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    SF-BGA169C-B-01

    Abstract: No abstract text available
    Text: D Ø 0.40mm [0.0156"] Tooling Hole SF-BGA169C-B-01 C 18.29mm [0.720"] See BGA pattern code to the right for actual pattern layout Y 1.52mm [0.060"] X Top View (reference only) 18.29mm [0.720"] 1.52mm [0.060"] 0.36mm dia. [0.014"] 2 3.81mm[0.150"] 6.22mm[0.245"]


    Original     		PDF SF-BGA169C-B-01 FR4/G10 P-T200A P-T105A SF-BGA169C-B-01

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X