BGA SHIPPING TRAYS Search Results

BGA SHIPPING TRAYS Result Highlights (5)

Part	Manufacturer	Description
MPC860PZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860PVR80D4	Rochester Electronics LLC	32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC855TCZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860TCZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860ENZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357

BGA SHIPPING TRAYS Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
ADV0505 Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7 Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The	Original	ADV0505 and14 12C-0707-E19 12F-1111-119 1F3-1313-D19 1F1-1717-A19 12U-1919-G19 12Y-2323-919 12Y-3333-419 12Y-3535-419 ADV0505 FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7	PDF
BGA PACKAGE TOP MARK intel Abstract: 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK Text: Preliminary Mechanical and Shipping Media Information for Easy BGA Packages May 2000 Document Number: 298049-007 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any	Original	28F160F3 US048641 RD33708SW RD33716SW 12B-1013-G13 BGA PACKAGE TOP MARK intel 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK	PDF
INTEL 28F640 Abstract: BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3 Text: µBGA* and VF BGA Chip Scale Package Mechanical and Shipping Media Specifications April 2001 Document Number: 290661-022 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any	Original	12E-0607-C13 28F320C3 12E-0710-C13 28F160F3 12E-0810-C13 28F320D18 12E-0713-C13 28F320W18 28F320W30 28F640W18 INTEL 28F640 BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3	PDF
56mm carrier tape Abstract: 28 pin ic TM 1628 Text: u Chapter 13 Packing Methods and Labels CHAPTER 13 PACKING METHODS AND LABELS Introduction Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Packing for Jewel Boxes Box Labeling Packages and Packing Publication Revision A 3/1/03	Original	3027b 56mm carrier tape 28 pin ic TM 1628	PDF
daewon tray Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA	Original	AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga	PDF
strapack s-669 Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga Text: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,	Original		PDF
CBG064-052A Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in Text: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability	Original		PDF
Kostat tray Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13 Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher	Original	and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13	PDF
Intel reflow soldering profile BGA Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764 Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems	Original		PDF
PBGA 256 reflow profile Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75 Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)	Original		PDF
PCB design for very fine pitch csp package Abstract: Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015A Second Edition – September 1999 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue	Original	SSYZ015A PCB design for very fine pitch csp package Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A	PDF
smd transistor mark E13 Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4 Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue	Original	SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4	PDF
pcb warpage in ipc standard Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)	Original		PDF
EIA and EIAJ standards 783 Abstract: EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label Text: Application Report SZZA021B – September 2001 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare	Original	SZZA021B EIA and EIAJ standards 783 EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label	PDF

Side Brazed Ceramic Dual-In-Line Packages Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year	Original		PDF
trays Abstract: QFN Shipping Trays PEAK TRAY bga Text: S PEC I FI C AT I ON SHE E T Matrix Trays Matrix T r ay s UltraLite designs Available Now Open Tooling for all popular configurations Quick-tur n, custom tooling ser vices Peak Matrix Trays conform to JEDEC standards and are available in a number of tray types including Pin Grid Array, Plastic Quad	Original		PDF
SPRU811 Abstract: BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate Text: Flip Chip Ball Grid Array Package Reference Guide Literature Number: SPRU811A May 2005 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue	Original	SPRU811A SPRU811 SPRU811 BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate	PDF
EIA and EIAJ standards 783 Abstract: JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP Text: Application Report SZZA021A – January 2000 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear and Logic ABSTRACT The Texas Instruments TI Semiconductor Group uses three packing methodologies to	Original	SZZA021A EIA and EIAJ standards 783 JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP	PDF
55740-001LF Abstract: 10060913-001 GS-20-016 Text: BOARD TO BOARD CONNECTORS GIG-ARRAY CONNECTOR SYSTEM DESCRIPTION The GIG-ARRAY® connector is designed to meet the needs of up to 10Gb/s applications requiring up to 296 signal pins per connector. FCI’s long tradition as a BGA connector innovator assures expertise and reliability in the	Original	10Gb/s 100-Ohm inno1-001LF 55700-001LF 55727-001LF 10054784-001LF 55740-001LF 10060912-001LF 55701-001LF 10060913-001LF 10060913-001 GS-20-016	PDF
rd33708 Abstract: BGA PACKAGE TOP MARK intel Intel H4 socket 28F3202C3 intel h2 socket 806801 Intel Stacked CSP 28F1602C3 JEDEC TRAY DIMENSIONS 28F3204C3 Text: Mechanical Specification and Shipping Media Information for Intel Stacked-Chip Scale Packages PRELIMINARY May 2000 Document Number: 298068-005 Information in this document is provided in connection with Inte® products. No license, express or implied, by estoppel or otherwise, to any intellectual	Original	28F1602C3 US048631 28F1604C3 28F3202C3 28F3204C3 US048681 rd33708 BGA PACKAGE TOP MARK intel Intel H4 socket 28F3202C3 intel h2 socket 806801 Intel Stacked CSP 28F1602C3 JEDEC TRAY DIMENSIONS 28F3204C3	PDF
Untitled Abstract: No abstract text available Text: BOARD TO BOARD CONNECTORS GIG-ARRAY CONNECTOR SYSTEM DESCRIPTION The GIG-ARRAY® connector is designed to meet the needs of up to 10Gb/s applications requiring up to 296 signal pins per connector. FCI’s long tradition as a BGA connector innovator assures expertise and reliability in the	Original	10Gb/s 100-Ohm inno4784-001LF 55740-001LF 10081496-001LF 10060912-001LF 55701-001LF 10081497-001LF 10060913-001LF ELXGIGARRAY0812ELT	PDF
55740-001LF Abstract: FCI Connector TERMINAL FCI 0.65mm pitch BGA solder joint reliability 1mm pitch BGA GR-1217-CORE 10060912-001LF bga trays Text: BOARD TO BOARD CONNECTORS GIG-ARRAY CONNECTOR SYSTEM DESCRIPTION The GIG-ARRAY® connector is designed to meet the needs of up to 10Gb/s applications requiring up to 296 signal pins per connector. FCI’s long tradition as a BGA connector innovator assures expertise and reliability in the	Original	10Gb/s 100-Ohm 55740-001LF 10081496-001LF 10060912-001LF 55701-001LF 10081497-001LF 10060913-001LF ELXGIGARRAY0408ELT 55740-001LF FCI Connector TERMINAL FCI 0.65mm pitch BGA solder joint reliability 1mm pitch BGA GR-1217-CORE 10060912-001LF bga trays	PDF
AN-1126 Abstract: AN-1205 land pattern BGA 0.75 TMCL ACLV MO-151 fbga Substrate design guidelines bga Shipping Trays pcb warpage after reflow Epoxy, glass laminate gold embrittlement Text: Table of Contents Introduction . 2 Package Overview . 3	Original	AN-1126 AN-1126 AN-1205 land pattern BGA 0.75 TMCL ACLV MO-151 fbga Substrate design guidelines bga Shipping Trays pcb warpage after reflow Epoxy, glass laminate gold embrittlement	PDF
MIL-STD-81705 Abstract: JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray Text: 2 10 Transport Media and Packing 1/16/97 5:51 PM CH10WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 10 TRANSPORT MEDIA AND PACKING 10.1. TRANSPORT MEDIA 10.1.1. Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride (PVC) with an	Original	CH10WIP MIL-STD-81705 JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray	PDF

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BGA SHIPPING TRAYS Search Results

BGA SHIPPING TRAYS Result Highlights (5)

BGA SHIPPING TRAYS Datasheets Context Search

ADV0505

BGA PACKAGE TOP MARK intel

INTEL 28F640

56mm carrier tape

daewon tray

strapack s-669

CBG064-052A

Kostat tray

Intel reflow soldering profile BGA

PBGA 256 reflow profile

PCB design for very fine pitch csp package

smd transistor mark E13

pcb warpage in ipc standard

EIA and EIAJ standards 783

Side Brazed Ceramic Dual-In-Line Packages

trays

SPRU811

EIA and EIAJ standards 783

55740-001LF

rd33708

Untitled

55740-001LF

AN-1126

MIL-STD-81705