MO-048
Abstract: No abstract text available
Text: Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach
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Original
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MO-048
063W/cm
TH17023
175x195
MO-048
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PDF
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MO-048
Abstract: MULTIWATT die TH17023
Text: Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach
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Original
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MO-048
063W/cm
TH17023
175x195
MO-048
MULTIWATT die
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PDF
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MO-048
Abstract: MULTIWATT die CMC 15 EPOXY RESIN
Text: Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach
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Original
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MO-048
063W/cm
TH17023
175x195
MO-048
MULTIWATT die
CMC 15
EPOXY RESIN
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PDF
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Untitled
Abstract: No abstract text available
Text: Thermal Data CLIPWATT Family 8,11,15 leads 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin
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Original
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063W/cm
120x130
175x195
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PDF
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Untitled
Abstract: No abstract text available
Text: Thermal Data CLIPWATT Family 8,11,15 leads 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin
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Original
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063W/cm
120x130
175x195
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PDF
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Untitled
Abstract: No abstract text available
Text: Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C
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Original
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063W/cm
112x130
100x100
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PDF
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Untitled
Abstract: No abstract text available
Text: Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C
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Original
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063W/cm
112x130
100x100
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C
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Original
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063W/cm
112x130
100x100
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PDF
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SOIC-16
Abstract: PLCC-20 SIP 9 SOIC-8 lr 014
Text: PACKAGE DESIGNATORS A DIP 14 to 40 pins B (Semi-Tab DIP) 8 to 24 pins Dwg. OA-004-18 Dwg. OA-004-17 K (SIP) 4 pins KA (SIP) 5 pins LL, LR, or LT (SOT) Dwg. OA-014-64 L (SOIC) 8, 14, or 16 leads Dwg. OA-008-3 LB (Semi-Tab SOIC) 16 to 24 leads LW (Wide-Body SOIC) 16 to 28 leads
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Original
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OA-004-18
OA-004-17
OA-014-64
OA-008-3
OA-005-14
OA-005-21
OA-015-3
OA-007-44
OA-013-4
OA-005-17
SOIC-16
PLCC-20
SIP 9
SOIC-8
lr 014
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PDF
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sot38
Abstract: No abstract text available
Text: Philips Semiconductors Package outlines IDF16: plastic dual in-line package; 16 leads September 1994 SOT38-8 1
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Original
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IDF16:
OT38-8
sot38
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PDF
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A 708 transistor
Abstract: Semiconwell
Text: SEMICONWELL SMALL OUTLINE TRANSISTOR PACKAGE SC 70-8 Integrated Passive Networks PACKAGE OUTLINE SHORT PACKAGE DESCRIPTION SMALL OUTLINE TRANSISTOR SOT package is a rectangular surface mount transistor or diode with three or more gull wings leads. The leads are
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Original
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OT143,
OT223
A 708 transistor
Semiconwell
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PDF
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sot-96-1
Abstract: SOT96
Text: Philips Semiconductors Package outlines SO8: plastic small outline package; 8 leads; body width 3.9mm 1997 May 22 5 SOT96-1
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Original
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OT96-1
sot-96-1
SOT96
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PDF
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Untitled
Abstract: No abstract text available
Text: Philips Semiconductors Package outlines DIP8: plastic dual in-line package; 8 leads 300 mil 1995 Feb 04 3080 SOT97-1
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Original
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OT97-1
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PDF
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SOT96- 1
Abstract: No abstract text available
Text: Philips Semiconductors Package outlines SO8: plastic small outline package; 8 leads; body width 3.9mm 1995 Feb 04 3095 SOT96-1
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Original
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OT96-1
SOT96- 1
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PDF
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|
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SOT97-1
Abstract: SOT-97
Text: Philips Semiconductors Package outlines DIP8: plastic dual in-line package; 8 leads 300 mil 1995 Feb 04 5-4 SOT97-1
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Original
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OT97-1
SOT97-1
SOT-97
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PDF
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SDIP42
Abstract: No abstract text available
Text: Philips Semiconductors Package outlines SDIP42: plastic shrink dual in-line package; 42 leads 600 mil 1995 Feb 04 5-8 SOT270-1
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Original
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SDIP42:
OT270-1
SDIP42
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PDF
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sot96
Abstract: No abstract text available
Text: Philips Semiconductors Package outlines SO8: plastic small outline package; 8 leads straight ; body width 3.9 mm 1997 May 22 6 SOT96-2
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Original
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OT96-2
sot96
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PDF
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SEI resistor
Abstract: No abstract text available
Text: Thick Film Resistor Networks Single Inline Package SEI Types LC & HC • • • • • Low Profile Standard — High Profile Available 6, 8 or 10 Pins Standard — 4, 5, 7, 9, 11 or 12 Pin Available Copper Leads Standard — Steel Leads Optional Black Body Color
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Original
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100ppm/
50ppm
SEI resistor
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PDF
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X10-4
Abstract: RE903
Text: MSOP-8 8-leads molded small outline package RE903 - Epoxydglashartgewebe FR4 1,50 mm, zweiseitig 35 µm CU (durchkontaktiert) - Löt- und Komponentenseite mit einer Oberfläche aus chem. AU und <br> Lötstoppmaske - Lochdurchmesser 1,00 mm - Adaptionsplatine für 1 x MSOP-8
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Original
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RE903
X10-4
RE903
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PDF
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Untitled
Abstract: No abstract text available
Text: Package Outline Drawings Hermetic and Molded DIPs HD420 & PD520 Series HERMETIC NO LEADS A MOLDED B C D E F G H NO LEADS A c B D E F G H 8 LEADS 0.400 0.160 0.018 0.100 0.300 0.170 0.012 10° 8 LE A D 0.400 0.160 0.018 0.100 0.300 0.125 0.012 10° 14 LE A D S
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OCR Scan
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HD420
PD520
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PDF
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PHILIPS OQ 0501
Abstract: philips OQ 051 oq 0066 oq 0051 PHILIPS 036 M/HD 780 footprint jedec MS-026 TQFP mo-001 packages philips
Text: Philips Semiconductors Package information Package outlines INDEX DESCRIPTION NAME VERSION PAGE DIP dual in-line package plastic dual in-line package; 8 leads (300 mil) plastic dual in-line package; 14 leads (300 mil) SOT97-1 1327 SOT27-1 1328 DIP16 plastic dual in-line package; 16 leads (300 mil); long body
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OCR Scan
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DIP14
DIP16
DIP18
DIP20
DIP24
DIP28
DIP40
LQFP32
PHILIPS OQ 0501
philips OQ 051
oq 0066
oq 0051
PHILIPS 036
M/HD 780
footprint jedec MS-026 TQFP
mo-001 packages philips
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PDF
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sot267
Abstract: No abstract text available
Text: Philips Semiconductors Package information Package outlines INDEX VERSION DESCRIPTION NAME PAGE DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 ; SOT97 593 DIP16 plastic dual in-line package; 16 leads (300 mil); long body
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OCR Scan
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DIP16
DIP20
DIP24
DIP28
DIP40
OT97-1
OT38-1
OT146-1
OT101-1;
OT101B
sot267
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PDF
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lm 3090
Abstract: HLMP-3200 XC-30211 L-285 LM 3466 HLMP-3201 HLMP-3350 HLMP-3351 HLMP-3365 HLMP-3366
Text: Package Style Part Number • • T1J4 Low Profile .020 Sq. Leads A M ‘ ii i r Du ii u D = .1 8 5 4,70 L = .230 (5,84) T1 'A Low Profile .020 Sq. Leads r \ id Wu u Plastic Lens Type r \ fj bT 11U H D = . 190 (4,83) L = .28 5 (7,24) T1 % Flangless Low .020 Sq. Leads
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OCR Scan
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NSL5920
NSL5921
HLMP-3200
HLMP-3201
HLMP-3350
HLMP-3351
HLMP-3365
HLMP-3366
HLMP-3450
HLMP-3451
lm 3090
XC-30211
L-285
LM 3466
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PDF
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Untitled
Abstract: No abstract text available
Text: PCI D ata Sheet Fast Or b - 50 Amp Avalanche AUTOMOTIVE RECTIFIERS Semiconductor Mechanical Dimensions Options - A dd Suffix to Part #: FR5028 F R 50 2 8 L = 2 Leads For 1 Lead Small Pkg: FR 5028C = Lead On Cathode FR 50 2 8 A = Lead On Anode Leads 1.00 typ. .05Dla.
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OCR Scan
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FR5028
5028C
05Dla.
ReC10
21X21X5
48X22X36cm
21X9X8
51X25X30cm
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PDF
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