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    8X9 BGA Search Results

    8X9 BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    8X9 BGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    eh 11757

    Abstract: 0.3mm pitch BGA JEDEC FBGA Coffin-Manson Equation thermal cycling data weibull 0.4mm pitch BGA BGA Solder Ball 0.35mm FBGA 63 PCB design for very fine pitch csp package bt resin
    Text: Daisy Chain Samples Application Note -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG


    Original     		PDF

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X

    56 pin BGA IC Socket

    Abstract: bga 1296 yamaichi IC 120 Test Socket 176325 bga 529 54427 IC274-036274 IC274-048278 IC274-054360 IC274-056310
    Text: IC274 Series Test Contactor SMT - Spring Probe Contact Style Part Number (Details) Specifications 1MΩ min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 200m Ω max. at 10mA/20mV max. Operating Temperature Range: –40°C to +100°C


    Original     		PDF IC274 10mA/20mV 56 pin BGA IC Socket bga 1296 yamaichi IC 120 Test Socket 176325 bga 529 54427 IC274-036274 IC274-048278 IC274-054360 IC274-056310

    transistor smd G46

    Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
    Text: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG


    Original     		PDF N32-2400 22142J transistor smd G46 fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm

    SG-BGA-6138

    Abstract: No abstract text available
    Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 15.225mm Ball guide prevents over compression of elastomer


    Original     		PDF 225mm SG-BGA-6138

    mxic xtrarom

    Abstract: xtrarom bga 6x8 Package MX23L6423TC-90
    Text: MX23L6423 64M-BIT PAGE MODE MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 8M x 8 byte mode - 4M x 16 (word mode) • Fast access time - Random access:90ns (max.) - Page access:25ns (max.) • Page size - 8 words per page • Current - Operating:20mA


    Original     		PDF MX23L6423 64M-BIT D15/A-1 100ns mxic xtrarom xtrarom bga 6x8 Package MX23L6423TC-90

    transistor b 1238

    Abstract: PCB design for very fine pitch csp package tray datasheet bga 8x9 5 ball csp drawing BGA PACKAGE TOP MARK intel land pattern BGA 0.75 SCR Manual, General electric databook N4646 15 ball CSP bga 6x8 tray dimension
    Text: The Micro Ball Grid Array µBGA Package The Micro Ball Grid Array (µBGA*) Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than


    Original     		PDF

    W25R128FV

    Abstract: W25Q128JV W25R128F W25Q128FV W25Q128F USON-8 W25Q80DL W978H6KB W25Q80BVSSIG
    Text: 2014 PRODUCT SELECTION GUIDE Mobile DRAM Specialty DRAM Code Storage Flash Memory Winbond Electronics Corporation is a worldwide leading supplier of specialty memory IC’s. The company provides memory solution backed by the expert capabilities of design, manufacturing


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    TB451

    Abstract: intersil standard part marking wlcsp inspection
    Text: Technical Brief 451 PCB Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices Introduction SOLDER BALL: Sn/Ag/Cu There is an industry-wide trend towards using the smallest package possible for a given pin count. This is driven primarily by the handheld products market where the trend towards


    Original     		PDF TB451 intersil standard part marking wlcsp inspection

    AMD reflow soldering profile BGA

    Abstract: Theta JC of FBGA AM29LV800B thermal resistance solder paste 63sn alpha metal fbga thermal resistance fbga 12 x 12 thermal resistance smd codes marking A21 AMD thermal design retention mechanism FR4 substrate fiberglass AMD K6
    Text: 5/11/99 Version 2.3 1999 Advanced Micro Devices, Inc. Advanced Micro Devices reserves the right to make changes in its products without notice in order to improve design or performance characteristics. This publication neither states nor implies any warranty of any kind, including but not limited to implied warrants of


    Original     		PDF 22247F AMD reflow soldering profile BGA Theta JC of FBGA AM29LV800B thermal resistance solder paste 63sn alpha metal fbga thermal resistance fbga 12 x 12 thermal resistance smd codes marking A21 AMD thermal design retention mechanism FR4 substrate fiberglass AMD K6

    PA-PGA181-02W

    Abstract: PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01
    Text: Ironwood Electronics PA.1 Prototyping Adapters Ironwood has developed over one thousand prototyping adapter designs, supporting CSP, BGA, QFP, SOIC, PGA, PLCC, QIP, and DIP packages for most popular prototyping panels and PGA DUT interfaces. We also offer adapters for


    Original     		PDF 12X12mm. FR4/G10 PA-PGA181-02W PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01

    STMicroelectronics smd marking code

    Abstract: BGA and QFP Package 14x14 STMICROELECTRONICS MSL STMicroelectronics date code tssop-14 HiQuad package STMicroelectronics pentawatt date code opto mold compound infineon msl TQFP 14X20 ST TSSOP Marking
    Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN CRP/04/744 LEAD-FREE CONVERSION PROGRAM Compliance with RoHS 1 1 RoHS = Restriction of the use of certain Hazardous Substances European directive 2002/95/EC November 18, 2004 Page 1/12 2004 STMicroelectronics - All Rights Reserved


    Original     		PDF CRP/04/744 2002/95/EC) STMicroelectronics smd marking code BGA and QFP Package 14x14 STMICROELECTRONICS MSL STMicroelectronics date code tssop-14 HiQuad package STMicroelectronics pentawatt date code opto mold compound infineon msl TQFP 14X20 ST TSSOP Marking

    STMicroelectronics smd marking code

    Abstract: smd marking code stmicroelectronics BGA bga 10x13 BGA 15X15 BGA 23X23 HEPTAWATT SMD Marking STMicroelectronics tqfp INFINEON package tqfp PART MARKING PLCC Part Marking STMicroelectronics Date Code Marking STMicroelectronics PACKAGE DPAK
    Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN MLD-MIC/05/943 Notification Date 02/23/2005 CONVERSION TO PB-FREE PRODUCTION MIC - MICROCONTROLLERS 1/4 PCN MLD-MIC/05/943 - Notification Date 02/23/2005 Table 1. Change Identification Product Identification Product Family/Commercial Product


    Original     		PDF MLD-MIC/05/943 MLD-MIC/05/943 STMicroelectronics smd marking code smd marking code stmicroelectronics BGA bga 10x13 BGA 15X15 BGA 23X23 HEPTAWATT SMD Marking STMicroelectronics tqfp INFINEON package tqfp PART MARKING PLCC Part Marking STMicroelectronics Date Code Marking STMicroelectronics PACKAGE DPAK

    bt 1696

    Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor
    Text: Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove the heat generated by the device. Device feature sizes are


    Original     		PDF

    TMS 3766

    Abstract: transistors 1UW AN1521 ao21 mx618 MX61H AOI21 H4EP012 H4EP044 H4EP171
    Text: Order this Data Sheet by H4EP/D MOTOROLA bu SEMICONDUCTOR TECHNICAL DATA H4EPlus SERIES Advanced Information H4EPlus SERIES CMOS ARRAYS The H4EPlus Series arrays offer a fully featured 3.3V, 5V and mixed voltage capable family combined with an increased core density providing over 50% more


    Original     		PDF

    14.4 v drill battery charger

    Abstract: circuit diagram for 14.4 v drill battery charger BANIAS SI4925 quanta quanta computer DIODE D27 capacitor 100u 63V TSOP32 8 X 14 FOOTPRINT 12v 60w audio amplifier circuit diagram with bios
    Text: 1 2 3 4 5 6 7 8 OA8 BLOCK DIAGRAM BANIAS / Montara-GME / ICH4-M DOTHAN A CPU BANIAS /DOTHAN CPU THERMAL SENSOR MAX6648MUA PAGE 4 478 Pins CPU VRM micro FC-BGA PAGE 4, 5 B PAGE 11 LCD Panel PAGE 10 SYSTEM POWER PAGE 29 PAGE 31, 32 CLOCK GEN (Dothan / Montara-GM+ / ICH4-M)


    Original     		PDF MAX6648MUA CY28346 ICS950810 4X100MHZ 266MHz 2N7002E SN74CBTD3306 SI3456DV DTC144EUA 14.4 v drill battery charger circuit diagram for 14.4 v drill battery charger BANIAS SI4925 quanta quanta computer DIODE D27 capacitor 100u 63V TSOP32 8 X 14 FOOTPRINT 12v 60w audio amplifier circuit diagram with bios

    IS43LR32640

    Abstract: is61wv5128 Product Selector Guide is42s86400 IS46R16160B IS25LD010 IS25LD025 IS25LQ IS62WV5128DALL BGA 168
    Text: To our valued customers, At ISSI we design, develop and market high performance integrated circuits for the following key markets: i automotive, (ii) communications, (iii) digital consumer, and (iv) industrial/medical/military. These key markets all require high quality and reliability, extended temperature ranges, and long-term support. Our primary products are high speed and


    Original     		PDF i1-44-42218428 IS43LR32640 is61wv5128 Product Selector Guide is42s86400 IS46R16160B IS25LD010 IS25LD025 IS25LQ IS62WV5128DALL BGA 168

    ic 6116 datasheet from texas instruments

    Abstract: intel date code marking 28f160 SMT pitch roadmap intel 6116 uBGA device MARKing intel intel 04195 intel 28f160 SMT roadmap 28f800 56 pin csp process flow diagram
    Text: D Comprehensive User’s Guide for µBGA* Packages 1998 NOTE: For the most current µBGA* package related information, please refer to Intel's Website at http://www.intel.com/design/flcomp/packdata Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


    Original     		PDF

    W988D6F

    Abstract: winbond 05 solder ball material W988D2F
    Text: W988D6FB / W988D2FB 256Mb Mobile LPSDR TABLE OF CONTENTS 1. GENERAL DESCRIPTION . 4 2. FEATURES . 4


    Original     		PDF W988D6FB W988D2FB 256Mb A01-003 W988D6F winbond 05 solder ball material W988D2F

    A01-002

    Abstract: by1 SMD winbond mobile dram A01002 W987D6HBGX
    Text: W987D6HB / W987D2HB 128Mb Mobile LPSDR TABLE OF CONTENTS 1. GENERAL DESCRIPTION . 4 2. FEATURES . 4


    Original     		PDF W987D6HB W987D2HB 128Mb A01-002 A01-002 by1 SMD winbond mobile dram A01002 W987D6HBGX

    Untitled

    Abstract: No abstract text available
    Text: W987D6HB / W987D2HB 128Mb Mobile LPSDR 1. GENERAL DESCRIPTION The Winbond 128Mb Low Power SDRAM is a low power synchronous memory containing 134,217,728 memory cells fabricated with Winbond high performance process technology. It is designed to consume less power than the ordinary SDRAM with low power features essential


    Original     		PDF W987D6HB W987D2HB 128Mb 166MHz. A01-003

    Untitled

    Abstract: No abstract text available
    Text: W987D6HB / W987D2HB 128Mb Mobile LPSDR 1. GENERAL DESCRIPTION The Winbond 128Mb Low Power SDRAM is a low power synchronous memory containing 134,217,728 memory cells fabricated with Winbond high performance process technology. It is designed to consume less power than the ordinary SDRAM with low power features essential


    Original     		PDF W987D6HB W987D2HB 128Mb 166MHz. A01-004

    W989

    Abstract: W989D2CB W989D6CB
    Text: W989D6CB / W989D2CB 512Mb Mobile LPSDR TABLE OF CONTENTS 1. GENERAL DESCRIPTION . 3 2. FEATURES . 3


    Original     		PDF W989D6CB W989D2CB 512Mb A01-004 W989 W989D2CB

    NP352

    Abstract: IC280-484-206 NP364 NP378 NP440 NP404 IC409 IC280-960-276 NP367 IC398
    Text: \ - f ^ ' \ 0.4mmPitch P ro d u c t Line-up P K G S iz e m m G r id O p en T o p T y p e 4 5 6 7 8 8,9 10,11 12,13,14 15,16 17,18,19 BGA N P437 series ▼ Si/Features ? □ y ? ? h t.3 S R R T f E « H j R - j u m o y * ? t 'f e g ^ q r t g U -sh a p e c o n ta c t m in im iz e s c o n ta c t m a r k o n so ld e r b a ll.


    OCR Scan     		PDF NP437 NP437-484-001 22X22 IC398 NP352 IC280-484-206 NP364 NP378 NP440 NP404 IC409 IC280-960-276 NP367