28F3202C3 Search Results

28F3202C3 Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
28F3202C3		Intel	3 Volt Advanced+ Stacked Chip Scale Package Memory		Original	PDF

28F3202C3 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
28F160B3 Abstract: Stacked Chip Scale Package 29066 Text: 3 Volt Advanced+ Stacked Chip Scale Package Memory 32 Mbit/4 Mbit, 16 Mbit/4 Mbit 32 Mbit/2 Mbit, 16 Mbit/2 Mbit Specification Update April 2000 Notice: The 28F1602C3A, 28F1604C3A, 28F3202C3A, 28F3204C3A may contain design defects or errors known as errata which may cause the product to deviate from published	Original	PDF	28F1602C3A, 28F1604C3A, 28F3202C3A, 28F3204C3A 32-Mbit 64-Mbit 128-Mbit 16-Mbit 32-Mbit 28F160B3 Stacked Chip Scale Package 29066
28F3202C3 Abstract: 29066 Text: PRODUCT PREVIEW 3 VOLT ADVANCED+ STACKED CHIP SCALE PACKAGE MEMORY 16-Mbit Flash + 2-Mbit SRAM - 28F1602C3 16-Mbit Flash + 4-Mbit SRAM - 28F1604C3 32-Mbit Flash + 4-Mbit SRAM - 28F3204C3 32-Mbit Flash + 2-Mbit SRAM - 28F3202C3 ! Flash Memory Plus SRAM	Original	PDF	16-Mbit 28F1602C3 32-Mbit 28F3204C3 28F1604C3 28F3202C3 16-Mb 32-Mb 28F3202C3 29066
CBG064-052A Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in Text: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability	Original	PDF
rd33708 Abstract: BGA PACKAGE TOP MARK intel Intel H4 socket 28F3202C3 intel h2 socket 806801 Intel Stacked CSP 28F1602C3 JEDEC TRAY DIMENSIONS 28F3204C3 Text: Mechanical Specification and Shipping Media Information for Intel Stacked-Chip Scale Packages PRELIMINARY May 2000 Document Number: 298068-005 Information in this document is provided in connection with Inte® products. No license, express or implied, by estoppel or otherwise, to any intellectual	Original	PDF	28F1602C3 US048631 28F1604C3 28F3202C3 28F3204C3 US048681 rd33708 BGA PACKAGE TOP MARK intel Intel H4 socket 28F3202C3 intel h2 socket 806801 Intel Stacked CSP 28F1602C3 JEDEC TRAY DIMENSIONS 28F3204C3