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    112X130 Search Results

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    112X130 Price and Stock

    CR Seals 112X130X12 CRS11 R

    Single Lip Oil Seal, I.D. 112 mm, O.D. 130 mm, Thickness 12 mm | CR Seals (SKF) 112X130X12 CRS11 R
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS 112X130X12 CRS11 R Bulk 4 Weeks 1
    • 1 $363.65
    • 10 $363.65
    • 100 $363.65
    • 1000 $363.65
    • 10000 $363.65
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    SMC Corporation of America NCA1B150-0112-X130US

    CYLINDER, TIE ROD, NCA1 SERIES | SMC Corporation NCA1B150-0112-X130US
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS NCA1B150-0112-X130US Bulk 5 Weeks 1
    • 1 $115.6
    • 10 $115.6
    • 100 $115.6
    • 1000 $115.6
    • 10000 $115.6
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    Dichtomatik 112X130X8TB (ALTERNATE: 75002822)

    Oil Seal, 112mm ID, 130mm OD, 8mm Width | Dichtomatik 112X130X8TB
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS 112X130X8TB (ALTERNATE: 75002822) Bulk 3 Weeks 1
    • 1 $21.85
    • 10 $21.85
    • 100 $21.85
    • 1000 $21.85
    • 10000 $21.85
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    Dichtomatik 112X130X8TB-BX (ALTERNATE: 75019901)

    Oil Seal, 112mm ID, 130mm OD, 8mm Width, Boxed | Dichtomatik 112X130X8TB-BX
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS 112X130X8TB-BX (ALTERNATE: 75019901) Bulk 3 Weeks 1
    • 1 $21.85
    • 10 $21.85
    • 100 $21.85
    • 1000 $21.85
    • 10000 $21.85
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    112X130 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER SIP Family 9,10 leads 9 leads 10 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm


    Original
    063W/cm 149x135 120x130 112x130 100x100 PDF

    Untitled

    Abstract: No abstract text available
    Text:  Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original
    063W/cm 112x130 100x100 PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER SIP Family 9,10 leads 9 leads 10 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm


    Original
    063W/cm 149x135 120x130 112x130 100x100 PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original
    063W/cm 112x130 100x100 PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original
    063W/cm 112x130 100x100 PDF