCB
    Text: R Chapter 4 PCB Design Considerations 1 Summary This chapter covers the following topics: • • • • • • • • • • 2 Pinout Information Pinout Diagrams Package Specifications 3 Flip-Chip Packages Thermal Data Printed Circuit Board Considerations


    Original     		PDF UG002 CS144: FG256, FG456, FG676: FF896, FF115XC2V40 CS144 XC2V40 FG256 12x12 bga thermal resistance XC2V6000-ff1152 xc2v3000fg XC2V3000-FG676 smd transistor J6 pin XC2V3000-BG728 XC2V80 IO-L93N UG002 Printed Circuit Boards PCB

    FG676

    Abstract: PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 TQ100 TQ128 TQ144 TQ176 VQ100 FG676 PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100